|
|
|
Double layer 8mil RO4003C DK3.38 Woven Glass Reinforced Hydrocarbon/Ceramics Laminate |
|
|
|
|
|
|
|
1. Introduction of RO4003C
Rogers RO4003C materials are proprietary laminates made from woven glass reinforced hydrocarbon/ceramics. They combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass.
|
|
|
|
Available in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles, all meeting the same electrical performance specifications. These laminates offer tight control over dielectric constant (Dk) and low loss, using standard epoxy/glass processing methods while significantly reducing costs compared to conventional microwave laminates. Unlike PTFE-based microwave materials, RO4003C does not require special through-hole treatments or handling procedures. |
|
|
|
Additionally, RO4003C materials are non-brominated and do not meet UL 94 V-0 ratings. |
|
|
|
The thermal coefficient of expansion (CTE) of RO4003C provides important advantages for circuit designers. Its expansion coefficient closely matches that of copper, ensuring excellent dimensional stability, which is essential for mixed-dielectric multilayer board constructions. The low Z-axis CTE also ensures reliable plated through-hole quality, even under extreme thermal shock conditions. With a Tg of over 280°C (536°F), RO4003C maintains stable expansion characteristics throughout the entire range of circuit processing temperatures. |
|
|
|
2. Features
- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz
- Dissipation Factor of 0.0027 at 10GHz, 0.0021 at 2.5GHz.
- Thermal Coefficient of dielectric constant of +40 ppm/°C
- Thermal Conductivity 0.71 W/m/°K
- X axis CTE of 11ppm/°C, Y CTE of 14ppm/°C, Z CTE of 46ppm/°C
- Low moisture absorption of 0.06%
|
|
|
|
3. Benefits
-Perfect for multi-layer board (MLB) constructions
-Processes similarly to FR-4 at a lower fabrication cost
-Tailored for performance-sensitive, high-volume applications
-Competitively priced |
|
|
|
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers 4003C Core - 0.203 mm (8mil)
Copper_layer_2 - 35 μm
|
|
|
|
| 5. PCB Construction Details: |
| |
| - Board dimensions: 117.04mm x 67.11 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.3mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Silver
- Top Silkscreen: Black
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
| |
| |
| |
| |
| |
| |
|
 |
|
|
|
|
6. PCB Statistics:
Components: 19
Total Pads: 76
Thru Hole Pads: 45
Top SMT Pads: 31
Bottom SMT Pads: 0
Vias: 67
Nets: 2 |
|
|
|
7. Type of artwork supplied: Gerber RS-274-X |
|
|
|
8. Quality standard: IPC-Class-2 |
|
|
|
9. Availability: worldwide |
|
|
|
10. Some Typical Applications:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites |
|
|
|
|
|
|
|
|
|
|
|
|
|
NEXT:Rogers RO4350B High-frequency Laminate 0.338 mm 13.3mil Immersion Gold Circuit Board |
|
|
|
|
|
|
