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0.813mm-4-Layer-Rogers-PCB-with-32mil-RO4003C-and-12mil-RO4450F-Cores-for-Premium-Ultrahigh-Frequency-Coupler-Solutions  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

Hello everyone,

Good day!

Today, we’re highlighting a 4-layer high-frequency PCB designed for ultrahigh-frequency coupler applications. This PCB is constructed using 2 cores of 0.813mm (32mil) RO4003C and 1 sheet of RO4450F prepreg, ensuring exceptional performance for high-frequency needs. Below, you’ll find the detailed stack-up for reference.

 
   
 
   
Multilayer Rogers high-frequency PCBs are typically constructed entirely from high-frequency materials, including specialized prepreg adhesives. As widely recognized, the RO4003C family offers six core thickness options, ranging from 8mil (0.203mm) to 60mil (1.524mm), providing flexibility for various design requirements.  
   

RO4003C:

 

8mil

0.203mm

12mil

0.305mm

16mil

0.406mm

20mil

0.508mm

32mil

0.813mm

60mil

1.524mm

 

It’s fascinating to see how a 4-layer stack-up can be designed in numerous ways to meet diverse requirements.

 
   
Following is the basic specifications.  

Base material: RO4003C 32mil + RO4450F 12mil PP

Layer count: 4 layers

Type: Castellation holes (half holes) on edge

Format: 113mm x 80mm = 1 type = 4 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 35 μm

Solder mask / Legend: no / no

Final PCB height: 2.1 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

 
   
Here are the key features and benefits you can enjoy:  

1. Superior High-Frequency Performance: Achieved through low dielectric tolerance and minimal signal loss.

2. Advanced AOI Inspection: Ensures top-quality and reliability.

3. End-to-End Solutions: From prototypes to mass production, we cater to all your PCB needs.

4. High Production Capacity: 30,000 square meters per month.

5. Diverse Product Range: Capable of producing 8,000 types of PCBs monthly.

6. Proven Expertise: Over 16 years of experience in PCB manufacturing.

 
   
Typical applications:  
GPS antenna, WiFi amplifier, Power amplifier, RF transceiver, TV antenna, Radar data acquisition converter, Spread spectrum, Attenuator  
   
Appendix: RO4003C Datasheet  

 

RO4003C Typical Value

Property

RO4003C

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.38±0.05

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.55

Z

 

8 to 40 GHz

Differential Phase Length Method

Dissipation Factortan,δ

0.0027
0.0021

Z

 

10 GHz/23
2.5 GHz/23

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+40

Z

ppm/

-50to 150

IPC-TM-650 2.5.5.5

Volume Resistivity

1.7 x 1010

 

MΩ.cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

4.2 x 109

 

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

Z

Kv/mm(v/mil)

0.51mm(0.020")

IPC-TM-650 2.5.6.2

Tensile Modulus

19,650(2,850)
19,450(2,821)

X
Y

MPa(ksi)

RT

ASTM D 638

Tensile Strength

139(20.2)
100(14.5)

X
Y

MPa(ksi)

RT

ASTM D 638

Flexural Strength

276
(40)

 

MPa
(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.3

X,Y

mm/m
(mil/inch)

after etch+E2/150

IPC-TM-650 2.4.39A

Coefficient of Thermal Expansion

11
14
46

X
Y
Z

ppm/

-55to288

IPC-TM-650 2.4.41

Tg

>280

 

 TMA

A

IPC-TM-650 2.4.24.3

Td

425

 

 TGA

 

ASTM D 3850

Thermal Conductivity

0.71

 

W/M/oK

80

ASTM C518

Moisture Absorption

0.06

 

%

48hrs immersion 0.060"
sample Temperature 50

ASTM D 570

Density

1.79

 

gm/cm3

23

ASTM D 792

Copper Peel Stength

1.05
(6.0)

 

N/mm
(pli)

after solder float 1 oz.
EDC Foil

IPC-TM-650 2.4.8

Flammability

N/A

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 

 

 
Thank you for reading! We’re here to assist with all your PCB needs—feel free to reach out for any inquiries or support.
   
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