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| Rogers RO4350B Based 8-Layer HDI RF PCB 1.6mm ENEPIG Board for Millimeter Wave Radar and 5G |
| Rogers RO4350B PCB is a high-frequency laminate combining woven glass reinforcement with hydrocarbon/ceramic technology, delivering PTFE-like electrical performance while maintaining epoxy/glass process compatibility. This innovative material provides precise dielectric constant (Dk) control and ultra-low signal loss at a significantly lower cost than traditional microwave laminates. |
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| RO4350B datasheet pdf |
RO4350B dielectric constant |
RO4350B thickness |
RO4350B PCB material |
RO4350B density |
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| 6-Layer 370HR PCB 1.03mm ENIG High Temperature FR-4 with 180°C Tg for Demanding Multilayer Applications |
| Isola 370HR PCB represents a premium-grade FR-4 solution engineered for multilayer PCB designs requiring exceptional thermal reliability. This high-performance material system features a 180°C glass transition temperature (Tg), developed with specialized multifunctional epoxy resin and E-glass reinforcement to deliver superior thermal characteristics while maintaining standard FR-4 processing compatibility. |
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| 370HR dk |
370HR datasheet |
370HR PCB material |
370HR FR-4 PCB |
370HR prepreg |
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| Wangling F4BM220 2-Layer 0.8mm Thick Immersion Gold PCB with Enhanced Dielectric Stability for RF Applications |
| Wangling F4BM220 laminates are crafted through a meticulous process of scientific formulation and stringent pressing, combining fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. This advanced manufacturing approach yields significantly improved electrical performance over its predecessor, F4B220 PCB. With reduced dielectric loss, elevated insulation resistance, and enhanced stability, F4BM220 serves as a highly capable alternative to comparable foreign - made products. |
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| F4BM220 High Frequency PCB |
2-Layer F4BM220 Substrate |
Wangling F4BM220 laminates |
F4BM220 datasheet |
F4BM220 PCB |
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| 10mil RO4350B and S1000-2M 1.5mm Thick 6-Layer Hybrid PCB for Thermal Shock Resistant Applications From Rogers |
| Rogers RO4350B is a high-performance laminate combining woven glass reinforcement with hydrocarbon/ceramic technology, delivering PTFE-like electrical properties with the processing ease of conventional epoxy/glass materials. This innovative RO4350B material offers precise dielectric constant control and ultra-low signal loss while maintaining compatibility with standard PCB fabrication techniques—eliminating the specialized handling required for traditional microwave laminates. |
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| RO4350B and S1000-2M PCB |
RO4350B Hybrid PCB |
RO4350B Datasheet |
RO4350B Material |
Rogers RO4350B PCB |
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| Taconic RF-10 Low Loss PCB Substrate 2-Layer 60mil with Immersion Tin for Optimal High Speed Signal Integrity |
| RF-10 Copper Clad Laminates combine ceramic-filled PTFE and woven fiberglass to deliver superior high-frequency performance. With a high dielectric constant and ultra-low dissipation factor, Taconic RF-10 PCB ensures minimal signal loss in demanding RF applications. The thin woven fiberglass reinforcement enhances rigidity for easier handling while maintaining excellent dimensional stability in multilayer designs. |
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RF-10 PCB Datasheet |
RF-10 High Frequency PCB |
Rogers RF-10 PCB Material |
RF-10 RF PCB |
RF-10 Low Loss PCB |
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| Rogers RO3010 2-Layer PCB 20mil Ceramic PTFE Composite with Immersion Silver for Circuit Miniaturization |
| Rogers RO3010 materials stand as top - tier ceramic - filled PTFE composites, delivering a robustly high dielectric constant alongside outstanding stability. Engineered for the rigors of modern electronics, RO3010 materials combine a competitive price point with remarkable mechanical and electrical steadfastness. This inherent stability streamlines the design process for broadband components, enabling seamless integration across an expansive spectrum of frequencies and applications. From high - end telecommunications to cutting - edge aerospace systems, RO3010 PCBs prove their mettle. |
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| RO3010 Immersion Silver |
Double-Layer RO3010 PCB |
Rogers RO3010 PCB |
RO3010 High Frequency PCB |
RO3010 PTFE PCB |
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| Rogers RO4003C PCB 2 Layer 60mil High Tg Microwave Laminate with Low Cost for Harsh Environments |
| Rogers RO4003C PCB is a high-performance laminate combining woven glass-reinforced hydrocarbon/ceramic for PTFE-like electrical properties with the ease of epoxy/glass processing. Available in 1080 and 1674 glass styles, it ensures consistent dielectric constant (Dk) control and low loss at a fraction of the cost of traditional microwave materials. Unlike PTFE-based alternatives, RO4003C PCB requires no special through-hole treatments, streamlining production. |
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Rogers RO4003C PCB |
60mil RO4003C Laminate |
2-Layer RO4003C PCB |
RO4003C Price |
RO4003C Datasheet |
