Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
WELCOME TO BICHENG

 

 

 

 

2-Layer 20mil Rogers RO3203 Material Lead-Free PCB with Finished Cu

Shipped: 15th-NOV-2024  

1.  Introduction of RO3203

RO3203 High Frequency Circuit Materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3203 High Frequency Materials were designed as an extension of the RO3000 Series High Frequency Circuit Materials with one distinguishing characteristic - improved mechanical stability. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

 

2. Features (RO3203)

- Rogers RO3203 ceramic-filled PTFE composites

- Dielectric constant of 3.02+/- 0.04 at 10 GHz/23°C

- Dissipation factor of 0.0016 at 10 GHz/23°C

- Td> 500°C

- Thermal Conductivity of 0.87 W/mK

- Coefficient of Thermal Expansion (-55 to 288 °C)X axis 13 ppm/°C, Y axis 13 ppm/°C, Z axis 58 ppm/°C

- Lead free Process Compatible, 94V-0 flammability.

 

3. Benefits

Woven glass reinforcement

- Improves rigidity for easier handling

 

Uniform electrical and mechanical performance

- Ideal for complex multi-layer high frequency structures

 

Low dielectric loss

- High frequency performance used in applications exceeding 20 GHz

 

Low in-plane expansion coefficient (matched to copper)

- Suitable for use with epoxy multi-layer board hybrid designs

- Reliable surface mounted assemblies

 

Excellent dimensional stability

- High production yields

 

Economically priced

- Cost effective volume manufacturing

 

Surface smoothness

- Allows for finer line etching tolerances

 

4. PCB Stackup:  2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO3203 Substrate - 20mil (0.508mm)

Copper_layer_2 - 35 μm

 
5. PCB Construction details:

- Board dimensions:  65.78mm x 37.48 mm=1PCS

- Minimum Trace/Space:  5/5 mils

- Minimum Hole Size:  0.4mm

- No Blind vias.

- Finished board thickness:  0.6mm

- Finished Cu weight:  1 oz (1.4 mils) outer layers

- Via plating thickness: 20 μm

- Surface finish:  Immersion Tin

- Top Silkscreen:          White

- Bottom Silkscreen:      No

- Top Solder Mask:  Green

- Bottom Solder Mask: No

- 100% Electrical test used prior to shipment

 

6.  PCB Statistics:

    Components:        10

    Total Pads:         34

    Thru Hole Pads:     19

    Top SMT Pads:      15

    Bottom SMT Pads:    0

    Vias:              29

    Nets:              2

 
 
 

7. Type of artwork supplied: Gerber RS-274-X

 

8. Accepted standard: IPC-Class-2

 

9. Availability: worldwide

 

10. Some Typical Applications

- Automotive collision avoidance systems

- Automotive global positions satellite antennas

- Wireless telecommunications systems

- Microstrip patch antennas for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

- LMDS and wireless broadband

- Base station infrastructure

 

 
 
 
 
 
 
NEXT:Double sided Rogers 50mil RO3210 PCB for Wireless Communication and Automotive Safety
 
 
 

 

 
About Us
Products
Solutions
Contact Us
 
 
 
Antenna, Mobile Internet
Address:
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
 
 
 
Wireless Infrastructure
Phone:
86-755-27374946
 
 
 
Millimeter Wave Radar
Email:
info@bicheng-enterprise.com
 
 
       
Aerospace
 
WeChat:
bichengpcb
 
 
 
 
 
 
       
Satellite Navigation
 
Skype:
vickyxie0315@outlook.com
 
 
 
 
 
 
       
Power Amplifier
 
 
 
 
 
 
 
 
 
 
 
 
IoT
 
 
 
 
 
 
 
in fb yt quora

 

Copyright  © Shenzhen Bicheng Electronics Technology Co., Ltd. All rights reserved