1. Introduction of RF-30 PCB

Taconic RF-30 PCB  delivers an optimal balance of performance and value for demanding RF and antenna applications. This innovative material combines woven glass-reinforced fluoropolymer technology with ceramic enhancements, offering exceptional thermal stability, electrical performance, and mechanical reliability.

Engineered for cost-sensitive yet high-performance needs, RF-30 Organic Ceramic PCB features an ultra-low dissipation factor and smooth surface profile to minimize phase variations and intermodulation distortion—making RF-30 PCB ideal for long-format base station antennas (up to 102"). Its robust peel strength ensures durability in high-temperature assembly processes, while the woven fabric reinforcement guarantees superior dimensional stability.

Meeting stringent industry standards, RF-30 laminate carries a V-0 flammability rating (per IPC-TM 650) and excels in power handling, making it a dependable choice for mission-critical microwave and RF designs where consistent performance and long-term reliability are paramount.

2. Features of RF-30 PCB

- DK of 3.0 +/- 0.05 at 1.9 GHz/23°C

- Dissipation factor of 0.0014 at 1.9 GHz/23°C

- CTE in X-axis of 11 ppm/°C, Y-axis of 21 ppm/°C and Z-axix of 125 ppm/°C

-  Moisture Absorption 0.02%

- Dielectric Breakdown of > 60kV

- Volume resistivity of 1.26 x 10^9 Mohm-cm

- Flammability Rating of UL-94V0 grade

3. Benefits of RF-30 PCB

-  Low Cost

- Excellent Peel Strength

- Exceptionally Low Dissipation Factor

- Excellent Intermodulation Performance

- Low Moisture Absorption

- Enhanced Surface Smoothness

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

RF-30 - 1.016 mm (40mil)

Copper_layer_2 - 35 μm

6. PCB Statistics:

    Components:        77

    Total Pads:         186

    Thru Hole Pads:     93

    Top SMT Pads:      72

    Bottom SMT Pads:    21

    Vias:             121

    Nets:              2