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RO4003C 2-Layer PCB 60mil with ENIG High Tg Low Cost Microwave Laminate for Harsh Environments

Shipped: 17th-APR-2025

1. Introduction of RO4003C PCB

Rogers RO4003C PCB is a high-performance laminate combining woven glass-reinforced hydrocarbon/ceramic for PTFE-like electrical properties with the ease of epoxy/glass processing. Available in 1080 and 1674 glass styles, it ensures consistent dielectric constant (Dk) control and low loss at a fraction of the cost of traditional microwave materials. Unlike PTFE-based alternatives, RO4003C PCB requires no special through-hole treatments, streamlining production.

 

 

Designed for reliability, RO4003C PCB features a copper-matched CTE for outstanding dimensional stability, making it ideal for multilayer RF designs. Its low Z-axis expansion ensures robust plated through-holes, even under extreme thermal cycling. With a high Tg exceeding 280°C, the RO4003C material maintains stable mechanical properties across all PCB processing temperatures. RO4003C laminate is non-brominated and not UL 94 V-0 rated, offering a balance of performance and manufacturability for demanding high-frequency applications.

 

 

Rogers RO4003C high-frequency PCB has several key advantages, including offering PTFE-level RF performance while allowing for standard FR-4 processing, featuring tight Dk tolerance and low loss which are essential for precise high-frequency designs, having a copper-matched coefficient of thermal expansion (CTE) that ensures multilayer stability and reliable vias, possessing high thermal resilience with a glass transition temperature (Tg) greater than 280°C making it suitable for harsh environments, and serving as a cost-effective alternative to conventional microwave laminates.

2. Features

- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz

- Dissipation Factor of 0.0027 at 10GHz, 0.0021 at 2.5GHz.

- Thermal Coefficient of dielectric constant of +40 ppm/°C

- Thermal Conductivity 0.71 W/m/°K

- X axis CTE of 11ppm/°C, Y CTE of 14ppm/°C, Z CTE of 46ppm/°C

- Low moisture absorption of 0.06%

 

3. Benefits

- Ideal for multi-layer board (MLB) constructions

- Processes like FR-4 at lower fabrication cost

- Designed for performance sensitive, high volume applications

- Competitively priced

 

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers 4003C Core - 1.524 mm (60mil)

Copper_layer_2 - 35 μm

 
5. PCB Construction Details:
 

    -Base material: RO4003C

    - Layer count: Double sided

    - Board dimensions:  580mm x 410 mm=1PCS, +/- 0.15mm

    - Minimum Trace/Space:  6/10 mils

    - Minimum Hole Size:  0.3mm

    - No Blind vias.

    - Finished board thickness:  1.6mm

    - Finished Cu weight:  1oz (1.4 mils) outer layers

    - Via plating thickness: 20 μm

    - Surface finish:  Electroless Nickel Immersion Gold

    - Top Silkscreen:          NO

    - Bottom Silkscreen:      No

    - Top Solder Mask:  NO

    - Bottom Solder Mask: No

    - 100% Electrical test used prior to shipment

 

 

6. PCB Statistics:

    Components:        92

    Total Pads:         227

    Thru Hole Pads:     171

    Top SMT Pads:      56

    Bottom SMT Pads:    0

    Vias:              48

    Nets:              2


 
7. Type of artwork supplied: Gerber RS-274-X
 
8. Quality standard: IPC-Class-2
 
9. Availability: worldwide

10. Typical Applications:

- Cellular Base Station Antennas and Power Amplifiers

- RF Identification Tags

- Automotive Radar and Sensors

- LNB's for Direct Broadcast Satellites

 
 
 
 
 
 
NEXT: Rogers RO4350B RF PCB 2-Layer 6.6mil ENIG Reliable Plated Through Holes for Thermal Shock Applications
 
 
 

 

 
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