 |
| F4BM220 High Frequency PCB: A 2-Layer Design with 1.0mm Thickness and Immersion Gold |
| The F4BM220 features enhanced characteristics, including lower dielectric loss, increased insulation resistance, and improved stability, making it an ideal choice for a variety of applications. This laminate can effectively replace similar foreign products, ensuring that users receive high-quality performance without compromise. |
Tags:
| 1.0mm F4BM PCB Board |
Double-Sided PTFE PCB |
RF F4BM PCB Immersion Gold Finish |
Low-DK F4BM220 PCB |
Wangling's F4BM220 Laminates |
|
|
|
|
 |
| TACONIC's RF10 High Frequency 2 Layer 25mil High TC 0.85 DK10.2 PCB |
RF-10 laminates are engineered to provide a cost effective substrate with industry acceptable delivery times. RF-10 responds to a need in RF applications for size reduction. RF-10 bonds well to smooth low profile copper. The low dissipation of RF-10 combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role. |
Tags:
| High Performance 2 layers Hybrid PCB |
High DK 10.2 TACONIC Substrate |
25mil RF-10 High Frequency PCB |
Low CTE RF-10 Hybrid Material PCB |
High Thermal Conductivity Material |
|
|
| |
|
 |
| 30mil Taconic's RF-35 Material High Frequency RF PCB Circuit Board |
| RF-35 is an organic-ceramic laminate within Taconic's ORCER family. It is based on woven glass reinforcement. RF-35 offers low cost and is suitable for high-volume commercial microwave and RF applications. It has excellent peel strength for 1/2 ounce and 1 ounce copper. Moreover, its ultra-low moisture absorption rate and low dissipation factor minimize phase shift with frequency. |
Tags:
2-Layer Taconic RF-35 Hybird PCB |
High Peel Strength 30mil RF-35 Substrate |
30mil RF-35 Hybird Material PCB |
2-Layer Low Dissipation PCB |
Low Moisture Absorption Substrate |
|
|
| |
|
 |
| High Performance 2-Layer 50mil PTFE Rogers RO3010 with ENIG Surface Finish |
| Rogers RO3010 is a ceramic-filled PTFE composite that provides a higher dielectric constant and excellent stability. Its competitive pricing, combined with superior mechanical and electrical properties, simplifies broadband component design. RO3010 laminates are ideal for circuit miniaturization and versatile applications across a wide frequency range. |
Tags:
2-Layer RO3010 Hybird Material |
50mil PTFE RO3010 PCB |
100% Electrical Test ENIG PCB |
Rogers RO3010 Hybird Substrate |
Low CTE RF-10 PCB Board |
|
|
| |
|
 |
| Multilayer 3 layers 2.7mm Thickness Rogers Td> 500°C RO3010 Material PCB |
| Rogers RO3010 advanced circuit materials are ceramic-filled PTFE composites that offer a high dielectric constant and excellent stability, making them ideal for various applications across a wide frequency range. Their dimensional stability, matched expansion coefficient to copper, and economical pricing support circuit miniaturization and multi-layer board designs, simplifying broadband component development. |
Tags:
| Td> 500°C and Low CTE |
Multilayer 3-layer 2.7mm PCB |
Ceramic-filled PTFE Material PCB |
Rogers RO3010 Hybird Material |
Multi-layer Board Designs |
|
|
| |
|
 |
| 2-Layer 20mil Rogers RO3203 Material Lead-Free PCB with Finished Cu |
| RO3203 High Frequency Circuit Materials are ceramic-filled laminates with woven fiberglass reinforcement, providing excellent electrical performance and mechanical stability. With a dielectric constant of 3.02 and a dissipation factor of 0.0016, they support frequencies over 40 GHz. Their low dielectric loss, rigidity, and excellent dimensional stability make them ideal for complex multi-layer structures and epoxy designs, all at a competitive price. |
Tags:
| RO3000 Series High Frequency PCB |
20mil Rogers RO3203 Substrate |
Low in-plane CTE |
20 mil RO32033 Via Filled Material |
2-Layer Low Dissipation PCB |
|
|
| |
|
 |
| Double sided Rogers 50mil RO3210 PCB for Wireless Communication and Automotive Safety |
| Rogers' RO3210 high frequency materials are ceramic-filled laminates with woven fiberglass. They provide excellent electrical and mechanical stability, especially improved mechanical stability. RO3210 combines non-woven PTFE's smooth surface and woven-glass PTFE's rigidity. It can be made into PCBs using standard PTFE techniques. |
Tags:
| Woven-glass Reinforcement Material |
Double Sided RogersRO3210 PCB |
50mil Rogers RO3210 PCB Board |
PTFE Material PCB |
50mil RO3210 Antenna PCB |
|
|
| |
|
 |
| Rogers RF Made on RO4003C LoPro 32.7mil 0.831mm Immersion Silver PCB |
| The RO4003C LoPro laminates utilize Rogers' technology to bond reverse-treated foil with standard RO4003C dielectric, achieving lower conductor loss and improved signal integrity. They offer high-frequency performance and cost-effective fabrication, compatible with standard FR-4 processes. |
Tags:
Mulilayer PCB Capability |
RF RO4003C LoPro Printed Circuit |
Rogers RO4003C LoPro PCB Prototype |
32.7mil RO4003C LoPro PCB |
RO4003C LoProBlue Mask |
|
|
| |
|
 |
| 24mil Rogers RO4360G2 High DK and High Tg Thermoset Laminate |
