1. Introduction of RO4533

Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon based material set, providing the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

RO4533 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas. Moreover, RO4533 laminates are available halogen-free to meet the most stringent “green” standards.

The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna. The typical glass transition temperature of RO4533 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through-hole reliability.

2. Features (RO4533)

    - Dielectric Constant of DK 3.3 at 10GHz

    - Dissipation Factor of 0.0025 at 10GHz

    - X axis CTE of 13ppm/°C, Y CTE of 11ppm/°C, Z CTE of 37ppm/°C

    - Tg >280 °C

    - Low moisture absorption of 0.02%

    - Thermal conductivity of 0.6 W/mk

3. Benefits:

- Low Loss, Low Dk and low PIM response for wide range of application use

- Thermoset resin system compatible with standard PCB fabrication

- Excellent dimensional stability for greater yield on larger panels sizes

- Uniform mechanical properties for maintaining mechanical form during handling

- High thermal conductivity for improved power handling

10. Some Typical Applications:

- Cellular infrastructure base station antennas

- WiMAX antenna networks