Rogers TC350 High Frequency Circuit Materials Introduction Greetings, everyone! Welcome back to my channel. Today, I'm excited to discuss another type of RF laminates specifically designed for heat management: Rogers TC350 laminate. Rogers TC350 laminates are advanced printed circuit board substrates, consisting of a combination of PTFE, highly thermally conductive ceramic fillers, and woven glass reinforcement. The primary advantage of TC350 is its exceptional thermal conductivity, which greatly enhances heat transfer and effectively reduces both dielectric and insertion loss. This leads to higher gains and efficiencies in amplifiers and antennas. TC350 PCB substrate excels at handling higher power by virtue of its superior thermal conductivity, which counts as one of its key benefits. By efficiently managing heat, it minimizes the occurrence of hot spots and improves overall device reliability. In designs with limited thermal management capabilities, TC350 laminates excel by enhancing heat transfer within the board. This, in turn, reduces junction temperatures and extends the lifespan of active components. Such attributes are crucial for ensuring the reliability of power amplifiers, increasing Mean Time Between Failures (MTBF), and minimizing warranty costs. Furthermore, TC350 high-frequency circuit materials operate at lower temperatures and exhibit matching thermal expansion characteristics with chips. This compatibility greatly enhances the reliability of component attachment, mitigating issues like solder fatigue and joint failure. Data Sheet In this section, we will delve into the typical properties of TC350, providing valuable insights into its electrical, thermal, mechanical, and physical attributes. Let's explore the key features of this remarkable laminate. Electrical Properties: Rogers TC350 high frequency material boasts impressive electrical properties that make it an excellent choice for various applications. Some noteworthy features include: Dielectric Constant: At 1 MHz: TC350 exhibits a dielectric constant of 3.50 (IPC TM-650 2.5.5.3). At 1.8 GHz: The dielectric constant remains consistent at 3.50 (Resonant Cavity). At 10 GHz: TC350 maintains a dielectric constant of 3.50 (IPC TM-650 2.5.5.5). Dissipation Factor: At 1 MHz: TC350 demonstrates a low dissipation factor of 0.0015 (IPC TM-650 2.5.5.3). At 1.8 GHz: The dissipation factor is impressively low at 0.0018 (Resonant Cavity). At 10 GHz: TC350 maintains a low dissipation factor of 0.0020 (IPC TM-650 2.5.5.5). Temperature Coefficient of Dielectric: TC350 Laminate exhibits a temperature coefficient of dielectric of -9 ppm/oC at 10 GHz over a temperature range of -40 to 150°C (IPC TM-650 2.5.5.5). Volume Resistivity: TC350 showcases a volume resistivity of 7.4x10^6 MΩ-cm (C96/35/90, IPC TM-650 2.5.17.1). At E24/125, the volume resistivity is even higher, measuring 1.4x10^8 MΩ-cm. Surface Resistivity: The surface resistivity of TC350 is 3.2x10^7 MΩ (C96/35/90, IPC TM-650 2.5.17.1). At E24/125, the surface resistivity reaches 4.3x10^8 MΩ (IPC TM-650 2.5.17.1). Electrical Strength: TC350 demonstrates an electrical strength of 780 Volts/mil (31 kV/mm) (IPC TM-650 2.5.6.2). Dielectric Breakdown: The dielectric breakdown voltage of TC350 is 40 kV (IPC TM-650 2.5.6). Arc Resistance: TC350 exhibits an arc resistance of over 240 seconds (IPC TM-650 2.5.1). Thermal Properties: TC350 excels in thermal performance, providing enhanced reliability in demanding environments. Notable thermal properties include: Decomposition Temperature (Td): Initial: TC350 has an initial decomposition temperature of 520°C (IPC TM-650 2.4.24.6). 