Rogers RO4350B High Frequency PCB Substrates Introduction Hello Everyone, Today, we’re going to talk about Rogers RO4350B laminates. Rogers RO4350B PCB materials are a proprietary blend of woven glass reinforced hydrocarbon/ceramics. Rogers 4350B laminates offer electrical performance that closely resembles PTFE/woven glass, while also providing the manufacturability advantages of epoxy/glass. Rogers RO4350B high-frequency circuit materials offer precise control over the dielectric constant (Dk) and maintain low loss characteristics. They can be processed using the same methods as standard epoxy/glass laminates. Rogers 4350 circuit boards are available at a significantly lower cost compared to traditional microwave laminates, making them more cost-effective. A notable advantage of 4350B laminates is that they eliminate the need for special through-hole treatments or handling procedures typically required for PTFE-based materials. This simplifies the manufacturing process and reduces associated costs and complexity. Additionally, Rogers 4350B PCB substrates have obtained a UL 94 V-0 rating, ensuring their suitability for applications involving active devices and high-power RF designs. This rating signifies their compliance with stringent safety standards. Data sheets Rogers RO4350B is a high-performance substrate widely used in the field of electronics and telecommunications. With its exceptional electrical and mechanical properties, RO4350B has become a popular choice for various applications. This paragraph provides a comprehensive overview of the typical values associated with RO4350B, shedding light on its key characteristics and performance metrics. Dielectric Constant: A Crucial Parameter The dielectric constant, represented by ε, is an essential property of RO4350B. The process dielectric constant (εProcess) is measured at 3.48±0.05, ensuring reliable signal transmission. Additionally, the design dielectric constant (εDesign) is determined to be 3.66, making RO4350B suitable for a wide frequency range of 8 to 40 GHz. These values were obtained using the IPC-TM-650 2.5.5.5 Clamped Stripline test method for εProcess and the Differential Phase Length Method for εDesign. Dissipation Factor: Minimizing Signal Loss Rogers RO4350B laminate exhibits a low dissipation factor, indicating minimal signal loss during transmission. At 10 GHz/23℃, the dissipation factor (tan,δ) is measured to be 0.0037, while at 2.5 GHz/23℃, it is found to be 0.0031. These values were determined using the IPC-TM-650 2.5.5.5 test method, highlighting the excellent performance of RO4350B in maintaining signal integrity. Thermal Coefficient of Dielectric Constant: Stability Across Temperature Variations One of the notable features of RO4350B is its stability across temperature variations. The thermal coefficient of the dielectric constant (+50 ppm/℃) ensures that the material maintains its electrical properties even in extreme temperature conditions ranging from -50℃ to 150℃. The measurement was carried out using the IPC-TM-650 2.5.5.5 test method, providing valuable insights into the material's behavior under varying thermal conditions. Electrical and Mechanical Strength: Robust Performance RO4350B demonstrates remarkable electrical and mechanical strength, making it suitable for demanding applications. The volume resistivity is measured at 1.2 x 10^10 MΩ.cm (COND A), ensuring excellent insulation properties. The surface resistivity is determined to be 5.7 x 10^9 MΩ (COND A), further enhancing its electrical performance. Additionally, the material exhibits an impressive electrical strength of 31.2 kV/mm (780 v/mil) at a thickness of 0.51mm (0.020"), as per the IPC-TM-650 2.5.6.2 test method. Mechanical properties are equally important, and RO4350B excels in this regard as well. The tensile modulus is measured at 16,767 MPa (2,432 ksi) in the X-direction and 14,153 MPa (2,053 ksi) in the Y-direction, as per the ASTM D 638 test method. The material demonstrates good tensile strength, with values of 203 MPa (29.5 ksi) in the X-direction and 130 MPa (18.9 ksi) in the Y-direction. Additionally, the flexural strength is determined to be 255 MPa (37 kpsi) using the IPC-TM-650 2.4.4 test method. Dimensional Stability and Thermal Expansion: Precision and Reliability RO4350B exhibits exceptional dimensional stability, ensuring precise and reliable performance. The material showcases dimensional stability of less than 0.5 mm/m (mil/inch) after etching and exposure to E2/150℃, as determined by the IPC-TM-650 2.4.39A test method. Moreover, the coefficient of thermal expansion is measured at 10 ppm/℃ (X-direction), 12 ppm/℃ (Y-direction), and 32 ppm/℃ (Z-direction) across a wide temperature range of -55℃ to 288℃, as per the IPC-TM-650 2.4.41 test method. Additional Properties: Versatility and Compatibility RO4350B material offers several additional properties that enhance its versatility and applicability. With a glass transition temperature (Tg) exceeding 280℃ (TMA), the material remains stable even at high temperatures. The decomposition temperature (Td) is measured at 390℃ (TGA), indicating superior thermal stability. Furthermore, RO4350B demonstrates a thermal conductivity of 0.69 W/M/oK at 80℃, as per the ASTM C518 test method. The material's moisture absorption is minimal, with a value of 0.06% after 48 hours of immersionat 50℃. It boasts a density of 1.86 gm/cm3 at 23℃, contributing to its lightweight nature. Additionally, RO4350B exhibits a copper peel strength of 0.88 N/mm (5.0 pli) after solder float with 1 oz. EDC Foil, ensuring reliable bonding in electronic applications. It meets the UL 94 V-0 flammability rating, providing a high level of fire resistance. Moreover, RO4350B is compatible with lead-free processes, aligning with modern environmental regulations. RO4350B Typical Value Property RO4350B Direction Units Condition Test Method Dielectric Constant,εProcess 3.48±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline Dielectric Constant,εDesign 3.66 Z 8 to 40 GHz Differential Phase Length Method Dissipation Factortan,δ 0.0037 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5 Volume Resistivity 1.2 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1 Surface Resistivity 5.7 x109 MΩ COND A IPC-TM-650 2.5.17.1 Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2 Tensile Modulus 16,767(2,432) X MPa(ksi) RT ASTM D 638 Tensile Strength 203(29.5) X MPa(ksi) RT ASTM D 638 Flexural Strength 255 MPa IPC-TM-650 2.4.4 Dimensional Stability <0.5 X,Y mm/m after etch+E2/150℃ IPC-TM-650 2.4.39A Coefficient of Thermal Expansion 10 X ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41 Tg >280 ℃?TMA A IPC-TM-650 2.4.24.3 Td 390 ℃?TGA ASTM D 3850 Thermal Conductivity 0.69 W/M/oK 80℃ ASTM C518 Moisture Absorption 0.06 % 48hrs immersion 0.060" ASTM D 570 Density 1.86 gm/cm3 23℃ ASTM D 792 Copper Peel Stength 0.88 N/mm after solder float 1 oz. IPC-TM-650 2.4.8 Flammability V-0 UL 94 Lead-free Process Compatible Yes A piece of RO4350B Laminate On the screen, we have observed a RO4350B laminate . Rogers 4350B PCB substrate is specially designed for microwave power amplifier applications. Applications Rogers RO4350B high frequency laminates find extensive application in various industries. Some typical applications include: - Cellular Base Station Antennas and Power Amplifiers - RF Identification Tags - Automotive Radar and Sensors - LNB's for Direct Broadcast Satellites
0.0031
2.5 GHz/23℃
14,153(2,053)
Y
130(18.9)
Y
(37)
(kpsi)
(mil/inch)
12
32
Y
Z
sample Temperature 50℃
(5.0)
(pli)
EDC Foil
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