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Wangling F4BM220 2-Layer 0.8mm Thick Immersion Gold PCB with Enhanced Dielectric Stability for RF Applications

Shipped: 25th-APR-2025

1. Introduction of F4BM220 PCB

Wangling F4BM220 PCBs are crafted through a meticulous process of scientific formulation and stringent pressing, combining fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. This advanced manufacturing approach yields significantly improved electrical performance over its predecessor, F4B220 laminate. With reduced dielectric loss, elevated insulation resistance, and enhanced stability, F4BM220 serves as a highly capable alternative to comparable foreign - made products.

 

When comparing F4BM220 and F4BME220, although they share the same dielectric layer, their differences lie in the copper foil combinations. F4BM220 PCB utilizes ED copper foil, making it a suitable choice for applications where passive inter - modulation (PIM) requirements are not a concern. In contrast, F4BME220 substrate is paired with reverse - treated foil (RTF) copper foil, which offers outstanding PIM performance, more accurate line control, and lower conductor loss.

 

Both F4BM220 and F4BME220 PCBs achieve precise regulation of the dielectric constant by carefully adjusting the ratio of polytetrafluoroethylene to fiberglass cloth. This adjustment enables them to deliver low - loss performance and enhanced dimensional stability. Notably, a higher proportion of fiberglass in the composition correlates with a higher dielectric constant, leading to superior dimensional stability, a reduced coefficient of thermal expansion, improved temperature drift characteristics, albeit with a marginal increase in dielectric loss.


2. Features (F4BM220 PCB )

- Dielectric constant (Dk) of 2.2±0.04 at 10GHz

- Dissipation factor of .001 at 10GHz

- CTE x-axis of 25  ppm/°C, CTE y-axis of 34 ppm/°C, CTE z-axis of 240 ppm/°C, -55°C to 288°C

- Thermal coefficient of Dk at-142 ppm/°C, -55°C to 150°C

- Moisture absorption of ≤0.08%

- Flammability of UL-94 V0

 

3. PCB Stack-up: 2-layer Rigid PCB

Copper_layer_1 - 35 μm

F4BM220 Core - 0.8 mm

Copper_layer_2 - 35 μm

 
4. PCB Construction details:
 

    - Base material: F4BM220

    - Layer count: double sided

    - Board dimensions:  66.7mm x 51.9 mm=1PCS, +/- 0.15mm

    - Minimum Trace/Space:  5/5 mils

    - Minimum Hole Size:  0.25mm

    - No Blind vias.

    - Finished board thickness:  0.9mm

    - Finished Cu weight:  1oz (1.4 mils) outer layers

    - Via plating thickness: 20 μm

    - Surface finish:  Immersion Gold

    - Top Silkscreen:          White

    - Bottom Silkscreen:      No

    - Top Solder Mask:  Blue

    - Bottom Solder Mask: No

    - 100% Electrical test used prior to shipment

 

 
   

5. PCB Statistics:

    Components:        31

    Total Pads:         72

    Thru Hole Pads:     45

    Top SMT Pads:     27

    Bottom SMT Pads:    0

    Vias:              49

    Nets:              2

 
6. Type of artwork supplied: Gerber RS-274-X
 
7. Quality standard: IPC-Class-2
 
8. Availability: worldwide

9. Typical Applications of F4BM220:

- Microwave, RF, and radar systems

- Phase shifters

- Power dividers, couplers, combiners

- Feed networks

- Phase-sensitive antennas, phased array antennas

- Satellite communications

- Base station antennas

 
 
 
 
 
 
NEXT:10mil RO4350B and S1000-2M 1.5mm Thick 6-Layer Hybrid PCB for Thermal Shock Resistant Applications From Rogers
 
 
 

 

 
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