1.  RO4360G2 Introduction

Rogers RO4360G2 laminates are low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing capability. RO4360G2 laminates are the first high dielectric constant (Dk) thermoset laminate that can be processed similar to FR-4. These materials are lead-free process capable and offer better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs. RO4360G2 laminates can be paired with RO440 series prepreg and lower-Dk RO4000 laminate in multi-layer designs.

2. Features (RO4360G2)

- Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C

- Dissipation factor of 0.0038 at 10 GHz/23°C

- Td> 407°C, High Tg greater than 280 °C TMA

- High Thermal Conductivity of 0.75 W/mK

- Low Z-axis coefficient of thermal expansion at 28 ppm/°C

- Copper matached Coefficient of Thermal Expansion (-55 to 288 °C)：X axis 13 ppm/°C, Y axis 14 ppm/°C

- Lead free Process Compatible, 94V-0 flammability.

3. Benefits

-Design flexibility

-Plated through-hole reliability

-Automated assembly compatible

-Environmentally friendly- Lead free process compatible

-Efficient supply chain and short lead times makes for cost effective material option

4. PCB Stackup:  2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO4360g2 Substrate - 24mil (0.61mm)

Copper_layer_2 - 35 μm

10. Some Typical Applications

- Base Station Power Amplifiers

- Small Cell Transceivers