1. Introduction of RF-10 PCB

Taconic RF-10 PCB combine ceramic-filled PTFE and woven fiberglass to deliver superior high-frequency performance. With a high dielectric constant and ultra-low dissipation factor, Taconic RF-10 PCB ensures minimal signal loss in demanding RF applications. The thin woven fiberglass reinforcement enhances rigidity for easier handling while maintaining excellent dimensional stability in multilayer designs.

Engineered for cost efficiency and fast industry-standard lead times, RF-10 Laminate enables compact RF circuit designs without compromising performance. Its exceptional bond with smooth, low-profile copper minimizes insertion losses—especially at high frequencies where skin effect dominates. This makes RF-10 PCB an ideal choice for high-speed, low-loss PCB applications requiring reliability and precision.

2. Features of RF-10 PCB

- Dielectric Constant of 10.2 ± 0.3 at 10GHz

- Dissipation Factor of 0.0025 at 10GHz

- High Thermal Conductivity of 0.85 W/mk (Unclad)

- x CTE of 16 ppm/°C, y CTE of 20 ppm/°C, z CTE of 25 ppm/°C

- Low Moisture Absorption of 0.08%

- Flammability Rating of V-0

3. Benefits of RF-10 PCB

- High DK for RF circuit size reduction

- Excellent dimensional stability

- Tight DK tolerance (10.2 +/- 0.3)

- High thermal conductivity for enhanced thermal management

- Excellent adhesion to smooth coppers

- Low X, Y, Z expansion

- Excellent price/performance ratio

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35μm (1oz)

RF-10 Core - 60mil (1.524mm)

Copper_layer_2 - 35μm (1oz)

6. PCB Statistics:

    Components:        26

    Total Pads:         75

    Thru Hole Pads:     43

    Top SMT Pads:      32

    Bottom SMT Pads:    0

    Vias:              53

    Nets:              2