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1.2mm-Hybrid-PCB-Mixed-Material-Circuit-Board-Combining-RO4350B, FR4-and-RT-Duroid- 5880-with-Immersion-Gold |
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(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.) |
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Hello Everyone,
Today, we’re diving into the world of hybrid PCBs, which primarily involve combining high-frequency materials with traditional epoxy glass. This unique mix allows for optimized performance in advanced applications. To better understand the hybrid structure, let’s take a closer look at the stack-up. |
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The hybrid PCB features Layer 1 to Layer 2 made from RO4350B high-frequency material for optimal signal performance, while Layer 3 to Layer 4 utilizes FR-4 epoxy glass for structural support. These two cores are securely bonded together using a layer of adhesive prepreg, ensuring a durable and reliable connection. |
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Types of hybrid PCB |
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Hybrid PCBs can combine FR-4 epoxy glass with high-frequency materials like RO4350B, offering a balance of performance and cost-efficiency. Alternatively, they can integrate different high-frequency materials with varying dielectric constants (DK), such as RT/duroid 5880 and RO4350B, to meet specific design requirements for advanced applications. |
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Why do we use hybrid PCB? |
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There are three main reasons why this type of high-frequency multilayer PCB is highly advantageous: cost efficiency, improved reliability, and enhanced electrical properties.
1. Cost Efficiency:
High-frequency materials are significantly more expensive than FR-4. By using a hybrid design that combines FR-4 with high-frequency materials, we can effectively reduce costs without compromising performance.
2. Improved Reliability:
Some high-frequency materials have high coefficient of thermal expansion (CTE), which can lead to reliability issues. By combining these materials with low-CTE FR-4, the composite CTE becomes more balanced, significantly enhancing the overall reliability of the PCB.
3. Enhanced Electrical Properties:
In many designs, only certain sections of the PCB require high electrical performance, while others do not. By using FR-4 for low-performance areas and high-frequency materials for critical sections, we optimize both performance and cost. Additionally, mixing materials with different dielectric constants (DK) can further improve electrical properties, making this approach ideal for applications like combiners and filters. |
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Why choose FR-4? |
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The combination of FR-4 and high-frequency materials is increasingly popular due to their excellent compatibility. This hybrid approach allows designers to leverage the cost-effectiveness of FR-4 while integrating high-frequency materials for enhanced performance, making it a versatile and practical solution for modern PCB designs. |
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Lamination |
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To ensure reliable lamination, we start by selecting a prepreg (PP) sheet made from high-frequency material and apply the appropriate pressing cycle. Using an adhesive layer of the same material simplifies the pressing process, making it more efficient and ensuring a stronger, more consistent bond. |
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Our PCB Capability(Hybrid PCB) |
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PCB Type: |
Hybrid PCB, Mixed PCB |
Hybrid type: |
RO4350B + FR4; |
RO4003C + FR4; |
F4B + FR4; |
RT/duroid5880 + FR4; |
RT/duroid5880 + RO4350B |
RO3000 Series + FR4 |
RT/duroid +FR4 |
Solder mask: |
Green, Red, Blue, Black, Yellow |
Layer count: |
4 Layer, 6 Layer, Multilayer |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
1.0-10mm |
PCB size: |
≤400mm X 500mm |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, Immersion silver, OSP, ENEPIG, Pure gold |
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Thank you for taking the time to read this. If you have any PCB - related inquiries, please feel free to get in touch with us. |
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Hot Tags:
| RO4350B FR4 Hybrid PCB |
Hybrid RO4350B FR4 Circuit Board |
Hybrid Design Blind Via Circuit Board |
Hybrid PCB Mixed Circuit Board |
RO4350B 5880 Blind Via PCBManufacturing |
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