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PTFE High Frequency PCB 2-layer 0.508mm 20mil RF-60TC DK6.15 Immersion Gold |
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1. Introduction of RF-60TC
The RF-60TC high frequency material is a ceramic-filled, glass-reinforced PTFE laminate with high thermal conductivity. It is specifically designed for high power RF and microwave applications. This material aims to offer lower operating temperatures in high power scenarios and better gains and efficiencies in miniaturized antenna applications for the 6.15 DK market by enhancing dielectric heat dissipation and boasting exceptionally low dielectric losses.
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RF-60TC's improved heat transfer provides additional design flexibility, extends the lifespan of active components, and enhances long-term reliability. It has excellent adhesion to very low profile and reverse treated copper, reducing insertion loss. The low coefficient of thermal expansion (CTE) and enhanced dimensional stability of RF-60TC enable the construction of high layer count multilayer PCBs with improved plated through hole reliability. |
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2. Features （RF-60TC)
- Glass Reinforced PTFE Ceramic Composites
- Dielectric Constant (Dk) of 6.15 at 10 GHz
- Dissipation factor of 0.002 at 10 GHz/23°C
- Thermal coefficient of Dk of -3.58 ppm/°C in the range of -50°C to 150°C
- Low moisture absorption of 0.03%
- High thermal conductivity of 0.9 W/M*K (unclad), 1.0W/M*K(0.5oz), 1.05 W/M*K(1oz)
- CTE X-axis, Y-axis of 9.9 ppm/°C and 40 ppm/°C of Z-axix
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3. Benefits
- Enhanced loss tangent
- Superior thermal conductivity
- Strengthened dimensional stability
- Low Z-axis CTE of 40 ppm/°C
- Outstanding adhesion to metal
- Stable DK over frequency
- Stable DK over temperature
- Low moisture absorption |
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4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 70 μm
RF-60TC- 0.508 mm (20mil)
Copper_layer_2 - 70 μm
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| 5. PCB Construction Details: |
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| - Board dimensions: 200mm x 62mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/5 mils
- Minimum Hole Size: 0.2mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1 oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 44
Total Pads: 99
Thru Hole Pads: 68
Top SMT Pads: 31
Bottom SMT Pads: 0
Vias: 47
Nets: 2 |
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Some Typical Applications:
- High Power Amplifiers
- Miniaturized Antennas
- GPS, Patch, RFID reader
- Filters, Couplers & Dividers
- Satellites |
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NEXT:Rogers RO3003 High Frequency PCB PTFE RF PCB 2.4mm Thick 1oz Copper Immersion Gold |
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