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| Multi-layer PCB |
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Multi-layer PCBs are advanced electronic components that consist of multiple layers of conductive pathways and insulating materials. These layers are bonded together to create a compact and efficient circuit design, allowing for increased functionality in a limited space. Multi-layer PCBs are essential in modern electronics, as they enable complex circuit designs that support high-density interconnections. One of the key advantages of multi-layer PCBs is their ability to reduce electromagnetic interference (EMI) and improve signal integrity. Additionally, multi-layer PCBs facilitate better thermal management, which is crucial for high-power applications. These boards are widely used in various industries, including telecommunications, aerospace, automotive, and medical devices. Their versatility and reliability make them a preferred choice for applications requiring high performance and durability. |
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| 6.6 Mil RO4350B and 10 Mil RO4350B Core Options--Versatile 4-Layer Rogers High-Frequency PCBs for Radar Systems |
When it comes to high-frequency applications, every detail matters. Our multilayer PCBs are crafted entirely from high-performance materials, including RO4350B substrates and prepreg adhesives, ensuring superior signal integrity and reliability. For instance, a 4-layer RO4350B PCB is built using 2 cores of RO4350B substrates, offering exceptional electrical performance and thermal stability. |
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6.6 Mil RO4350B PCB Thickness |
4 layers Rogers RO4350B PCB |
Rogers RO4350B Dielectric Constant |
Rogers RO4350B Material |
10 Mil RO4350B Laminate |
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| Precision Rogers 60 Mil and 10 Mil RO4350B 4 Layer RF Circuit Board with Back Drill for Reliable UHF Coupler Applications |
| This high-performance 4-Layer RF PCB is built with a 60mil RO4350B core, a 10mil RO4350B core, and 4mil RO4450F prepreg, achieving a final thickness of 2.1mm. Featuring 35 μm (1oz) copper on each layer and immersion gold-plated pads, it ensures excellent conductivity and durability. The inclusion of back-drilled vias from the 10mil core reduces noise interference, enhances signal integrity, and simplifies fabrication by eliminating the need for buried or blind vias. |
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RO4350B High Frequency PCB |
Rogers RO4350B RF Circuit Board |
60 Mil RO4350B PCB Thickness |
Rogers RO4350B Datasheet |
4 - layer RO4350B Laminate |
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| 0.813mm-4-Layer-Rogers-PCB-with-32mil-RO4003C-and-12mil-RO4450F-Cores-for-Premium-Ultrahigh-Frequency-Coupler-Solutions |
| We’re highlighting a 4-layer high-frequency PCB designed for ultrahigh-frequency coupler applications. This PCB is constructed using 2 cores of 0.813mm (32mil) RO4003C PCB and 1 sheet of RO4450F prepreg, ensuring exceptional performance for high-frequency needs. Multilayer Rogers high-frequency PCBs are typically constructed entirely from high-frequency materials, including specialized prepreg adhesives. As widely recognized, the RO4003C family offers six core thickness options, ranging from 8mil (0.203mm) to 60mil (1.524mm), providing flexibility for various design requirements. |
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Rogers RO4003C datasheet |
0.813mm (32mil) RO4003C Thickness |
Rogers RO4003C Price |
Rogers RO4003C Substrate |
Rogers RO4003C PCB |
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| 6-Layer-20mil-High-Frequency-PCB-with-3-Cores-Rogers-RO4003C-and-4mil-RO4450F-for-Advanced-Radar-Altimeter-Solutions |
| 6 Layer Rogers RO4003C PCB is constructed using 3 cores of 20mil RO4003C combined with bondply RO4450F, ensuring exceptional performance and reliability. RO4003C laminate offers a stable dielectric constant across a wide frequency range, making it ideal for broadband applications, while its minimized signal loss meets the demands of high-frequency communication technology. Produced in our UL, ISO14001, and IATF16949 certified factory, this material ensures top-quality standards and reliability for your PCB needs. |
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RO 4003C Online Purchase |
Rogers RO4003C Dielectric Constant |
Rogers RO4003C Loss Tangent |
20Mil RO4003C Substrate |
Rogers RO4003C datasheet |
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| 10mil-10-Layer-High-Frequency-PCB-with-5-Cores-Rogers-RO4350B-and-4mil-RO4450F-for-Premium-Broadband-Wireless-Applications |
