2. PCB Basic Specification Table

Specification Item	Detailed Parameters
PCB Layer Count	8-layer Hybrid Board
Dielectric Material & Thickness	Top: 0.203mm RO4003C; Middle: S1000-2M; Bottom: 0.203mm RO4003C
Finished Board Thickness	1.6mm
Outer Layer Copper Weight	1oz
Inner Layer Copper Weight	0.5oz / 1oz (Positive-negative Copper)
Surface Treatment	Immersion Gold
Solder Mask & Printing	Double-sided Green Solder Mask, White Silk Screen
Board Dimension	273mm × 185mm (1PCS, Including Process Edge)
Special Hole Process	L1-L2 & L7-L8 Blind Holes; 0.2mm/0.25mm/0.35mm Resin Plug Holes

3. PCB Stackup Structure

This customized 8-layer hybrid PCB adopts a rational mixed stackup design combining high-frequency RO4003C and high-reliability S1000-2M materials, which balances excellent high-frequency electrical performance and multi-layer structural stability. The layered structure optimizes signal transmission and mechanical endurance, with the detailed stackup configuration displayed below:

4.RO4003C High-frequency Material Introduction

RO4003C is a classic hydrocarbon ceramic laminate belonging to the Rogers RO4000 series, specially engineered for high-frequency and microwave circuit applications. Different from traditional PTFE high-frequency materials, this rigid thermoset dielectric material delivers superior high-frequency performance while supporting standard FR-4 processing, achieving a perfect balance of high performance and cost efficiency for mass production.

The material boasts ultra-stable electrical properties across a wide frequency and temperature range. It features low dielectric tolerance and ultra-low dielectric loss, with a minimal temperature coefficient of dielectric constant, effectively reducing insertion loss for high-frequency signals. Its dielectric constant remains stable even at elevated operating frequencies, making it ideal for broadband RF circuit design. Equipped with optional LoPro foil, it further optimizes high-frequency signal transmission quality and enhances signal integrity.

In terms of structural and processing performance, RO4003C has a copper-matched coefficient of thermal expansion (CTE), providing outstanding dimensional stability, which is critical for hybrid multi-layer PCB construction. Its low Z-axis CTE ensures reliable plated through-hole performance even under severe thermal shock conditions. With a Tg exceeding 280°C, the material maintains stable expansion characteristics throughout the entire PCB processing temperature range. It requires no specialized via treatment such as sodium etch, fully adapting to automated PCB production equipment and standard FR-4 manufacturing workflows, supporting high-volume industrial production. In addition, RO4003C features excellent CAF resistance and repeatable impedance control, ensuring consistent circuit performance.

5.RO4003C Datasheet

Property	Typical Value	Direction	Units	Condition	Test Method
Dielectric Constant εr (Process)	3.38 ± 0.05	Z	—	10 GHz / 23°C	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant εr (Design)	3.55	Z	—	8 ~ 40 GHz	Differential Phase Length Method
Dissipation Factor tanδ	0.00270.0021	Z	—	10 GHz / 23°C2.5 GHz / 23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of εr	+40	Z	ppm/°C	-50°C ~ 150°C	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 × 10¹⁰	—	MΩ•cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 × 10⁹	—	MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2 (780)	Z	KV/mm (V/mil)	0.51mm (0.020”)	IPC-TM-650 2.5.6.2
Tensile Modulus	19,650 (2,850)19,450 (2,821)	XY	MPa (ksi)	Room Temperature	ASTM D638
Tensile Strength	139 (20.2)100 (14.5)	XY	MPa (ksi)	Room Temperature	ASTM D638
Flexural Strength	276 (40)	—	MPa (kpsi)	—	IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X, Y	mm/m (mils/inch)	After etch + E2 / 150°C	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	111446	XYZ	ppm/°C	-55°C ~ 288°C	IPC-TM-650 2.4.41
Tg (Glass Transition Temperature)	>280	—	°C	TMA Method A	IPC-TM-650 2.4.24.3
Td (Decomposition Temperature)	425	—	°C	TGA Test	ASTM D3850
Thermal Conductivity	0.71	—	W/m·K	80°C	ASTM C518
Moisture Absorption	0.06	—	%	48 hrs immersion, 0.060” sample, 50°C	ASTM D570
Density	1.79	—	g/cm³	23°C	ASTM D792
Copper Peel Strength	1.05 (6.0)	—	N/mm (pli)	After solder float, 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	N/A	—	—	—	UL 94
Lead-Free Process Compatible	Yes	—	—	—	—

6.RO4003C Application Fields

Thanks to its reliable high-frequency performance and cost-effective manufacturability, RO4003C materials are widely applied in commercial and industrial RF/microwave electronic devices. Its core application scenarios include cellular base station antennas and power amplifiers, RF identification systems, automotive radar and sensor modules, as well as low-noise block downconverters for satellite direct broadcast systems. It is the preferred substrate for high-frequency broadband circuits, controlled impedance transmission lines and filter design products.

