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Rogers RO4730G3 PCB 2-Layer 60mil 1.524mm Material with ENEPIG Surface Finish |
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1. Introduction of RO4730G3
Rogers RO4730G3 is hydrocarbon / ceramic / woven glass UL 94 V-0 antenna grade laminates that are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4730G3 dielectric materials provide the necessary properties for ideal antenna performance. RO4730G3 antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4730G3 laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance. |
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2. Features (RO4730G3)
- Dk of 3.0 +/- 0.05 at 10GHz
- Dissipation factor of .0028 at 10GHz
- Thermal coefficient of Dk of 34 ppm/°C
- Coefficient of thermal expansion matched to copper - x y z : 15.9 ppm/°C, 14.4 ppm/°C, 35.2 ppm/°C
- Tg >280 °C
- Decomposition Temperature (Td) of 411 °C TGA
- Thermal Conductivity of 0.45W/mk |
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3. Benefits
- low loss dielectric with low profile foil
* Reduced PIM
* Low insertion loss |
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- Unique filler / closed microspheres
* Low density
* Light-weight 30% lighter than PTFE / Glass |
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- Low Z-axis CTE <30ppm/°C
- High Tg >280°C
* Design flexibility
* Automated assembly compatible |
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- Low TCDk <40 ppm/°C
* Consistent circuit performance |
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- Specially formulated thermoset resin system/filler
* Low TCDk
* 3.0 Dk
* Ease of fabrication
* PTH process capability |
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- Environmentally Friendly
* Lead-free process compatibility
* RoHS compliant |
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4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO4730G3 Core - 1.524 mm (60mil)
Copper_layer_2 - 35 μm |
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5. PCB Construction details: |
- Board dimensions: 158mm x 127 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 1.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Blue
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 31
Total Pads: 68
Thru Hole Pads: 42
Top SMT Pads: 26
Bottom SMT Pads: 0
Vias: 37
Nets: 2 |
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Some Typical Applications:
- Cellular Base Station Antennas
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NEXT:Hybrid PCB Rogers RT/duroid 6006 Ceramic-PTFE High Td 500°C Materials 2 Layers Circuit Board |
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