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| 18-Layer-RO4350B-PCB-3.2mm-Thick-ENIG-Selective-Hard-Gold--Cost-Effective-RF/Microwave-Board-with-Excellent-Dimensional-Stability |
| Engineered for superior RF performance, Rogers RO4350B laminates combine proprietary ceramic-hydrocarbon technology with woven glass reinforcement to deliver PTFE-grade electrical characteristics while maintaining standard epoxy/glass processability. These innovative materials provide tight dielectric constant (Dk) control and ultra-low signal loss at a fraction of traditional microwave laminate costs, eliminating the need for specialized PTFE handling or through-hole treatments. |
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| RO4350B High Tg PCB 280°C |
RO4350B for RF/Microwave Application |
Rogers RO4350B with ENIG |
Rogers RO4350B PCB Material |
18-Layer RO4350B Laminate |
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| F4BM220-PCB-2-Layer-1.575mm-Precision-PTFE-Material-for-Low-Loss-and-PIM-Critical-Applications-From-Wangling |
Wangling's F4BM220 laminates represent a scientifically engineered PTFE composite solution, combining fiberglass cloth with polytetrafluoroethylene resin and film to deliver superior electrical performance over conventional F4B220 materials. These high-performance laminates feature reduced dielectric loss, enhanced insulation resistance, and improved stability - providing a cost-competitive alternative to imported equivalents. |
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| 1.575mm F4BM220 Substrate |
F4BM220 PCB Design |
F4BM220 High Frequency PCB |
Wangling F4BM220 Laminate |
F4BM220 PTFE Material |
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| F4BTMS430-2-Layer-PCB-Wangling-3.175mm-Aerospace-Grade-Ceramic-PTFE-Composite-with-Enhanced-Dk-Range-and-Stability |
| Wangling's F4BTMS series represents a significant technological advancement over previous F4BTM materials, combining precision-engineered nano-ceramic additives with ultra-fine glass fiber reinforcement in a PTFE matrix. This innovative formulation delivers exceptional dielectric stability across an expanded constant range while minimizing wave propagation interference - achieving reduced loss, enhanced dimensional stability, and improved isotropy for superior high-frequency performance. |
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2-Layer F4BTMS430 PCB |
F4BTMS430 High Frequency PCB |
F4BTMS430 Ceramic PTFE Laminate |
3.175mm F4BTMS430 Thickness |
F4BTMS430 Datasheet PDF |
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| F4BTMS1000-2-Layer-0.508mm-PCB--Wangling-Ultra-High-Thermal-Conductivity-Microwave-Substrate-for-Phase-Array-Antennas |
| The F4BTMS series represents a significant technological evolution from its F4BTM predecessor, featuring an optimized material system combining nano-ceramic additives with precision-engineered glass fiber reinforcement in a PTFE matrix. This innovative formulation delivers superior dielectric stability across an extended Dk range while minimizing wave propagation interference - achieving reduced loss, enhanced dimensional control, and improved thermal/mechanical isotropy for demanding RF applications. |
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F4BTMS1000 PCB Material |
0.508mm Thick F4BTMS1000Substrate |
F4BTMS Series PCB |
Wangling F4BTMS High Frequency PCB |
F4BTMS PCB Layout |
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| 10-layer-IT-180ATC-FR-4-HDI-PCB-1.6mm-Circuit-Boards-with-Green-Solder-Mask-and-Immersion-Gold-for-Lead-Free-Assembly |
| IT-180ATC is an advanced epoxy-based laminate engineered for demanding applications, featuring a high glass transition temperature (Tg 175°C by DSC) for superior thermal reliability. This multifunctional composite material delivers exceptional CAF resistance and withstands lead-free assembly processes up to 260°C, making it ideal for high-density interconnects and thermally challenging environments. |
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| IT-180ATC FR-4 HDI PCB |
