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10mil-10-Layer-High-Frequency-PCB-with-5-Cores-Rogers-RO4350B-and-4mil-RO4450F-for-Premium-Broadband-Wireless-Applications |
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(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.) |
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Hello everyone,
Good day!
In our previous discussions, we explored 4-layer and 6-layer RF PCBs, highlighting how Rogers multilayer PCBs are constructed using various core materials. Now, let’s dive into 10-layer RF PCBs—are they as straightforward as they seem?
A 10-layer RF PCB is built using 5 cores of Rogers material. To maintain a manageable final thickness, thinner cores are typically used, such as 6.6mil RO4350B, 10mil RO4350B, 13.3mil RO4350B, 8mil RO4003C, and 12mil RO4003C, among others.
Today’s focus is on a 10-layer PCB constructed with 5 cores of 10mil RO4350B and bonded with RO4450F prepreg. Designed for broadband wireless applications, this PCB has a total thickness of 2.0 mm and features immersion gold-plated pads. It is fabricated to IPC 6012 Class 2 standards using supplied Gerber data, with each shipment packed in sets of 10 boards. |
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Features and benefits |
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1. Exceptional Dimensional Stability: Ensures consistent performance and reliability.
2. Wide Temperature Resistance: Operates reliably in extreme temperatures, ranging from -192°C to 260°C.
3. Superior Surface Planarity with Immersion Gold: Ideal for PCBs with BGA or CSP components, reducing assembly failures and enhancing soldering quality.
4. Proactive Engineering Design: Identifies and resolves potential issues during the preproduction phase.
5. Efficient DDU Door-to-Door Shipment: Offers competitive shipping costs for seamless delivery.
6. Flexible Ordering Options: No minimum order quantity (MOQ), with cost-effective solutions for prototypes and samples. |
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Applications |
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RF transceiver, Communications relays, Low Noise Block, Splitter module |
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Parameter and data sheet |
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PCB SIZE |
115 x 110mm=1PCS=1design |
BOARD TYPE |
High Frequency PCB, Multilayer PCB |
Number of Layers |
10 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
TOP Layer: signal - 1/2oz foil + 25μm Cu |
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Core RO4350B -0.254mm |
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INT 1: mixed - 1/2oz foil |
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Prepreg RO4450F -0.202mm (2 x 0.101) |
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INT 2: mixed - 1/2oz foil |
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Core RO4350B -0.254mm |
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INT 3: mixed - 1/2oz foil |
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Prepreg RO4450F -0.202mm (2 x 0.101) |
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INT 4: mixed - 1/2oz foil |
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Core RO4350B -0.254mm |
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INT 5: mixed - 1/2oz foil |
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Prepreg RO4450F -0.202mm (2 x 0.101) |
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INT 6: mixed - 1/2oz foil |
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Core RO4350B -0.254mm |
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INT 7: mixed - 1/2oz foil |
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Prepreg RO4450F -0.202mm (2 x 0.101) |
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INT 8: mixed - 1/2oz foil |
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Core RO4350B -0.254mm |
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BOT Layer: signal - 1/2oz foil + 25μm Cu |
TECHNOLOGY |
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Minimum Trace and Space: |
5.5mil/5mil |
Minimum / Maximum Holes: |
0.3/2.0mm |
Number of Different Holes: |
9 |
Number of Drill Holes: |
7505 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control |
NO |
BOARD MATERIAL |
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Glass Epoxy: |
RO4350B core 0.254mm(10mil), RO4450B PP 0.1mm(4mil) |
Final foil external: |
1oz |
Final foil internal: |
0.5oz |
Final height of PCB: |
2.0mm ±10% |
PLATING AND COATING |
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Surface Finish |
Electroless nickel over Immersion Gold (ENIG)( 0.05µm over 3µm nickel) |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated Through Hole(PTH), via tented. BGA package |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" (0.15mm) |
Board plating: |
0.0030" (0.076mm) |
Drill tolerance: |
0.002" (0.05mm) |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Hot Tags:
10mil RO4350B PCB Thickness |
10 layers Rogers RO4350B PCB |
Rogers Multi-layer Board Designs |
Rogers RO4350B Material |
Rogers RO4350B Laminate |
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