Rogers R04534 High Frequency PCB Material Introduction Rogers RO4534 high frequency laminates are ceramic-filled, glass-reinforced hydrocarbon based material which are cost/performance materials, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.4 and a loss tangent (Df) of 0.0027 measured at 10GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, Rogers RO4534 PCB materials provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications. It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4534 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna. Features and Benefits 1. Low Loss 0.0027, Low Dk 3.4, low PIM response: Wide range of application use 2. Thermoset resin system: Compatible with standard PCB fabrication 3. Excellent dimensional stability: ?Greater yield on larger panels sizes 4. Uniform mechanical properties: Maintains mechanical form during handling 5. High thermal conductivity: Improved power handling Typical Applications: 1. Cellular infrastructure base station antennas 2. WiMAX antenna networks Typical Value of RO4534 Property RO4534 Direction Units Condition Test Method Dielectric Constant, er Process 3.4 ± 0.08 Z - 10 GHz/23℃?2.5 GHz IPC-TM-650,2.5.5.5 Dissipation Factor 0.0022 Z - 2.5 GHz/23℃ IPC-TM-650, 2.5.5.5 0.0027 10 GHz/23℃ PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2 Dimensional Stability <0.3 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A Coefficient of Thermal Expansion 11 X ppm/℃ -55 to 288℃ IPC-TM-650, 2.4.41 14 Y 46 Z Thermal Conductivity 0.6 - W/(m.K) 80℃ ASTM C518 Moisture Absorption 0.06 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570 Tg >280 - ℃?TMA A IPC-TM-650, 2.4.24.3 Density 1.8 - gm/cm3 - ASTM D792 Copper Peel Strength 6.3 （1.1） - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8 Flammability NON FR - - - UL 94 Lead-Free Process Compatible Yes - - - - Conclusion Rogers RO4534 high frequency laminates are cost-effective ceramic-filled, glass-reinforced hydrocarbon materials tailored for antenna market applications. With a dielectric constant of 3.4 and a loss tangent of 0.0027 at 10GHz, RO4534 PCB material minimizes signal loss and delivers outstanding passive intermodulation performance, ideal for mobile infrastructure microstrip antennas. Featuring X and Y axis CTE consistent with copper to lower PCB stress, it serves as an economical alternative to traditional PTFE antenna materials, balancing excellent performance and favorable costs for antenna design optimization..jpg)
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