IT-180ATC PCB Datasheet |
Excellent CAF resistance |
10-Layer IT-180ATC Laminate |
IT-180ATC FR-4 with High Tg |
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| RO4003C-and-S1000-2M-Hybrid-PCB-6-Layer-2.0mm- PTFE-Performance-with-Standard-FR4-Process-Compatibility-at-Epoxy-Cost |
| Rogers RO4003C laminates deliver superior RF performance through a proprietary ceramic-hydrocarbon/glass reinforcement system, matching PTFE/woven glass electrical properties while maintaining epoxy/glass manufacturability. These cost-effective microwave materials are available in 1080 and 1674 glass styles, providing tight Dk control and low loss without requiring special PTFE processing methods. |
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| RO4003C High Frequency PCB |
20mil RO4003C PCB |
Rogers RO4003C Laminate |
RO4003C S1000-2M Hybrid PCB |
RO4003C Loss Tangent Substrate |
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| RO3003-High-Frequency-PCB-Rogers-2-Layer-ENIG-Laminate-Engineered-for-5G, Radar-and-Advanced-Driver-Assistance-Systems |
| Rogers RO3003 High-Frequency Laminates deliver superior RF performance for demanding microwave applications. These ceramic-filled PTFE composites maintain exceptional dielectric constant (Dk) stability across temperature variations and frequency ranges—eliminating the Dk fluctuations common in standard PTFE materials. Engineered for reliability, RO3003 PCB is the material of choice for critical 77GHz automotive radar systems, next-gen ADAS technologies, and high-speed 5G mmWave infrastructure. |
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| Rogers RO3003 PCB |
Double Sided RO3003 Substrate |
RO3003 High Frequency Laminate |
RO3003 Datasheet |
RO3003 Online Purchase |
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| RO3006-2-Layer-25mil-ENIG-Circuit-Board-Advanced-Material-for-Stable-Dk-in-Commercial-Microwave-and-RF-Applications |
| Rogers RO3006 High-Frequency PCBs represent a premium ceramic-PTFE composite solution engineered for demanding RF and microwave applications. These advanced materials deliver unmatched electrical and mechanical stability, maintaining a consistent dielectric constant across wide temperature ranges. Unlike conventional PTFE glass materials that exhibit Dk variations near room temperature, RO3006 laminates provide exceptional stability - ensuring reliable performance in critical communication systems, radar applications, and high-frequency circuits. |
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2-Layer RO3006 PCB |
Rogers RO3006 RF PCB |
Rogers RO3006 for Sale |
RO3006 Dielectric Constant 6.15 |
RO3006 ENIG Circuit Board |
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| RO3035-PCB-2-Layer-5mil-PTFE-Based-Laminate-with-Immersion-Gold-for-Massive-MiMo-Applications-in-Multi-Layer-Designs |
| Rogers RO3035 laminates are ceramic-filled, PTFE-based high-frequency circuit materials designed for demanding RF and microwave applications. Part of the RO3000 series, these materials offer consistent mechanical properties across varying dielectric constants, allowing engineers to create reliable multi-layer board designs without compromising on warpage or structural integrity. |
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| RO3035 High Frequency PCB |
RO3035 Microwave PCB |
5MIl RO3035 Thinkness |
Rogers RO3035 Datasheet |
Rogers RO3000 Series PCBs |
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| Rogers-RO4360G2-2-Layer-8mil-Circuit-Board – Superior-RF-Laminate-with-Enhanced-Rigidity-and-Lead-Free-Processing |
| RO4360G2 laminates are high-performance, low-loss RF materials featuring a unique ceramic-filled, glass-reinforced thermoset construction that delivers exceptional electrical properties while maintaining FR-4-like processability. As the first high-Dk thermoset laminate compatible with standard PCB fabrication methods, RO4360G2 PCB offers superior rigidity for enhanced multilayer board processing, lead-free manufacturing compatibility, and significant cost savings versus traditional high-frequency materials. |