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| Rogers RO4350B RF PCB 2-Layer 6.6mil ENIG Reliable Plated Through Holes for Thermal Shock Applications |
| Rogers RO4350B PCB represents an advanced ceramic-filled hydrocarbon composite that delivers near-PTFE electrical characteristics while maintaining epoxy/glass processing compatibility. This RO4350B material offers exceptional dielectric constant consistency and ultra-low loss characteristics, providing RF designers with reliable high-frequency performance at significantly reduced costs compared to traditional microwave substrates. |
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| RO4350B datasheet pdf |
Rogers RO4350B dielectric constant |
6.6mil RO4350B thickness |
Rogers RO4350B PCB material |
RO4350B density |
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| RT/duroid 6035HTC PCB 2-Layer 60mil Immersion Gold Superior Thermal Management for Demanding Microwave Applications |
| Engineered for excellence in high-power applications, Rogers RT/duroid 6035HTC ceramic-filled PTFE composite delivers unmatched thermal performance with 2.4x greater conductivity than standard RT/duroid 6000 series materials. This cutting-edge laminate combines superior thermal management (0.84 W/m/K) with Rogers' proprietary filler technology that dramatically improves drillability while reducing manufacturing costs - a game-changing advantage over traditional alumina-filled alternatives. |
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| RT/duroid 6035HTC PCB |
RT/duroid 6035HTC Price |
RT/duroid 6035 PCB material |
2-Layer 6035HTC PCB |
RT/duroid 6035 High-Frequency PCB |
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| 2-Layer Rogers TC350 PCB 60mil with 2OZ ENIG High Thermal Conductivity board for Power Amplifier and Antenna Systems |
| Rogers TC350 laminates are advanced PCB substrates combining PTFE resin, thermally conductive ceramic fillers, and woven glass reinforcement, delivering unmatched performance for high-power RF systems. Designed for engineers prioritizing signal integrity and thermal management, TC350 PCB materials achieve ultra-low insertion loss paired with 1.3 W/m·K thermal conductivity—critical for reducing hotspot temperatures in 5G base stations, radar arrays, and satellite communications equipment. |
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| 2-Layer TC350 PCB |
60mil TC350 PCB |
TC350 Low Loss PCB |
5G Antenna Board |
High Thermal Conductivity Substrate |
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| Rogers TC600 PCB 2-Layer 60mil Ultra Low Insertion Loss and Size Reduction for High Power RF Amplifiers |
Rogers TC600 laminates revolutionize high-power RF designs with their PTFE-ceramic-glass hybrid composition, delivering 2.5 W/m·K thermal conductivity—the industry’s highest for PCB substrates. Engineered to slash dielectric and insertion losses by 30%, these 2-layer 60mil TC600 PCBs dramatically boost amplifier gain and antenna efficiency in 5G base stations, radar arrays, and satellite payloads. |
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| Rogers TC600 PCB |
2-Layer RF Board |
TC600 Immersion Tin Finish |
5G Power Amplifier PCB |
TC600 Radar Antenna Circuit |
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| TFA300 High Frequency PCB 2-Layer 10mil PTFE Ceramic PCB Aerospace Grade RF Substrate with Dk3.0 |
| The TFA series redefines RF/microwave circuit performance through its glass-free PTFE-ceramic composite structure, engineered to eliminate electromagnetic interference from traditional fiberglass substrates. Utilizing nano-ceramic particle infusion technology, TFA laminates deliver isotropic dielectric properties (Dk tolerance ±0.05) across X/Y/Z axes, achieving 0.0018 dielectric loss at 40GHz for 5G mmWave and satellite communication systems. |
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| TFA Series PCB |
TFA300 PTFE-Ceramic Substrate |
TFA300 RF Material |
TFA300 Low CTE PCB |
5G mm Wave Circuit Board |
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| TMM10i PCB 25mil 2-Layer Pure Gold RF Board Optimized for 5G Microstrip Antenna From Rogers |
| Rogers TMM10i ceramic-thermoset composite laminates deliver isotropic dielectric stability (Dk 9.8±0.045) across 1-40GHz frequencies, engineered for mission-critical stripline/microstrip designs in radar and satellite communications. TMM10i PCB hybrid material combines PTFE-grade electrical performance with FR-4-like processability, achieving 100% plated through-hole (PTH) reliability under MIL-STD-202G thermal shock testing (-55°C to +125°C). |
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| Rogers TMM10i PCB |
TMM10i Isotropic Microwave Material |
Rogers TMM Series |
TMM10i 5G Radar Substrate |
TMM10i Stripline Circuit Board |
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| TP980 7.62mm ENIG PCB 2-Layer Dk3-25 Adjustable Ceramic/PPO RF Substrate in Aerospace Telemetry Systems |
| The TP series PCB introduces a glass-free ceramic/PPO composite technology, revolutionizing RF design with adjustable dielectric constants (3.0-25) through precise ceramic-resin ratio control—40% broader Dk range than conventional PTFE substrates. Engineered for 28GHz mmWave and satellite payloads, TP series laminates maintain 0.0018 loss tangent at 10GHz, outperforming FR-4 by 65% in signal integrity. |
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| TP980 TP Series PCB |
Adjustable Dk Substrate |
TP980 Aerospace RF Laminate |
TP980 Low Loss Thermoplastic PCB |
2-Layer TP980 PCB |
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