7. S1000-2M FR-4 Material Introduction

S1000-2M (including S1000-2MB) is a high-performance lead-free FR-4 dielectric material with low CTE and high Tg characteristics, specially optimized for high-layer-count multi-layer PCB manufacturing. This premium substrate material solves the structural stability challenges of complex multi-layer boards, featuring excellent mechanical processing performance and thermal resistance, fully compatible with modern lead-free assembly processes.

The material exhibits prominent advantages in reliability and environmental adaptability. Its low Z-axis CTE greatly improves through-hole structural reliability, effectively avoiding hole cracking and layer delamination during long-term use and thermal cycling. It delivers superior PCT performance with ultra-low water absorption, enabling stable operation under high temperature and high humidity working conditions. With excellent mechanical strength and thermal stability, it adapts to complex multi-layer pressing and high-precision processing requirements of high-density PCBs.

8. S1000-2M Datasheet

Items	Condition	Unit	Spec Requirement	Typical Value
Tg	DMA	℃	≥ 180	185
Flammability	C-48/23/50, E-24/125	Rating	V-0	V-0
Volume Resistivity	After moisture resistance	MΩ-cm	≥ 10⁶	6.79×10⁷
Volume Resistivity	E-24/125	MΩ-cm	≥ 10³	2.19×10⁸
Surface Resistivity	After moisture resistance	MΩ	≥ 10⁴	3.16×10⁶
Surface Resistivity	E-24/125	MΩ	≥ 10³	2.24×10⁷
Arc Resistance	D-48/50+D-0.5/23	S	≥60	133
Dielectric Breakdown	D-48/50+D-0.5/23	kV	≥40	45kV+NB
Dielectric Constant @ 1GHz	C-24/23/50	—	—	4.6
Dielectric Constant @ 1MHz	C-24/23/50	—	≤5.4	4.9
Dissipation Factor @ 1GHz	C-24/23/50	—	—	0.018
Dissipation Factor @ 1MHz	C-24/23/50	—	≤0.035	0.015
Thermal Stress	288℃, solder dip	—	>10s, No Delamination	>100s, No Delamination
Peel Strength (1 Oz)	288℃/10s	N/mm	≥ 1.05	1.3
Flexural Strength (LW)	—	MPa	≥415	567
Flexural Strength (CW)	—	MPa	≥345	442
Water Absorption	D-24/23	%	≤0.5	0.08
CTE(Z-axis) Before Tg	—	PPM/℃	≤60	41
CTE(Z-axis) After Tg	—	PPM/℃	≤300	208
Z-axis Thermal Expansion 50–260℃	—	%	≤3.0	2.4
Td (5% weight loss)	—	℃	≥340	355
T260 (TMA)	—	min	≥30	60
T288 (TMA)	—	min	≥5	30
T300 (TMA)	—	min	≥2	15
CTI	IEC60112 Method	V	PLC3(175~250)	PLC3 (200V)

9. S1000-2M Application Fields

S1000-2M is widely utilized in high-layer-count, high-reliability PCB products. It is extensively applied in high-end computing equipment, communication infrastructure devices, automotive electronic systems and other precision electronic fields. Its outstanding thermal stability and structural reliability make it an ideal core dielectric material for hybrid high-frequency multi-layer PCBs, effectively complementing the high-frequency performance of RO4003C materials and improving the overall yield and service life of finished circuit boards.

10. Summary

This 8-layer 1.6mm hybrid PCB adopts a premium combination of RO4003C high-frequency ceramic hydrocarbon material and S1000-2M high-reliability FR-4 material, integrating the high-frequency signal advantages of Rogers substrates and the structural stability of high-performance FR-4 materials. With a scientific mixed stackup design, positive-negative hybrid copper thickness configuration, immersion gold surface treatment, and precision blind hole and multi-specification resin plug hole processes, RO4003C hybrid PCB achieves excellent signal integrity, structural firmness and environmental adaptability. RO4003C and S1000-2M PCB supports high-frequency broadband signal transmission and high-temperature and high-humidity working environments, perfectly meeting the manufacturing standards and application demands of RF communication, automotive electronics and high-precision computing equipment in European and American markets.

Tags: RO4003C Hybrid PCB, Rogers 8-layer 1.6mm PCB, S1000-2M FR4 PCB, Immersion Gold PCB, RO4003C High Frequency PCB, RO4003C and S1000-2M PCB, Rogers RO4003C Multilayer PCB, Automotive Electronic PCB, High Layer Count PCB