Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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    What is HDI High Frequency PCB?      
   

1. Understanding HDI PCB

 
  PCB Prototypes
 
  HDI PCB
   
  Rigid-flex PCB
   
  Multi-layer PCB
  High Speed PCB
   
  Low Loss PCB
   
  Hybrid PCB
   
  Rogers PCB
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  F4B PCB
   
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HDI PCB (High-Density Interconnect Printed Circuit Board) represents a cutting-edge advancement in circuit board technology, designed to meet the increasing demands for miniaturization, high performance, and complex functionality in modern electronic devices. By utilizing high-density interconnect technology, HDI PCBs feature finer trace widths, smaller vias, and significantly higher wiring density compared to traditional PCBs. This enables the integration of more components in a compact space, making them ideal for applications where size, speed, and reliability are critical.

 

   
         
    2. Key Features    
   

2.1 Microvia Technology:

Uses laser-drilled microvias (typically less than 150µm in diameter) to achieve denser routing.

 

2.2 Multilayer Stacking:

Increases interlayer connection density through blind vias, buried vias, and stacked vias.

 

2.3 Fine Lines:

Smaller trace widths and spacing to support high-density component placement.

 

2.4 Thin Materials:

Employs thinner substrates to enhance overall performance.

   
         
   

3. Advantages

   
   

3.1 High-Density Routing:

Accommodates complex circuit designs.

 

3.2 Signal Integrity:

Reduces signal loss and interference.

 

3.3 Miniaturization:

Supports compact electronic devices.

 

3.4 High Performance:

Suitable for high-frequency and high-speed applications.

   
         
    4. Overview of 8-layer TU-883 HDI PCB    
   

When it comes to the HDI PCB, the one that impresses me the most is Isola TU-883 HDI PCB.

 

Discover our advanced 8-layer HDI PCB, built with TU-883 material, a state-of-the-art solution tailored for high-speed, low-loss, and high-frequency applications. This RF PCB is meticulously designed to meet the demanding requirements of modern electronics, delivering exceptional performance, reliability, and precision. Whether you're working on cutting-edge telecommunications systems, high-performance computing solutions, or RF/wireless applications, this High-Density Interconnect (HDI) PCB is the perfect choice for your next-generation projects.

 

   
         
   

4.1 Key Features

   
   

1.Exceptional Low-Loss Performance:

With a dielectric constant (Dk) of 3.39 @ 10GHz and a dissipation factor (Df) of 0.0045 @ 10GHz, this PCB ensures minimal signal loss, making it perfect for high-frequency applications.

 

2.Outstanding Thermal Stability:

Featuring a Tg (TMA) of 170°C, TU-883 provides excellent thermal stability, ensuring reliable performance even in high-temperature environments.

 

3.Eco-Friendly Compliance:

This halogen-free and lead-free material meets stringent environmental regulations and is fully compatible with lead-free reflow processes.

 

4.Anti-CAF Reliability:

Enhanced resistance to conductive anodic filament (CAF) formation guarantees long-term durability and performance.

 

5.Superior Moisture Resistance:

Designed to withstand humid conditions, the material offers excellent moisture resistance, preventing degradation over time.

   
         
   

4.2 8-layer TU883 PCB Stack-Up

   
   

The 8-layer stack-up PCB is designed to optimize high-speed signal transmission and enhance thermal management.

   
   

Layer

Material

Thickness (um)

Specification

Top Layer

Copper

45

18um base + 17um plating

Layer 2

TUC-TU883P Prepreg

89

IPC-4101/24

Layer 3

Copper

35

 

Layer 4

S1000-2MB Prepreg

160

IPC-4101/24

Layer 5

Copper

35

 

Layer 6

FR-4 TU883 Core

254

IPC-4101/24

Layer 7

Copper

35

 

Layer 8

S1000-2MB Prepreg

160

IPC-4101/24

Bottom Layer

Copper

35

18um base + 17um plating

   
         
       
         
   

4.3 Applications of HDI PCB

   
   

This wholesale HDI PCB is perfectly suited for a variety of high-performance applications, such as:

 

- Radio frequency

 

- Backplane, High performance computing

 

- Line cards, Storage

 

- Servers, Telecom, Base station

 

- Office Routers

   
         
    5. Concluding Remarks    
   

As a core technology in high-frequency PCBs, HDI PCBs, with their exceptional signal integrity and thermal management capabilities, have driven rapid advancements in 5G, artificial intelligence, and high-speed computing, leading the electronics industry to new heights.

   
         
   

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Feel free to consult and contant at any time !

 

Visit https://www.bicheng-enterprise.com to learn more.

Unlock its full potential by contacting Vicky at v.xie@bichengpcb.com.

   
         
         
         
       
       
           
   
 
                                     
       
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