3. Benefits
- Low Dielectric Loss: Suitable for applications up to 77 GHz.
- Excellent Mechanical Properties Across Temperature:
* Enables reliable stripline and multi-layer board constructions.
- Uniform Mechanical Properties Across Various Dielectric Constants:
* Perfect for multi-layer board designs with different dielectric constants.
* Compatible with epoxy glass multi-layer board hybrid designs.
- Stable Dielectric Constant with Temperature and Frequency:
I* deal for bandpass filters, microstrip patch antennas, and voltage-controlled oscillators.
- Low In-Plane Expansion Coefficient (Matches Copper):
* Ensures more reliable surface-mounted assemblies.
* Suitable for temperature-sensitive applications.
* Provides excellent dimensional stability.
- Volume Manufacturing Process:
* Offers economical laminate pricing. |