A 10-layer RF PCB is built using 5 cores of Rogers material. To maintain a manageable final thickness, thinner cores are typically used, such as 6.6mil RO4350B, 10mil RO4350B, 13.3mil RO4350B, 8mil RO4003C, and 12mil RO4003C, among others. Designed for broadband wireless applications, this PCB has a total thickness of 2.0 mm and features immersion gold-plated pads. |
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10mil RO4350B PCB Thickness |
10 layers Rogers RO4350B PCB |
Rogers Multi-layer Board Designs |
Rogers RO4350B Material |
Rogers RO4350B Laminate |
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| 10mil-0.254mm-RF-Hybrid-High-Frequency-6-Layer-PCB-Top-Notch-Constructed-with-Rogers-RO4350B-and-FR-4-Featuring-Blind-Via |
| This PCB is designed for radar antenna applications, featuring a hybrid construction with RO4350B cores on both the top and bottom sides. Plated through-holes (PTH) ensure reliable interlayer connections across all layers. Based on the stack-up design, each dielectric layer exceeds 0.2mm in thickness, contributing to an overall PCB thickness of 1.9mm. The pads and holes are coated with immersion gold for enhanced durability and performance. |
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6-Layer Low Dissipation PCB |
10 mil Hybird Material PCB |
PCB for Modular Oscilloscope |
RO4350B and FR-4 Hybrid PCB |
0.254mm RF Hybrid Substrate |
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| 6-Layer-High-Frequency-Hybrid-PCB-20mil-0.508mm-Rogers-RO4350B-and-FR-4-with-Blind-Via-and-Green-Solder-Mask |
| The first board is designed for satellite receiver applications. It features a single RO4350B core on the top layer, as illustrated in the stack-up below. The design is relatively complex, incorporating three different types of blind vias. The board has a total thickness of 1.71mm, with white silkscreen printed over green solder mask on both sides. Pads and tracks are finished with immersion gold plating. Each unit is supplied as a single board, manufactured in compliance with IPC 6012 Class 2 standards using provided Gerber files. |
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RO4350B Dielectric Constant |
Rogers 6-layer Hybrid PCB |
Immersion Gold Plating |
20mil RO4350B Core and FR-4 Material |
Hybrid Substrate for RF Switches |
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| 12mil-0.305mm-6-Layer-Hybrid-High-Frequency-Multilayer-PCB-RO4003C-and-FR-4-High-Performance-Reliable-Design |
| The 12mil RO4003C core and FR-4 hybrid multilayer PCB features the 12mil core positioned on the top layer, where it primarily functions as the signal layer. The core's fixed thickness is critical, as it directly impacts the electrical length of the RF traces on the circuit board. The remaining layers are composed of FR-4 epoxy glass material, with thicknesses comparable to that of the RO4003C core. |
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High Frequency Multilayer PCB |
Multilayer RO4003C FR-4 PCB |
Hybrid Multilayer PCB Board |
Hybrid Printed Circuit Board |
Roger RO4003C FR-4 PCB |
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| Innovative-10-Layer-Hybrid-PCB-Rogers-RO4350B-and-6.6mil-FR4-with-Red-Solder-Mask-for-RF-and-WiFi-Performance |
| The design of 10 Layers hybrid RO4350B FR4 material board is straightforward, featuring only through-hole connections that link each layer. With a finished thickness of 1.7mm, it incorporates immersion gold-plated pads and holes, complemented by a vibrant red solder mask surface. Manufactured in compliance with IPC 6012 Class 2 standards, the board is produced using provided Gerber data. |
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Hybrid PCB Rogers RO4350B |
Hybrid PCB FR-4 Thickness |
Hybrid 10 Layers Multiplayer Circuit Board |
Hybrid RO4350B FR4 Material |
Multiplayer Mixed Circuit Board |
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| 20mil-Rogers-RO4003C-5-Layer-High-Frequency-PCB, Immersion-Gold-Perfect-for-RF, Microwave, and-High-Speed-Circuits |
| The stack-up configuration of multilayer RO4003C PCBs can be customized in numerous ways to meet specific requirements, such as controlled impedance, signal transmission, and other application needs. Within the RO4003C family, designers have a wide range of core thickness options to choose from, including 8mil, 12mil, 16mil, 20mil, 32mil, and 60mil, among others. |
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5 Layer RO4003C PCB |
Mutilayer RO4003C PCB |
RO4003C Multilayer PCB |
Rogers Multilayer PCB |
Rogers RO4003C PCB Board |
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