Home - Low DK 3.0-3.9 Substrates - Taconic RF-35TC High Frequency PCB Material

 

 

Taconic RF-35TC High Frequency PCB Material

 

 

Introduction

 

Hello everyone. Welcome back to our channel. Today, we’re going to introduce the thermally conductive low loss material ---- RF-35TC laminate.

 

Taconic RF-35TC is a PTFE based, ceramic filled fiberglass laminate, which will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor.

 

Taconic RF-35TC laminate provides low dissipation factor with high thermal conductivity. The heat is diffused away from both transmission lines and surface mount components such as capacitors etc.

 

 

RF-35 Typical Properties

 

First, let's talk about the dielectric properties of the RF-35TC. The DK at 10 GHz is 3.5 which is a low value in most high frequency laminates. The DK is stable across a broad temperature range which is critical for both narrow band and broad band overlay couplers. Furthermore, the TCDk value remains consistent at 24 ppm across a wide temperature range from -30 to 120℃, ensuring stable performance.

 

Moving on to the RF-35TC's electrical properties, we have a low Df value of 0.0011 at 10 GHz, indicating minimal signal loss and high signal integrity, whereas RT/duroid 6035HTC is 0.0013, TC600 is 0.0017 and TC350 is 0.002. The dielectric breakdown and dielectric strength are impressive, measuring at 56.7 kV and 570 V/mil (22,441 V/mm) respectively.

 

Taconic RF-35TC high frequency material exhibits exceptional arc resistance, surpassing industry standards with an impressive duration of 304 seconds, as determined by IPC-650 2.5.1.Dielectric breakdown is 56.7 kilo voltages, dielectric strength is 570 V/mil. These are secure value for our electronics devices.

 

 

With a moisture absorption rate of a mere 0.05%, Taconic RF-35TC material showcases outstanding resistance to absorbing moisture, complying with the stringent IPC-650 2.6.2.1 standard. This ensures its reliability and stability even in environments with high humidity or exposure to moisture.

 

 

Let's now discuss the mechanical properties of the RF-35TC laminate. It exhibits excellent flexural strength, with values of 12,900 psi (88.94 N/mm2) in the MD direction and 11,700 psi (80.67 N/mm2) in the CD direction. Similarly, the tensile strength measures at 9,020 psi (62.19 N/mm2) and 7,740 psi (53.37 N/mm2) in the MD and CD directions respectively.

 

 

Taconic RF-35TC also demonstrates good elongation at break, with 1.89% (1.89 N/mm) in the MD direction and 1.7% in the CD direction. Additionally, it has a high Young's modulus, measuring at 667,000 psi (4,599 N/mm2) and 637,000 psi (4,392 N/mm2) in the MD and CD directions respectively.

 

 

Now, let's move on to the RF-35TC's thermal properties. It exhibits excellent thermal conductivity, with values of 0.6 W/(mK) at 125℃ for both the unclad condition and the C1/C1 configuration. The CH/CH configuration has a slightly lower thermal conductivity of 0.87 W/(mK) at the same temperature. The extremely low Df and high thermal conductivity are particularly suited for power amplifier applications.

 

 

Another important property to consider is the material's dimensional stability. Taconic RF-35TC copper clad laminate shows minimal dimensional changes, with values of 0.23 mils/in. (0.23 mm/M) and 0.64 mils/in. (0.64 mm/M) in the MD and CD directions, respectively, after etching. Under thermal stress, the changes are even smaller, with -0.04 mils/in. (-0.04 mm/M) in the MD direction and 0.46 mils/in. (0.46 mm/M) in the CD direction.

 

 

In terms of electrical properties, Taconic RF-35TC maintains good surface resistivity after elevated temperature and humidity, measuring at 8.33 x 10^7 Mohms and 6.42 x 10^7 Mohms, respectively. Similarly, it maintains good volume resistivity under the same conditions, measuring at 5.19 x 10^8 Mohms/cm and 2.91 x 10^8 Mohms/cm, respectively.

 

Now let's quickly cover a few more properties. The RF-35TC has a low coefficient of thermal expansion (CTE) in all three axes, measuring at 11 and 13 ppm/℃ in the X and Y axes, and 34 ppm/℃ in the Z axis. Low X and Y CTE values are crucial for maintaining critical distances between trace elements in printed filters,enhancing antenna gains and efficiencies.

 

The density is 2.35 g/cm3, and the material has a hardness of 79.1 (ASTM D 2240, Shore D).

 

Lastly, the RF-35TC exhibits a specific heat of 0.94 j/(g℃) and has a thermal decomposition temperature (Td) of 420℃ (788°F) for a 2% weight loss and 436℃ (817°F) for a 5% weight loss.

