1. Introduction of TU-768

TUC's TU-768 and TU-768P laminates/prepregs are crafted from high-quality woven E-glass coated with an epoxy resin system. This composition imparts UV-blocking characteristics and ensures compatibility with automated optical inspection (AOI) processes. These products are ideal for boards that must endure severe thermal cycles or extensive assembly work. TU-768 laminates demonstrate exceptional coefficient of thermal expansion (CTE), superior chemical resistance, thermal stability, and resistance to conductive anodic filament (CAF) growth.

2. Typical Properties

- Glass Transition Temperature (Tg) by DSC of 180°C

- Lead Free process compatible

- Excellent coefficient of thermal expansion, X-Axis of 11-15 ppm/°C, Y-Axis of 11-15 ppm/°C

- Time to Delaminate by TMA (Copper removed), T260 of 60 minutes, T288 of 15 minutes

- DK, Permittivity of 4.3 at 5 GHz and 10 GHz, 4.3-4.4 at 1 GHz

- Df, Loss Tangent of 0.023 at 10 GHz, 0.021 at 5 GHz, 0.019-0.018 at 1 GHz

- Anti-CAF property

- Superior chemical and thermal resistance

- Fluorescence for AOI

- Moisture resistance of 0.18%

- Flammability (Laminate & laminated prepreg) of UL94-V0

3. PCB Stack-up: 2-layer Rigid PCB

Copper_layer_1 - 35 μm

TU-768 Core - 1.5 mm (60mil)

Copper_layer_2 - 35 μm

5. PCB Statistics:
Components: 41

Total Pads: 152

Thru Hole Pads: 97

Top SMT Pads: 45

Bottom SMT Pads: 0

Vias: 51

Nets: 2