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1.524mm 2-layer Fiberglass Cloth and PTFE Composites Wangling F4BM300 for Satellite Communications |
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1. Introduction of F4BM300
Wangling's F4BM300 laminates are created by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is enhanced compared to F4B300, mainly due to lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.
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F4BM300 and F4BME300 have the same dielectric layer but different copper foil combinations. F4BM300 is paired with ED copper foil, suitable for applications without PIM requirements. F4BME300 is paired with reverse-treated foil (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss. |
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By adjusting the ratio between polytetrafluoroethylene and fiberglass cloth, F4BM300 and F4BME300 achieve precise control of the dielectric constant, providing low loss and enhanced dimensional stability. A higher dielectric constant corresponds to a higher proportion of fiberglass, resulting in better dimensional stability, lower thermal expansion coefficient, improved temperature drift, and a slight increase in dielectric loss. |
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2. Features （F4BM300)
- Dielectric constant (Dk) of 3.0 at 10GHz
- Dissipation factor of .0017 at 10GHz
- CTE x-axis of 12 ppm/°C, CTE y-axis of 15 ppm/°C, CTE z-axis of 95 ppm/°C, -55°C to 288°C
- Low thermal coefficient of Dk at-80 ppm/°C, -55°C to 150°C
- Moisture absorption of ≤0.08%
- Flammability of UL-94 V0
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3. PCB Stackup:2-layer rigid PCB
Copper_layer_1 - 35 μm
F4BM300 Core - 1.524 mm
Copper_layer_2 - 35 μm |
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| 4. PCB Construction Details: |
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- Board dimensions: 700mm x 40 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.4mm
- No Blind vias.
- Finished board thickness: 1.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion tin
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: Green
- 100% Electrical test used prior to shipment |
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5. PCB Statistics:
Components: 51
Total Pads: 76
Thru Hole Pads: 37
Top SMT Pads: 49
Bottom SMT Pads: 0
Vias: 32
Nets: 2 |
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6. Type of artwork supplied: Gerber RS-274-X |
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7. Quality standard: IPC-Class-2 |
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8. Availability: worldwide |
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9. Some Typical Applications:
- Microwave, RF, and radar systems
- Phase shifters
- Power dividers, couplers, combiners
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications
- Base station antennas |
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NEXT:Customized Double Sided Wangling 5.08mm F4BTMS615 Material PCB HASL Surface Finish |
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