RT/duroid 6010.2LM High Frequency PCB Supplier

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

RT/duroid 6010.2LM High Frequency PCB Built on 25mil 0.635mm Substrate with Double Layers and Immersion Gold

Shipped: 1st-Sep-2023

Introducing our high-quality PCB (Printed Circuit Board) made with RT/duroid 6010.2LM ceramic PTFE composites. This 2-layer rigid PCB is designed to meet the demands of various applications, from patch antennas to satellite communication systems and power amplifiers. With its exceptional performance and reliable construction, it is an ideal choice for critical electronic circuits.

The PCB material features a dielectric constant of 10.2 at 10 GHz and a low dissipation factor of 0.0023 at 10 GHz, ensuring efficient signal transmission. It also offers a coefficient of thermal expansion of 24 ppm/°C in the X and Y dimensions and 47 ppm/°C in the Z dimension, making it suitable for a wide temperature range of -40℃ to +85℃.

The PCB's stackup consists of a finished copper layer of 35um on each side, sandwiching the RT/duroid 6010.2LM dielectric with a thickness of 25 mil (0.635mm). This configuration provides excellent electrical performance and enables reliable plated through holes in multilayer boards. The finished board has a thickness of 0.8mm and a finished copper weight of 1 oz (1.4 mils) on all layers.

With a focus on precision and performance, the PCB offers tight εr (dielectric constant) and thickness control, ensuring repeatable circuit performance. It features a minimum trace/space of 8/9 mils and a minimum hole size of 0.4mm, allowing for intricate circuit designs. The via plating thickness is 20um, and the surface finish is immersion gold, providing optimal conductivity and corrosion resistance.

To guarantee the quality and reliability of our PCBs, we conduct a 100% electrical test. The impedance is controlled at 50 ohms, with track/gap dimensions of 13.39mil/10.24mil. The absence of top and bottom silkscreen and solder mask ensures a clean and precise appearance.

Our PCB is manufactured to meet IPC-Class-2 standards, indicating its high level of quality and workmanship. It is suitable for a global customer base, as we offer worldwide service.

For any technical inquiries or further information, please contact at sales@bicheng-enterprise.com. We are here to assist you.

Item	Value
PCB Material	RT/duroid 6010.2LM ceramic PTFE composites
	Dielectric Constant at 10 GHz 23°C: 10.2
	Dissipation Factor at 10 GHz: 0.0023
	Coefficient of Thermal Expansion (X, Y, Z): 24 ppm/°C, 24 ppm/°C, 47 ppm/°C
	Operation Temperature: -40℃?to +85℃
Features and Benefits	- High dielectric constant for circuit size reduction
	- Low loss, suitable for X-band or below operation
	- Low Z-axis expansion for reliable plated through holes in multilayer boards
	- Low moisture absorption for reduced effects of moisture on electrical loss
	- Tight εr and thickness control for repeatable circuit performance
Stackup	2-layer rigid PCB
	Copper Layer 1: 35 μm
	RT/duroid 6010.2LM dielectric: 25 mil (0.635 mm)
	Copper Layer 2: 35 μm
Construction Details	Board dimensions: 50 mm x 38 mm (2 Types, 2 PCS, +/- 0.15 mm)
	Minimum Trace/Space: 8/9 mils
	Minimum Hole Size: 0.4 mm
	No blind or buried vias
	Finished board thickness: 0.8 mm
	Finished Cu weight: 1 oz (1.4 mils) all layers
	Via plating thickness: 20 μm
	Surface finish: Immersion Gold
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical test used
	13.39 mil/10.24 mil track/gap, 50 ohm impedance controlled
PCB Statistics	Components: 21
	Total Pads: 35
	Thru Hole Pads: 18
	Top SMT Pads: 17
	Bottom SMT Pads: 0
	Vias: 43
	Nets: 5
Type of artwork supplied	Gerber RS-274-X
Accepted standard	IPC-Class-2
Service area	Worldwide
Some Typical Applications	- Patch Antennas
	- Satellite Communications Systems
	- Power Amplifiers
	- Aircraft Collision Avoidance Systems
	- Ground Radar Warning Systems

BACK TO SEPTEMBER