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Rogers RO4350B RF PCB 2-Layer 6.6mil ENIG Reliable Plated Through Holes for Thermal Shock Applications

Shipped: 16th-APR-2025

1. Introduction of RO4350B PCB

Rogers RO4350B PCB represents an advanced ceramic-filled hydrocarbon composite that delivers near-PTFE electrical characteristics while maintaining epoxy/glass processing compatibility. This RO4350B material offers exceptional dielectric constant consistency and ultra-low loss characteristics, providing RF designers with reliable high-frequency performance at significantly reduced costs compared to traditional microwave substrates.

 

 

Engineered for demanding applications, RO4350B PCB features a copper-matched CTE profile that ensures outstanding dimensional stability for complex multilayer architectures. The material's UL 94 V-0 flammability rating makes it particularly suitable for high-power RF components and active circuitry. With a Tg exceeding 280°C and optimized Z-axis expansion properties, RO4350B laminate maintains structural integrity through rigorous thermal cycling while delivering robust plated through-hole reliability.

 

 

The combination of PTFE-comparable electrical properties with standard FR4 manufacturing processes eliminates the need for specialized via treatments, offering RF engineers a cost-effective solution without compromising performance. RO4350B PCB's unique material properties bridge the gap between conventional circuit board materials and premium high-frequency substrates, making it ideal for commercial wireless, automotive radar, and aerospace communication systems.


2. Features

- Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C

- Dissipation Factor of 0.0037 at 10GHz/23°C

- Thermal Conductivity 0.69 W/m/°K

- X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C

- High Tg value of >280 °C

- Low water absorption of 0.06%

 

3. Benefits

- Ideal for multi-layer board (MLB) constructions

- Processes like FR-4 at lower fabrication cost

- Excellent dimensional stability

- Competitively priced

 

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO4350B Core - 0.168 mm (6.6mil)

Copper_layer_2 - 35 μm

 
5. PCB Construction Details:
 

    - Base material: RO4350B

    - Layer count: Double sided

    - Board dimensions:  40.8 mm x 51.6 mm=1PCS, +/- 0.15mm

    - Minimum Trace/Space:  4/4 mils

    - Minimum Hole Size:  0.2mm

    - No Blind vias.

    - Finished board thickness:  0.29mm

    - Finished Cu weight:  1oz (1.4 mils) outer layers

    - Via plating thickness: 20 μm

    - Surface finish:  Immersion Gold

    - Top Silkscreen:          White

    - Bottom Silkscreen:      No

    - Top Solder Mask:  Green

    - Bottom Solder Mask: No

    - 100% Electrical test used prior to shipment

 

 

6. PCB Statistics:

    Components:        2

    Total Pads:         13

    Thru Hole Pads:     9

    Top SMT Pads:      4

    Bottom SMT Pads:    0

    Vias:              7

    Nets:              2


 
7. Type of artwork supplied: Gerber RS-274-X
 
8. Quality standard: IPC-Class-2
 
9. Availability: worldwide

10. Typical Applications:

- Cellular Base Station Antennas and Power Amplifiers

- RF Identification Tags

- Automotive Radar and Sensors

- LNB's for Direct Broadcast Satellites

 
 
 
 
 
 
NEXT: RT/duroid 6035HTC PCB 2-Layer 60mil Immersion Gold Superior Thermal Management for Demanding Microwave Applications
 
 
 

 

 
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