|
|
|
RO4535 PCB 20mil Rogers 2-layer Substrates High Frequency Laminate for Microstrip Antennas |
|
|
|
|
|
|
|
1. Introduction of RO4535
RO4535 High Frequency Laminates from Rogers Corporation are specifically designed to meet the needs of the antenna market, enhancing the capabilities of the RO4000 product series for antenna applications. This ceramic-filled, glass-reinforced hydrocarbon material offers controlled dielectric constant, low loss performance, and excellent passive intermodulation response, making it ideal for mobile infrastructure microstrip antennas.
|
|
|
|
Fully compatible with conventional FR-4 and high-temperature lead-free solder processing, RO4535 laminates eliminate the need for special treatments required by traditional PTFE laminates for plated through-hole preparation. This makes them a cost-effective alternative to conventional PTFE antenna technologies, enabling designers to balance price and performance effectively. Additionally, RO4535 laminates are available with Rogers' RoHS-compliant flame-retardant technology for applications that require UL94 V-0 certification. |
|
|
|
2. Features
- Dielectric Constant of DK 3.44 +/-0.08 at 10GHz/23°C
- Dissipation Factor of 0.0037 at 10GHz/23°C
- Thermal Conductivity 0.6 W/m/°K
- X axis CTE of 16 ppm/°C, Y CTE of 17 ppm/°C, Z CTE of 50 ppm/°C
- High Tg value of >280 °C
- Low water absorption of 0.09%
- UL-94 V0
|
|
|
|
3. Benefits
-Outstanding passive inter-modulation (PIM) performance with LoPro™ copper foil
-Enhanced mechanical rigidity compared to PTFE
-Coefficient of thermal expansion (CTE) comparable to copper, minimizing stress in PCB antennas |
|
|
|
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO4535 Core - 0.508 mm (20mil)
Copper_layer_2 - 35 μm
|
|
|
|
| 5. PCB Construction Details: |
| |
| - Board dimensions: 53 mm x 53 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: Green
- 100% Electrical test used prior to shipment |
| |
| |
| |
| |
| |
| |
|
 |
|
|
|
|
6. PCB Statistics:
Components: 11
Total Pads: 22
Thru Hole Pads: 12
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 17
Nets: 2 |
|
|
|
7. Type of artwork supplied: Gerber RS-274-X |
|
|
|
8. Quality standard: IPC-Class-2 |
|
|
|
9. Availability: worldwide |
|
|
|
10. Some Typical Applications:
- Cellular infrastructure base station antennas
- WiMAX antenna networks |
|
|
|
|
|
|
|
|
|
|
|
|
|
NEXT:Rogers High Frequency Made on RT/duroid5880 2-layer 0.381mm 15mil DK2.2 PCB |
|
|
|
|
|
|
