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6-Layer-Rogers-RO3003-RF-PCB-with-FastRise-28-Prepreg--Superior-High-Speed-Signal-Transmission, Cost-Effective-Solution |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RO3003 high-frequency PCB materials are advanced ceramic-filled PTFE composites specifically engineered for commercial microwave and RF applications. Designed to deliver outstanding electrical and mechanical stability at cost-effective prices, these materials ensure consistent mechanical properties, enabling designers to create multi-layer board designs without issues like warping or reliability concerns. RO3003 materials feature a coefficient of thermal expansion (CTE) of 17 ppm/℃ in the X and Y axes, closely matching that of copper. This alignment ensures exceptional dimensional stability, with typical post-etch and bake shrinkage of less than 0.5 mils per inch. Additionally, the Z-axis CTE of 24 ppm/℃ guarantees superior plated through-hole reliability, even under harsh environmental conditions. |
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Typical applications: |
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1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers |
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RO3003 Typical Value |
Property |
RO3003 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.0±0.04 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.001 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-3 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.06
0.07 |
X
Y |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
107 |
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MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
107 |
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MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
930
823 |
X
Y |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.04 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.9 |
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j/g/k |
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Calculated |
Thermal Conductivity |
0.5 |
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W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
17
16
25 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Density |
2.1 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
12.7 |
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Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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Taconic's FastRise-28 prepreg is specifically engineered for high-speed digital signal transmission and millimeter-wave RF multilayer PCB manufacturing. It is designed to seamlessly integrate with other Taconic microwave substrate materials, enabling the production of high-performance multilayer microwave printed circuit boards.
FastRise-28 prepreg is ideal for stripline structures, offering low dielectric loss to meet demanding design requirements. Its thermosetting adhesive properties make it suitable for multiple lamination processes, ensuring robust and reliable multilayer constructions. The inclusion of a high percentage of ceramic powder fillers in its composition enhances dimensional stability, resulting in superior product performance. Additionally, its high-performance thermosetting resin ensures excellent bonding with copper foil and various PTFE materials.
The key properties of this advanced adhesive sheet material are detailed in the table below. |
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FastRise-28 (FR-28) Typical Value |
Property |
Value |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,ε |
2.78 |
- |
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10 GHz |
IPC-TM-650 2.5.5.5.1 |
Dissipation Factor,tanδ |
0.0015 |
- |
- |
10 GHz |
IPC-TM-650 2.5.5.5.1 |
Water Absorption |
0.08 |
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% |
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IPC TM-650 2.6.2.1 |
Dielectric breakdown voltage |
49 |
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KV |
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IPC TM-650 2.5.6 |
Dielectric strength |
1090 |
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V/mil |
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ASTM D 149 |
Volume Resistivity |
8.00 x 108 |
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MΩ/cm |
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IPC-TM-650 2.5.17.1 |
Surface Resistivity |
3.48 x 108 |
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MΩ |
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IPC-TM-650 2.5.17.1 |
Tg |
188 |
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℃ |
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ASTM E 1640 |
Tensil strength |
1690 |
X |
psi |
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ASTM D 882 |
1480 |
Y |
psi |
Tensil modulus |
304 |
X |
psi |
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ASTM D 882 |
295 |
Y |
psi |
Density |
1.82 |
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gm/cm³ |
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ASTM D-792 Method A |
Td |
709 |
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°F |
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IPC TM-650 2.4.24.6 |
Peel Strength |
7 |
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lbs/in |
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IPC-TM-650 2.4.8 |
Thermal Conductivity |
0.25 |
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W/mk |
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ASTM F433 |
Coefficient of Thermal Expansion |
59
70
72 |
X
Y
Z |
ppm/℃ |
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IPC-TM-650 2.4.41 |
Hardness |
68 |
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Shore D |
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ASTM D 2240 |
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More FastRise Prepregs |
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fastRise Prepreg |
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Product |
Carrier film (mil) |
Film Elognation (%) |
Pressed Thickness (mil) |
Pressed Thickness (mil) |
Pressed Thickness (mil) |
Nominal DK (Min. / Max.) (10 GHz) |
Typical Flow (%) |
FR-26-0025-60 |
1 |
200-300 |
2.7 |
1.3 |
1 |
2.58 |
17 |
FR-27-0030-25 |
2.3 |
30-60 |
3.5 |
2.1 |
Not recommended |
2.74 (2.71 / 2.78) |
4 |
FR-27-0035-66 |
1 |
200-300 |
3.7 |
2.5 |
2.1 |
2.7 |
36 |
FR-27-0040-25 |
3 |
30-60 |
4.9 |
3.7 |
Not recommended |
2.74 |
4 |
FR-28-0040-50 |
1 |
200-300 |
4.9 |
3.7 |
3.5 |
2.81 (2.80 / 2.82) |
23 |
FR-27-0042-75 |
2.3 |
30-60 |
5.16 |
3.96 |
3.5 |
2.73 |
35 |
FR-27-0045-35 |
3 |
30-60 |
5.8 |
4.6 |
4.2 |
2.75 (2.73 / 2.77) |
13 |
FR-27-0050-40 |
3 |
30-60 |
6.1 |
5.5 |
4.9 |
2.76 (2.71 / 2.80) |
23 |
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0.5 oz Cu. 50% removal |
1 oz. Cu. 50% removal |
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Refrigeration |
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FastRise is a non-reinforced prepreg produced between release liners to prevent individual plies from sticking together. The adhesive layer on the surface of the PTFE/ceramic film can be particularly tacky, especially in freshly manufactured material. To facilitate easier handling, it is recommended to refrigerate FastRise before lamination. Continuous refrigeration is a best practice for storing prepregs, as it extends shelf life. For FastRise, storing at a temperature as close to 4℃ as possible is ideal. This cooling process stiffens the material, making it easier to separate from the release liners. |
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Lamination |
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FastRise prepreg is used alongside various laminate cores to create multilayer boards tailored for RF, digital, and ATE applications. When incorporated into a symmetrical board design, FastRise ensures optimal electrical and mechanical performance. Thanks to the thermoset properties of its bonding agent, multiple lamination cycles can be performed without the risk of delamination. Additionally, the recommended press temperature of 215.5℃ is achievable for most board manufacturers.
An example of this is an RF PCB constructed with a Rogers RO3003 core bonded using FastRise-28. This 6-layer stack-up features 1oz copper on each layer, resulting in a finished board thickness of 1.2mm. The pads are immersion gold-plated, and the design includes 2+N+2 step blind vias from layer 1 to layer 4. Below is the detailed stack-up configuration.
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