2. RT duroid 6010.2LM PCB Features

1. High dielectric constant (Dk) of 10.2 +/- 0.25, enabling efficient circuit size reduction
2. Low dissipation factor of 0.0023 at 10 GHz, ensuring minimal signal attenuation for high-frequency operation
3. Coefficient of Thermal Expansion (CTE) matched to copper, with X-axis, Y-axis, and Z-axis values all at 24 ppm/°C, 24 ppm/°C, and 47 ppm/°C respectively
4. Exceptional Decomposition Temperature (Td) of 500 °C (measured via TGA), providing superior thermal stability in extreme environments
5. Thermal Conductivity of 0.86 W/mk, facilitating efficient heat dissipation to protect components
6. Complies with UL 94 V0 flammability standard, ensuring enhanced safety for various applications
7. Clad with both standard and reverse treated electrodeposited copper foil, offering flexibility for diverse manufacturing needs
8. Base Material: RT duroid 6010.2LM (RT/duroid® 6010LM ceramic-PTFE composite microwave laminates)
9. Layer Count: 4-layer rigid PCB, engineered for complex multi-layer circuit designs
10. Finished Board Thickness: 2.8mm, providing structural integrity for heavy-duty applications
11. Surface Finish: ENIG (Electroless Nickel Immersion Gold), ensuring excellent solderability, corrosion resistance, and long-term reliability

3. RT duroid 6010.2LM PCB Benefits

1. The high dielectric constant enables substantial circuit size reduction, making it ideal for compact electronic devices where space is at a premium.
2. Low loss performance ensures optimal signal integrity, making it perfectly suited for operation at X-band frequencies and below.
3. Tight control over dielectric constant and board thickness delivers consistent, repeatable circuit performance, reducing production variability and improving yield rates.
4. Low moisture absorption enhances durability and reliability, even in humid or variable environmental conditions.
5. Designed with reliable plated through-holes (PTH), ensuring secure interlayer connections and long-term structural stability for multi-layer boards.
6. CTE matched to copper prevents warping and delamination during thermal cycling, extending the PCB’s service life and reducing failure risks.
7. High decomposition temperature and thermal conductivity provide exceptional thermal stability, protecting components from heat damage in harsh operating environments.
8. UL 94 V0 flammability rating enhances safety, making it suitable for applications with strict fire safety requirements.
9. Compatibility with both standard and reverse treated electrodeposited copper foil offers flexibility in manufacturing, adapting to diverse design and assembly needs.
10. Meets IPC-Class-2 quality standards, striking an optimal balance between cost and performance with minor cosmetic imperfections that do not impact functionality.
11. 4-layer rigid construction provides the structural support needed for complex multi-layer circuits, enabling the integration of more components in a compact space.

4. PCB Construction Details

Construction Item	Specification
Base Material	RT duroid 6010.2LM
Layer Count	4 layers
Board Dimensions	86mm x 103mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	5/7 mils
Minimum Hole Size	0.5mm
Blind Vias	No
Finished Board Thickness	2.8mm
Finished Cu Weight (Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	ENIG
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Electrical Test (Prior to Shipment)	100% Electrical Test used

5. PCB Stackup

4-layer rigid PCB, with the following structure (from top to bottom):

1. Copper_layer_1 - 35 μm
2. Rogers RT duroid 6010.2LM Core - 1.27 mm (50mil)
3. Copper_layer_2 - 35 μm
4. Prepreg - 0.102mm
5. Copper_layer_3 - 35 μm
6. Rogers RT duroid 6010.2LM Core - 1.27 mm (50mil)
7. Copper_layer_4 - 35 μm

6. PCB Statistics

1. Components: 21
2. Total Pads: 42
3. Thru Hole Pads: 16
4. Top SMT Pads: 26
5. Bottom SMT Pads: 0
6. Vias: 28
7. Nets: 2

7. Type of Artwork Supplied

Gerber RS-274-X

8. Quality Standard

IPC-Class-2 (adheres to industry-established quality criteria for high-frequency and microwave applications, balancing cost-effectiveness and performance with minor cosmetic imperfections that do not compromise functionality).

9. Availability

Worldwide

10. Typical Applications

1. Patch Antennas
2. Satellite Communications Systems
3. Power Amplifiers
4. Aircraft Collision Avoidance Systems
5. Ground Radar Warning Systems

11.Summary

Rogers RT/duroid 6010.2LM 4-Layer PCB is a high-performance circuit board engineered for electronic and microwave applications requiring a high dielectric constant, leveraging RT/duroid® 6010LM ceramic-PTFE composite laminates to deliver exceptional results. With a 2.8mm thickness, 4-layer rigid construction, and compliance with IPC-Class-2 standards, it offers high Dk for circuit size reduction, low loss for reliable signal transmission, and tight performance control—making it ideal for patch antennas, satellite communications systems, power amplifiers, and aerospace radar applications. Featuring ENIG surface finish, CTE matched to copper, high thermal stability, and reliable plated through-holes, RT/duroid 6010.2LM PCB combines structural integrity with functional excellence. Supported by worldwide availability, it provides a dependable solution for precision high-frequency applications across aerospace, telecommunications, and defense industries.

 

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !

Visit https://www.bicheng-enterprise.com to learn more.