1. Introduction of RO4350B

Rogers RO4350B is a high-performance laminate combining woven glass reinforcement with hydrocarbon/ceramic technology, delivering PTFE-like electrical properties with the processing ease of conventional epoxy/glass materials. This innovative RO4350B material offers precise dielectric constant control and ultra-low signal loss while maintaining compatibility with standard PCB fabrication techniques—eliminating the specialized handling required for traditional microwave laminates.

Engineered for reliability, RO4350B PCB features a copper-matched CTE for exceptional dimensional stability in complex multilayer designs, along with a low Z-axis expansion rate that ensures robust plated through-holes even under extreme thermal cycling. With a Tg exceeding 280°C (536°F), this UL 94 V-0 certified material maintains consistent performance across all processing temperatures, making RO4350B PCB  ideal for high-power RF applications and active components where thermal resilience and signal integrity are critical.

Cost-effective without compromise, RO4350B laminate bridges the gap between premium RF performance and practical manufacturability.

2.1 Features (RO4350B)

- Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C

- Dissipation Factor of 0.0037 at 10GHz/23°C

- Thermal Conductivity 0.69 W/m/°K

- X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C

- High Tg value of >280 °C

- Low water absorption of 0.06%

2.2 Features (S1000-2M)

-Lower Z-Axis CTE for improved throughhole reliability

-Excellent Mechanical Processability andThermal Resistance

-Leadfree Compatible

-Tg180℃ (DSC), UV Blocking/AOI compatible

-High heat resistance

-Excellent Anti-CAF performance

-Low water absorption

3. PCB Stackup: 6-layer rigid PCB

Copper_layer_1 - 35 μm

RO4350B - 0.254 mm (10mil)

Copper_layer_2 - 35 μm

                                  Prepreg - 1080 X2 RC63% 0.127mm (5mil)

Copper_layer_3 - 35 μm

S1000-2M  - 0.254 mm (10mil)

Copper_layer_4 - 35 μm

  Prepreg - 1080 X2 RC63% 0.127mm (5mil)

Copper_layer_5 - 35 μm

RO4350B  - 0.254 mm (10mil)

Copper_layer_6 - 35 μm

5. PCB Statistics:

    Components:        149

    Total Pads:         215

    Thru Hole Pads:     57

    Top SMT Pads:     38

    Bottom SMT Pads:    120

    Vias:              79

    Nets:              6