1. Introduction of RT/duroid 6035HTC

Rogers RT/duroid 6035HTC high frequency circuit materials are ceramic-filled PTFE composites intended for high power RF and microwave applications. They are an outstanding option for high power scenarios. The laminates possess a thermal conductivity nearly 2.4 times that of the standard RT/duroid 6000 products. They come with copper foil (ED and reverse treat) boasting excellent long-term thermal stability. Moreover, Rogers' advanced filler system provides excellent drillability, reducing drilling costs compared to standard high thermally conductive laminates that utilize alumina fillers.

2. Features

- DK of 3.5 +/- 0.05 at 10 GHz/23°C

- Dissipation factor of 0.0013 at 10 GHz/23°C

- Thermal Coefficient of dielectric constant of -66 ppm/°C

- Moisture Absorption 0.06%

- Thermal Conductivity of 1.44 W/m/K at 80°C

- CTE in X-axis of 19 ppm/°C, Y-axis of 19ppm/°C and Z-axix of 39ppm/°C

3. Benefits

- High thermal conductivity

- Enhanced dielectric heat dissipation allows for lower operating temperatures in high-power applications

- Outstanding high-frequency performance

- Reduced insertion loss and excellent thermal stability of traces

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

RT/duroid 6035HTC - 0.254 mm (10mil)

Copper_layer_2 - 35 μm

6. PCB Statistics:
Components: 11

Total Pads: 40

Thru Hole Pads: 23

Top SMT Pads: 17

Bottom SMT Pads: 0

Vias: 18

Nets: 2