2. Core Product Features

Stable High -DK Dielectric Performance: TF960 features DK 9.6 ± 0.19 at 10 GHz, enabling precise impedance matching for compact high-frequency RF and millimeter-wave circuit designs.

 

Ultra-Low Signal Loss: Dissipation factor Df 0.0012 at 10 GHz minimizes insertion loss and preserves signal integrity across broadband microwave operation.

 

Excellent Dimensional Stability: Controlled X/Y CTE of 50 ppm/°C and Z-axis CTE of 65 ppm/°C reduces thermal-induced deformation during assembly and long-term service.

 

 Low Moisture Absorption & Safety Rating: Maximum moisture absorption ≤0.05 % improves environmental reliability; UL 94-V0 flammability rating satisfies industrial and aerospace safety requirements.

 

FR4-Compatible Fabrication: Supports standard drilling, plating and lamination processes and withstands 260 °C lead-free reflow, lowering production difficulty compared with conventional PTFE-based boards.

 

Aerospace-grade Survivability: Radiation-resistant and low-outgassing properties make this PCB suitable for space-borne payload and high-reliability defense electronic hardware.

 

PCB Construction Details

Parameter Item	Technical Specification
Base Material	TF960 PTFE-Ceramic Composite Laminate
Layer Count	2-Layers
Board Dimensions	102 mm × 86 mm (1 Piece), tolerance ±0.15 mm
Minimum Trace/Space	5/8 mils
Minimum Hole Size	0.25 mm
Blind Vias	No Blind Vias Design
Finished Board Thickness	0.635 mm Rigid Board
Outer Layer Finished Copper Weight	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Silver
Top Silkscreen	White Silkscreen
Bottom Silkscreen	No Silkscreen
Top Solder Mask	Blue Solder Mask
Bottom Solder Mask	No Solder Mask
Pre-Shipment Test	100 % Electrical Testing

 

PCB Stackup Structure

This 2‑Layer rigid high‑frequency PCB adopts TF960 ceramic‑filled PTFE core with symmetrical copper configuration for stable microwave performance:

 

Copper_layer_1: 35 μm

TF960 Core Substrate: 0.635 mm (25 mil)

Copper_layer_2: 35 μm

 

5. PCB Statistical Parameters

Total Components: 49

Total Pads: 57

Thru Hole Pads: 32

Top SMT Pads: 25

Bottom SMT Pads: 0

Total Vias: 43

Total Nets: 2

 

6. Production & Quality Standards

Artwork Supply Format: Gerber RS-274-X

Accepted Standard: IPC-Class-2

Supply Scope: Worldwide Supply & Service

 

7. TF-Series PTFE-Ceramic Composite Substrate Knowledge

7.1 TF-Series Product Overview

TF series substrates are composite dielectrics formulated with high-performance modified PTFE resin and micron-scale ceramic fillers, without woven glass-fabric reinforcement. Dielectric constant can be precisely tuned by adjusting ceramic-to-PTFE ratio to satisfy diverse microwave impedance targets. Available variants include unclad TF, single-sided copper-clad TF-1, double-sided copper-clad TF-2, and TF960-a dedicated high-DK grade optimized for repeatable dielectric behaviour and manufacturability for advanced RF and millimeter-wave circuits.

TF- series offers DK options from 3.0 up to 16.0, including standard values 3.0, 6.0, 9.2, 9.6, 10.2, 16.0. The material maintains reliable long-term performance from −80 °C to +200 °C and provides thickness selections ranging from 0.635 mm to 2.5 mm. Benefiting from radiation resistance and low-outgassing characteristics, TF-series laminates are widely adopted within aerospace and space-grade electronic hardware.

 

7.2 Material Advantages

Broad customizable dielectric-constant portfolio for microwave and millimeter-wave PCB projects Low dissipation factor ensures minimal high-frequency signal attenuation Wide operating-temperature window and outstanding thermal stability Radiation-resistant and low-outgassing for aerospace and satellite payload applications Compatible with standard thermoplastic PCB processing workflows to control manufacturing cost

8. Typical Application Scenarios

TF960 2-Layer high-frequency PCB fits a wide range of high-performance electronic systems: microwave/RF transceivers, 5G/6G Massive MIMO antennas, automotive ADAS radar, aerospace radar systems, satellite communication payloads, high-power RF amplifiers and test-and-measurement instruments such as vector network analyzers. It is also well-suited for phased-array antenna feed networks and high-reliability defense electronics hardware.

9.DataSheet

Property	TEST CONDITIONS	UNITS	TYPICAL VALUES (TF960)
Dielectric Constant	10 GHz	-	9.6±0.19
Dielectric Constant Tolerance	-	-	±2%
Dissipation Factor	10 GHz	-	0.0012
Thermal Coefficient of Dielectric Constant	-55℃ ~ 150℃	ppm/℃	-260
Copper Peel Strength	1 OZ, Normal Condition	N/mm	>0.6
Copper Peel Strength	1 OZ, After Alternating Humid Heat	N/mm	>0.4
Volume Resistivity	Normal Condition, 500V	MΩ·cm	>1×10⁹
Surface Resistivity	Normal Condition, 500V	MΩ	>1×10⁷
Coefficient of Thermal Expansion (X/Y/Z)	-55℃ ~ 150℃	ppm/℃	50, 50, 65
Moisture Absorption	20±2℃, 24 hours	%	≤0.05
Long-Term Operating Temperature	Temperature Chamber	℃	-80～200℃
Material Composition	-	-	PTFE, Ceramic, matched with ED copper foil

 

10. Product Summary

TF960 2-Layer rigid high-frequency PCB is a double-sided microwave circuit board based on 0.635 mm TF960 PTFE-ceramic composite core. With DK 9.6 ± 0.19 and ultra-low Df 0.0012 at 10 GHz, this immersion-silver finished PCB with blue top solder mask and white silkscreen supports 5/8 mils fine-line fabrication. Built to IPC-Class-2 and fully electrically tested before delivery, it combines FR4-compatible processability, low-moisture absorption, UL 94-V0 safety and aerospace-qualified low-outgassing performance, serving as a robust solution for 5G-6G Massive MIMO, automotive radar, satellite payloads and high-power RF amplifier hardware.

Tags

TF960 PCB, 2-Layer High Frequency PCB, PTFE ceramic composite laminate, Immersion Silver PCB, Blue solder mask PCB, TF960 rigid PCB, 5G 6G Massive MIMO PCB, Automotive ADAS radar PCB, Aerospace satellite communication PCB, millimeter-wave circuit board, IPC-Class-2 RF PCB