5%: The decomposition temperature reaches 567°C (IPC TM-650 2.4.24.6). Thermal Endurance: TC350 demonstrates excellent thermal endurance, with minimum T260, T288, and T300 values exceeding 60 minutes (IPC TM-650 2.4.24.1). Thermal Expansion: The thermal expansion coefficient (CTE) of TC350 is 7 ppm/oC (x,y) and 23 ppm/oC (z) in the temperature range of 50-150oC (IPC TM-650 2.4.41, 2.4.24). The z-axis expansion from 50 to 260oC is 1.2% (IPC TM-650 2.4.24). Mechanical Properties: TC350 offers robust mechanical properties, ensuring structural integrity and reliability. Key mechanical characteristics include: Peel Strength to Copper: After Thermal Stress: TC350 exhibits a peel strength of 7 lb/in (1.2 N/mm) (IPC TM-650 2.4.8). At Elevated Temperatures (150oC): The peel strength reaches 9 lb/in (1.6 N/mm) (IPC TM-650 2.4.8.2). After Process Solutions: The peel strength remains at 7 lb/in (1.2 N/mm) (IPC TM-650 2.4.8). Flexural Strength: TC350 demonstrates a flexural strength of 14 kpsi (97 MPa) (Machine direction) and 10 kpsi (69 MPa) (Crossdirection) (IPC TM-650 2.4.4). Tensile Strength: The tensile strength of TC350 is 11 kpsi (76 MPa) (Machine direction) and 8 kpsi (55 MPa) (Cross direction) (IPC TM-650 2.4.18.3). Water Absorption: TC350 has a low water absorption rate of 0.05% (IPC TM-650 2.6.2.1). Density: At ambient temperature (23oC), TC350 exhibits a density of 2.30 g/cm^3 (ASTM D792 Method A). Thermal Conductivity: TC350 demonstrates a thermal conductivity of 0.72 W/mK (ASTM D5470). Specific Heat: The specific heat of TC350 is 0.90 J/gK (ASTM D5470). Flammability: TC350 is classified as V-0 according to the UL-94 flammability standard. NASA Outgassing: Under NASA testing conditions at 125oC, TC350 exhibits minimal outgassing: Total Mass Loss: 0.02% (NASA SP-R-0022A). Collected Volatiles: 0.01% (NASA SP-R-0022A). Water Vapor Recovered: 0.01% (NASA SP-R-0022A). Typical Properties:TC350 Property Units Value Test Merthod 1. Electrical Properties Dielectric Constant (may vary by thickness) @1 MHz － 3.50 IPC TM-650 2.5.5.3 @1.8 GHz － 3.50 RESONANT CAVITY @10 GHz － 3.50 IPC TM-650 2.5.5.5 Dissipation Factor @1 MHz － 0.0015 IPC TM-650 2.5.5.3 @1.8 GHz － 0.0018 RESONANT CAVITY @10 GHz － 0.0020 IPC TM-650 2.5.5.5 Temperature Coefficient of Dielectric － TC r @ 10 GHz (-40-150°C) ppm/ºC -9 IPC TM-650 2.5.5.5 Volume Resistivity C96/35/90 MΩ-cm 7.4x106 IPC TM-650 2.5.17.1 E24/125 MΩ-cm 1.4x108 Surface Resistivity C96/35/90 MΩ 3.2x107 IPC TM-650 2.5.17.1 E24/125 MΩ 4.3x108 IPC TM-650 2.5.17.1 Electrical Strength Volts/mil (kV/mm) 780 (31) IPC TM-650 2.5.6.2 Dielectric Breakdown kV 40 IPC TM-650 2.5.6 Arc Resistance sec >240 IPC TM-650 2.5.1 2.Thermal Properties Decomposition Temperature (Td) Initial °C 520 IPC TM-650 2.4.24.6 5% °C 567 IPC TM-650 2.4.24.6 T260 min >60 IPC TM-650 2.4.24.1 T288 min >60 IPC TM-650 2.4.24.1 T300 min >60 IPC TM-650 2.4.24.1 Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 7, 7 IPC TM-650 2.4.41 Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 23 IPC TM-650 2.4.24 % z-axis Expansion (50-260ºC) % 1.2 IPC TM-650 2.4.24 3. Mechanical Properties Peel Strength to Copper (1 oz/35 micron) After Thermal Stress lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8 At Elevated Temperatures (150ºC) lb/in (N/mm) 9 (1.6) IPC TM-650 2.4.8.2 After Process Solutions lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8 Young’s Modulus kpsi (MPa) IPC TM-650 2.4.18.3 Flexural Strength (Machine/Cross) kpsi (MPa) 14/10 (97/69) IPC TM-650 2.4.4 Tensile Strength (Machine/Cross) kpsi (MPa) 11/8 (76/55) IPC TM-650 2.4.18.3 Compressive Modulus kpsi (MPa) ASTM D-3410 Poisson’s Ratio － ASTM D-3039 4. Physical Properties Water Absorption % 0.05 IPC TM-650 2.6.2.1 Density, ambient 23ºC g/cm3 2.30 ASTM D792 Method A Thermal Conductivity W/mK 0.72 ASTM D5470 Specific Heat J/gK 0.90 ASTM D5470 Flammability class V-0 UL-94 NASA Outgassing, 125ºC, ≤10- 6 torr Total Mass Loss % 0.02 NASA SP-R-0022A Collected Volatiles % 0.01 NASA SP-R-0022A Water Vapor Recovered % 0.01 NASA SP-R-0022A A Laminate and Applicatoins The image presented below displays Rogers TC350 substrates. Rogers TC350 PCB substrates are highly sought after for applications that require efficient heat dissipation.TC350 RF PCB materials are commonly utilized in various devices, including power amplifiers, backhaul radios, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), thermally cycled antennas, microwave combiners, power dividers, and many more. TC350 high-frequency laminates are specifically engineered to facilitate fast and effective heat transfer, ensuring optimal performance in heat-intensive environments.
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