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| Rogers RO4360G2 PCB |
Rogers RO4360G2 Datasheet |
RO4360G2 2-Layer Circuit Board |
Rogers RO4360G2 Laminate |
RO4360G2 RF Materials |
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| RTduroid-5880-2-Layer-20mil-Immersion-Gold-PCB-Low-Loss-PTFE-Composite-for-Stripline-and-Microstrip-Circuit-Applications |
| Rogers RT/duroid 5880 High-Frequency Laminates represent the gold standard in PTFE-based microwave substrates, combining precision engineering with exceptional electrical performance. These glass microfiber-reinforced composites deliver unparalleled dielectric constant uniformity across panels and maintain consistent electrical properties throughout a broad frequency spectrum - from RF through Ku-band and beyond. |
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| RT/duroid 5880 High Frequency PCB |
20Mil RO4350B Thickness |
RT/duroid 5880 Immersion Gold PCB |
RT/duroid 5880 Microwave Substrates |
RT/duroid 5880 Loss Tangent |
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| RTduroid-6002-2-Layer-5mil-PCB-Advanced-Low-Loss-Microwave-Substrate-for-Complex-RF-Structures-and-Multilayer-Constructions |
| Rogers RT/duroid 6002 High-Frequency PCBs are advanced ceramic-reinforced PTFE composites engineered for precision microwave applications. These low-dielectric-constant materials deliver exceptional high-frequency performance with minimal signal loss, while their optimized mechanical properties ensure reliable integration in complex multilayer board architectures. |
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| RTduroid-6002 Dielectric Constant |
Rogers RTduroid-6002 Datasheet |
2-Layer RTduroid-6002 |
RTduroid-6002 PCB Material |
RTduroid-6002 Microwave Substrate |
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| Taconic-TLX-8-20mil-2-Layer-ENEPIG-PCB: PTFE-Fiberglass-Laminate-for-Vibration-Heat-and-Radiation-Resistant-Antennas |
| TLX-8 Laminate is a PTFE fiberglass composite material engineered for high-reliability antenna applications across demanding RF environments. This versatile substrate supports diverse microwave designs through its adjustable thickness options and customizable copper cladding configurations. The material delivers critical mechanical stability in extreme operating conditions. |
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| Taconic TLX-8 Substrate |
TLX-8 ENEPIG PCB |
TLX-8 Online Purchase |
20mil TLX-8 Thickness |
Taconic TLX-8 RF PCB |
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| Taconic-TLX-9-PCB-2-layer-31mil-High-Performance-PTFE-Laminate-with-Low-DK2.5-and-Immersion-Silver |
| TLX-9 PCB represents an advanced composite material combining PTFE with precision woven glass reinforcement, delivering exceptional stability in both electrical and mechanical performance. This engineered laminate maintains a tightly controlled dielectric constant of 2.5 across extended frequency ranges and temperature variations, with a remarkably low dissipation factor of 0.0019 at 10 GHz. |
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| Taconic TLX-9 PCB |
Taconic TLX-9 Datasheet |
2-layer TLX-9 substrate |
TLX-9 PTFE-Laminate |
TLX-9 LossTangent |
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| TMM4-2-Layer-50mil-RF-PCB--Rogers-High-Reliability-Ceramic-Thermoset-Laminate-for-Strip-Line-and-Micro-Strip |
| TMM4 PCB represents an advanced ceramic-filled hydrocarbon thermoset composite engineered for high-reliability stripline and microstrip applications. This innovative material combines the electrical performance benefits of ceramic substrates with the processability advantages of traditional PTFE laminates, while eliminating the need for specialized manufacturing techniques typically associated with high-frequency materials. |
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| 30mil WL-CT338 laminates |
Wangling's WL-CT338 PCB |
Loss Tangent of 0.0029 |
Wangling's WL-CT338 Price |
Wangling's WL-CT338 Material |
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