1.  Introduction of RO3210

Rogers' RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability with one distinguishing characteristic - improved mechanical stability.

RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques.

2. Features (RO3210)

- Dk of 10.2 +/- 0.5

- Dissipation factor of .0027 at 10GHz

- Coefficient of thermal expansion matched to copper - x y z : 13 ppm/°C, 13 ppm/°C, 34 ppm/°C

- Decomposition Temperature (Td) of 500 °C TGA

- Thermal Conductivity of 0.81W/mk

- Flammability of V0 UL 94 standard

3. Benefits

- Woven glass reinforcement

*Improves rigidity for easier handling

- Uniform electrical and mechanical performance;

*Ideal for complex multi-layer high frequency structures

- Low in-plane expansion coefficient (matched to copper)

* Suitable for use with epoxy multi-layer board hybrid designs

* Reliable surface mounted assemblies

- Excellent dimensional stability

* High production yields

-Surface smoothness

* Allows for finer line etching tolerances

4.  PCB Stackup:  2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO3210 Core - 1.27 mm (50mil)

Copper_layer_2 - 35 μm

10. Some Typical Applications:

- Automotive collision avoidance systems

- Automotive global positions satellite antennas

- Wireless telecommunications systems

- Microstrip patch antennas for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

- LMDS and wireless broadband

- Base station infrastructure