1.  RO4003C Low Profile Introduction

RO4003C LoPro laminates use a proprietary Rogers’ technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining the other desirable attributes of the standard RO4003C laminate system. RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes and do not require specialized via preparation such as sodium etch for lower manufacturing cost.

2. Features(RO4003C LoPro)

- Dielectric constant of 3.38+/- 0.05 at 10 GHz/23°C

- Dissipation factor of 0.0027 at 10 GHz/23°C

- Td> 425°C, High Tg greater than 280 °C TMA

- High Thermal Conductivity of 0.64 W/mK

- Low Z-axis coefficient of thermal expansion at 46 ppm/°C

- Copper matached Coefficient of Thermal Expansion (-55 to 288 °C)：X axis 11 ppm/°C, Y axis 14 ppm/°C

- Lead free Process Compatible

3. Benefits

- Lower insertion loss allows for higher operating frequency designs (even greater than 40 GHz)

- Reduced passive inter-modulation (PIM) for base station antennas

- Improved thermal performance due to lower conductor loss

- Mulilayer PCB capability

- Design flexibility

- High temperature processing

- Meets environmental concerns

- CAF resistant

10. Some Typical Applications

- Digital applications such as servers, routers, and high speed back planes

- Cellular base station antennas and power amplifiers

- LNB’s for direct broadcast satellites

- RF Identification Tags