 

Property

Test Method

Unit

RF-35TC

Unit

RF-35TC

DK at 10 GHz

IPC-650 2.5.5.5.1(modified)

 

3.5

 

3.5

Tck(-30 to 120℃

IPC-650 2.5.5.5.1(modified)

ppm

24

ppm

24

Df at 10 GHz

IPC-650 2.5.5.5.1(modified)

 

0.0011

 

0.0011

Dielectric Breakdown

IPC-650 2.5.6(in-Plane,Two Pins in Oil)

kV

56.7

kV

56.7

Dielectric Strength

ASTM D 149(Through Plane)

V/mil

570

V/mm

22,441

Arc Resistance

IPC-650 2.5.1

Seconds

304

Seconds

304

Moisture Absorption

IPC-650 2.6.2.1

%

0.05

%

0.05

Flexural Strength(MD)

ASTM D 790/IPC-650 2.4.4

psi

12,900

N/mm2

88.94

Flexural Strength(CD)

ASTM D 790/IPC-650 2.4.4

psi

11,700

N/mm2

80.67

Tensile Strength(MD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

9,020

N/mm2

62.19

Tensile Strength(CD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

7,740

N/mm2

53.37

Elongation at Break(MD)

ASTM D 3039/IPC-TM-650 2.4.19

%

1.89

N/mm

1.89

Elongation at Break(CD)

ASTM D 3039/IPC-TM-650 2.4.19

%

1.7

%

1.7

Young's Modulus(MD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

667,000

N/mm2

4,599

Young's Modulus(CD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

637,000

N/mm2

4,392

Poisson's Ratio(MD)

ASTM D 3039/IPC-TM-650 2.4.19

 

0.18

 

0.18

Poisson's Ratio(CD)

ASTM D 3039/IPC-TM-650 2.4.19

 

0.23

 

0.18

Compressive Modulus

ASTM D 695(23℃)

psi

560,000

N/mm2

3,861

Flexural Strength(MD)

ASTM D 790/IPC-650 2.4.4

psi

1.46 x 106

N/mm2

10,309

Flexural Strength(CD)

ASTM D 790/IPC-650 2.4.4

psi

1.50 x 106

N/mm2

10,076

Peel Stength(½ oz.CVH)

IPC-650 2.4.8(Thermal Stress.)

Ibs./inch

7

g/cm3

1.25

Thermal Conductivity(Unclad,125℃)

ASTM F433(Guarded Heat Flow)

W/(mK)

0.6

W/(mK)

0.6

Thermal Conductivity(C1/C1,125℃)

ASTM F433(Guarded Heat Flow)

W/(mK)

0.92

W/(mK)

0.92

Thermal Conductivity(CH/CH,125℃)

ASTM F433(Guarded Heat Flow)

W/(mK)

0.87

W/(mK)

0.87

Dimensional Stability(MD)

IPC-650-2.4.39 Sec.5.4(After Etch)

mils/in.

0.23

mm/M

0.23

Dimensional Stability(CD)

IPC-650-2.4.39 Sec.5.4(After Etch)

mils/in.

0.64

mm/M

0.64

Dimensional Stability(MD)

IPC-650-2.4.39 Sec.5.5(Thermal Stress.)

mils/in.

-0.04

mm/M

-0.04

Dimensional Stability(CD)

IPC-650-2.4.39 Sec.5.5(Thermal Stress.)

mils/in.

0.46

mm/M

0.46

Surface Resistivity

IPC-650 2.5.17.1(after elevated temp.)

Mohms

8.33 x 107

Mohms

8.33 x 107

Surface Resistivity

IPC-650 2.5.17.1(after humidity)

Mohms

6.42 x 107

Mohms

6.42 x 107

Volume Resistivity

IPC-650 2.5.17.1(after elevated temp.)

Mohms/cm

5.19 x 108

Mohms/cm

5.19 x 108

Volume Resistivity

IPC-650 2.5.17.1(after humidity)

Mohms/cm

2.91 x 108

Mohms/cm

2.91 x 108

CTE(X axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

11

ppm/℃

11

CTE(Y axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

13

ppm/℃

13

CTE(Z axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

34

ppm/℃

34

Density

ASTM D 792

g/cm3

2.35

g/cm3

2.35

Hardness

ASTM D 2240(Shore D)

 

79.1

 

79.1

Strain at Break(MD)

ASTM D 790/IPC-650 2.4.4

%

0.014

%

0.014

Strain at Break(CD)

ASTM D 790/IPC-650 2.4.4

%

0.013

%

0.013

Specific Heat

ASTM E 1269-05,E 967-08,E968-02

j/(g℃)

0.94

j/(g℃)

0.94

Td(2% Weight Loss)

IPC-650 2.4.24.6/TGA

oF

788

420

Td(5% Weight Loss)

IPC-650 2.4.24.6/TGA

oF

817

436

 

 

A Piece of RF-35TC Laminate

 

On the screen is a RF-35TC laminate.

 

We can also see the applications in filters, couplers, antennas, power amplifiers and satellite equipment etc.

 

 

 

Conclusion

 

Like most material properties, there are many techniques for measuring thermal conductivity. Thermal conductivity measured on an unclad laminate offers the true thermal conductivity of the material. Measurements on a copper clad laminate (CCL) typically yield higher values as the CCL offers the least thermal resistance at the interface between the laminate and measuring equipment. When measured with or without copper cladding, RF-35TC offers superior heat dissipation performance.

 

Well, this conclude today’s episode. Thank you for reading. See you next time.