3. Benefits
- Uniform Mechanical Properties: It exhibits consistent mechanical traits for diverse dielectric constants.
This makes it a prime choice for multi-layer board configurations where varying dielectric constants are required.
It also dovetails well with epoxy glass multi-layer board hybrid designs.
- Low In-Plane Expansion Coefficient: Matching closely with copper.
This feature permits more dependable surface mounted assemblies.
It is especially advantageous for applications that are highly responsive to temperature fluctuations, given its excellent dimensional stability.
-Volume Manufacturing Process
Thanks to its suitability for mass production, it offers cost-effective laminate pricing. |