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Rogers TC600 PCB 2-Layer 60mil Ultra Low Insertion Loss and Size Reduction for High Power RF Amplifiers |
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1. Introduction of TC600 laminates
Rogers TC600 PCBs revolutionize high-power RF designs with their PTFE-ceramic-glass hybrid composition, delivering 2.5 W/m·K thermal conductivity—the industry’s highest for PCB substrates. Engineered to slash dielectric and insertion losses by 30%, these 2-layer 60mil TC600 PCBs dramatically boost amplifier gain and antenna efficiency in 5G base stations, radar arrays, and satellite payloads. The ultra-efficient heat dissipation eliminates hotspots, enabling 20% higher power density versus standard FR-4 solutions while reducing PCB footprint through enhanced mechanical rigidity.
Ideal for mission-critical applications, Rogers TC600 PCB’s immersion tin finish ensures solderability across extreme thermal cycles (-65°C to +150°C), maintaining IPC-6012 Class 3 reliability for aerospace and defense systems. Its stable dielectric properties (±0.03 Dk variance) guarantee impedance consistency in Wilkinson dividers and Doherty amplifiers, cutting prototype iterations by 40%.
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2. Features
Dielectric constant (Dk) of 6.15 at 1.8MHz and 10 GHz/23°C
Low Dissipation factor of 0.0017 and 0.0020 at 1.8 and 10 GHz/23°C respectively.
High thermal conductivity of 1.1W/mK
Stable Dk across wide temperature range of -75ppm/°C from -40°C to 140°C
Low coefficient of thermal expansion on X,Y and Z axis (9, 9 and 35 ppm/°C)
Low Moisture Absorption 0.03% |
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3. Technical Advantages
Enables 40% PCB miniaturization vs FR-4 via optimized Dk (3.0±0.05) substrate integration
Cuts thermal load by 30% with 0.0015 insertion loss at 28GHz for 5G mmWave systems
Achieves IPC-6012 Class 3 compliance while eliminating delamination risks up to 288°C
Ensures X/Y CTE 12/14ppm/°C matching GaN power amplifiers for solder joint longevity |
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4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 18 μm + 17μm plating
TC600 - 1.524 mm (60mil)
Copper_layer_2 - 18 μm + 17μm plating |
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| 5. PCB Construction Details: |
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- Base material: TC600
- Layer count: Double sided
- Board dimensions: 76mm x 57 mm=4Types = 4PCS, +/- 0.15mm
- Minimum Trace/Space: 4/5 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 1.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immesion gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 24
Total Pads: 141
Thru Hole Pads: 65
Top SMT Pads: 76
Bottom SMT Pads: 0
Vias: 101
Nets: 2
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Typical Applications:
- Power Amplifiers, Filters and Couplers
- Microwave Combiner and Power Divider Boards in Avionics Applications
- Small Footprint Antennas
- Digital Audio Broadcasting (DAB) Antennas(Satellite Radio)
- GPS & Hand-held RFID Reader Antennas |
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NEXT: TFA300 High Frequency PCB 2-Layer 10mil PTFE Ceramic PCB Aerospace Grade RF Substrate with Dk3.0 |
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