1. Introduction of RO3010 PCB

Rogers RO3010 PCB materials stand as top - tier ceramic - filled PTFE composites, delivering a robustly high dielectric constant alongside outstanding stability. Engineered for the rigors of modern electronics, Rogers RO3010 PCB materials combine a competitive price point with remarkable mechanical and electrical steadfastness. This inherent stability streamlines the design process for broadband components, enabling seamless integration across an expansive spectrum of frequencies and applications. From high - end telecommunications to cutting - edge aerospace systems, RO3010 PCBs prove their mettle. Their unique set of characteristics makes them the go - to choice for circuit miniaturization, empowering engineers to create compact, high - performance circuits without sacrificing reliability or efficiency.

2. Features of RO3010 PCB

- Dielectric constant of 10.2+/- .30 at 10 GHz/23°C

- Dissipation factor of 0.0022 at 10 GHz/23°C

- Low Coefficient of Thermal Expansion (-55 to 288 °C) of 13 ppm/°C(X), 11 ppm/°C (Y),  16 ppm/°C (Z) respectively

- Td> 500°C

- Thermal Conductivity of 0.95 W/mK

- Moisture Absorption of 0.05%

- -40℃ to +85℃ operation

3. Benefits of RO3010 PCB

- Material exhibits dimensional stability with expansion coefficient matched to copper

- Economical laminate pricing for Volume manufacturing process

- ISO 9001 Certified

- Suitable for use with multi-layer board designs

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO3010 Substrate - 20mil (0.508mm)

Copper_layer_2 - 35 μm

6. PCB Statistics:

Components: 15

Total Pads: 37

Thru Hole Pads: 21

Top SMT Pads: 16

Bottom SMT Pads: 0

Vias: 32

Nets: 2