| The Rogers RO4360G2 laminates are low-loss, glass-reinforced thermoset materials that offer high performance and cost-effective processing. As the first high dielectric constant (Dk) laminates compatible with FR-4, they provide lead-free options and enhanced rigidity for multilayer boards. These laminates ensure design flexibility, reliable plated through-holes, and efficient supply chains for cost savings. |
Tags:
| RO440 Series 2-Layer PCB |
RO4360G2 Multi-layer Laminate |
High DK Thermoset Laminate |
Lead Free Process Compatible Material |
24mil Rogers RO4360G2 PCB |
|
|
| |
|
 |
| 2-Layer 60mil Rogers RO4533 High Frequency PCB for WiMAX Antenna Networks |
| Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon materials. These laminates are compatible with conventional FR-4 and high-temperature lead-free solder processing, eliminating the need for special treatments required by traditional PTFE laminates. RO4533 laminates are a cost-effective alternative to PTFE technologies and they're also available in halogen-free versions to meet strict environmental standards. |
Tags:
| PTFE-based RO4533 Laminates |
Double Sided 60mil RO4533 PCB |
RO4533 PCB Immersion Gold Surface Finish |
Low CTE Rogers High Frequency PCB |
2-Layer Low Dissipation Substrate |
|
|
| |
|
 |
| Rogers RO4730G3 PCB 2-Layer 60mil 1.524mm Material with ENEPIG Surface Finish |
| Rogers RO4730G3 laminates are hydrocarbon/ceramic/woven glass materials designed for antenna applications. They offer a cost-effective alternative to PTFE-based laminates, providing excellent antenna performance without requiring special treatment for plated through-hole preparation. Compatible with FR-4 and lead-free solder processes, RO4730G3 is ideal for optimizing cost and performance. |
Tags:
| ENEPIG Surface Finish Circuit Board |
Low TCDk RO4730G3 Substrate |
Rogers Low Loss Dielectric PCB |
Rogers RO4730G3 High Tg 280 °C |
2-Layer 60mil Rogers RO4730G3 |
|
|
| |
|
 |
| Hybrid PCB Rogers RT/duroid 6006 Ceramic-PTFE High Td 500°C Materials 2 Layers Circuit Board |
| Rogers RT/duroid 6006 laminates are ceramic-PTFE composites designed for electronic and microwave circuits requiring a high dielectric constant. They enable smaller circuit sizes with low loss characteristics, making them ideal for X-band applications and below. Their precise Dk and thickness control ensure consistent performance. |
Tags:
| Tight DK of 6.15 Laminates |
RT/duroid 6006 Ceramic PTFE Composites |
Double Sided 10mil RT/duroid 6006 |
ENIG High Frequency PCB |
RT/duroid 6006 for X-band Applications |
|
|
| |
|
 |
| TMM10i Rogers PCB 15mil 0.381mm Immersion Gold and Edge Plated High Frequency Board |
| Rogers TMM 10i is an isotropic thermoset microwave material made from a ceramic thermoset polymer composite, tailored for applications like high reliability plated thru-hole, strip-line, and micro-strip designs. This material features a consistent dielectric constant (Dk) and combines the advantageous properties of ceramic and PTFE substrates with the easy processing of softer materials. |
Tags:
| TMM 10i Thermoset Microwave Material |
The TMM series PCB |
PCB for High Strip-line and Micro-strip Application |
15mil Thickness TMM 10i Substrate |
The Edge Plated TMM 10i Laminates |
|
|
| |
|
 |
| 0.8mm 2-layer Ceramics and PPO Composites High Frequency PCB Wangling TP440 for Beidou |
| TP440 utilizes a distinct high-frequency thermoplastic material. The dielectric layer of TP-type laminates is formed by ceramics and PPO resin without the reinforcement of fiberglass, allowing the dielectric constant to be accurately adjusted. Its special production process confers it with outstanding dielectric performance and high reliability. Notably, the adhesion between the copper foil and the dielectric is more dependable compared to ceramic substrates with vacuum coating. Additionally, it exhibits resistance to radiation and low outgassing, making it an ideal choice for applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas. |
Tags:
| High-frequency Thermoplastic Material |
0.8mm Wangling TP440 for Beidou |
Double Sided Adjustable DK Wangling TP440 |
TP440 Ceramics and PPO Composites |
PCB for Missile-borne Systems |
|
|
| |
|
 |
| 2-layer 20 mil Thickness Taconic DF 0.0011 TSM-DS3 for High-power Applications |
| TSM-DS3 is a ceramic-filled reinforced material with very low fiberglass content , designed for large-format, complex multilayers. It features an industry-leading low loss core and offers the predictability and consistency of high-quality fiberglass reinforced epoxies. Developed for high-power applications, TSM-DS3 efficiently conducts heat away from other sources in printed wiring board (PWB) designs and has low coefficients of thermal expansion for durability under thermal cycling. |
Tags:
| TSM-DS3 for Large-format, Complex Multilayers |
2-layer Low CTE TSM-DS3 PCB |
Low Loss Core 0.0011 Taconic TSM-DS3 |
Taconic TSM-DS3 for High-power Applications |
Low ~5% Fiberglass Content Material |
|
|
| |
|
