1. Introduction of TP series

The TP series PCB introduces a glass-free ceramic/PPO composite technology, revolutionizing RF design with adjustable dielectric constants (3.0-25) through precise ceramic-resin ratio control—40% broader Dk range than conventional PTFE substrates. Engineered for 28GHz mmWave and satellite payloads, TP series laminates maintain 0.0018 loss tangent at 10GHz, outperforming FR-4 by 65% in signal integrity. Available in three configurations (TP/TP-1/TP-2), 7.62mm TP980 ENIG-finished PCBs achieve ±0.03 Dk stability across -55°C to +150°C, ideal for phased array radars and LEO satellite amplifiers.

Standardized variants (TP300/TP440/TP980) deliver MIL-PRF-31032 compliance with copper-matched CTE (14/18/52 ppm/°C), eliminating solder joint failures in 1000+ thermal cycles. Their thermoplastic nature enables 3-day rapid prototyping via standard PCB processes, cutting lead times by 50% versus ceramic hybrids.

- Dielectric constant (Dk) of 9.8±0.2 at 10GHz

- Dissipation factor of .0012 at 10GHz

- Low TCDK at -40 ppm/°C, -55°C to 150°C

- CTE x-axis of 40  ppm/°C, CTE y-axis of 40  ppm/°C, CTE z-axis of 55  ppm/°C, -55°C to 150°C

- Thermal conductivity of 0.65 W/mk

- Moisture absorption of 0.01%

- UL 94-V0

3. PCB Stack-up: 2-layer Rigid PCB

Copper_layer_1 - 35 μm

TF980 Core - 7.62 mm (300mil)

Copper_layer_2 - 35 μm

5. PCB Statistics:

    Components:        10

    Total Pads:         31

    Thru Hole Pads:     21

    Top SMT Pads:     10

    Bottom SMT Pads:    0

    Vias:              22

    Nets:              2