Rogers RO4535 High Frequency PCB Material Introduction RO4535 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. Rogers RO4535 high frequency circuit material has a dielectric constant of 3.44 and a loss tangent (Df) of 0.0037 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications Rogers RO4535 is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4535 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna. Features and Benefits 1. Low Loss 0.0037 , Low Dk 3.44, low PIM response: Wide range of application use 2. Thermoset resin system: Compatible with standard PCB fabrication 3. Excellent dimensional stability: Greater yield on larger panels sizes 4. Uniform mechanical properties: Maintains mechanical form during handling 5. High thermal conductivity: Improved power handling Typical Applications: 1. Cellular infrastructure base station antennas 2. WiMAX antenna networks Typical Value of RO4535 Property RO4535 Direction Units Condition Test Method Dielectric Constant, er Process 3.44 ± 0.08 Z - 10 GHz/23℃ 2.5 GHz IPC-TM-650,2.5.5.5 Dissipation Factor 0.0032 Z - 2.5 GHz/23℃ IPC-TM-650, 2.5.5.5 0.0037 10 GHz/23℃ PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2 Dimensional Stability <0.5 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A Coefficient of Thermal Expansion 16 X ppm/℃ -55 to 288℃ IPC-TM-650, 2.4.41 17 Y 50 Z Thermal Conductivity 0.6 - W/(m.K) 80℃ ASTM C518 Moisture Absorption 0.09 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570 Tg >280 - ℃ TMA A IPC-TM-650, 2.4.24.3 Density 1.9 - gm/cm3 - ASTM D792 Copper Peel Strength 5.1? （0.9） - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8 Flammability V-0 - - - UL 94 Lead-Free Process Compatible Yes - - - - .jpg)
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