Rogers R03035 High Frequency PCB Material Introduction Greetings, everyone, In today's discussion, we will be focusing on Rogers RO3035 substrates. Rogers RO3035 laminates are circuit materials with a base of PTFE (polytetrafluoroethylene) filled with ceramics. Rogers RO3035 high frequency materials are specifically designed for commercial microwave and RF applications. They offer outstanding electrical and mechanical stability while maintaining competitive pricing. The consistent mechanical properties of RO3035 laminates allow designers to create multilayer board designs for individual layers without facing issues like warping or reliability concerns. As a result, RO3035 laminates provide effective design solutions for applications such as 5G, millimeter wave sub 6GHz, and massive MiMo (Multiple-Input Multiple-Output) technologies. Data sheet Rogers RO3035 is a high-performance material with various electrical, thermal, mechanical, and physical properties. Let's explore its characteristics in detail. Starting with the electrical properties, the dielectric constant of RO3035 during the manufacturing process is 3.50 ± 0.05 in the Z direction, measured at 10 GHz and 23℃ using the IPC-TM-650 2.5.5.5 Clamped Stripline test method. For design purposes, the dielectric constant is 3.6 in the Z direction, covering a frequency range of 8 GHz to 40 GHz, determined using the Differential Phase Length Method. The dissipation factor, also known as tan delta, is 0.0015 in the Z direction at 10 GHz and 23℃, as per the IPC-TM-650 2.5.5.5 test method. The thermal coefficient of the dielectric constant is -45 ppm/℃ in the Z direction, measured from 10 GHz and a temperature range of -50℃ to 150℃ using the IPC-TM-650 2.5.5.5 standard. Moving to the electrical resistivity, the volume resistivity of RO3035 is 10^7 MΩ.cm, and the surface resistivity is also 10^7 MΩ, both under COND A conditions, following the IPC 2.5.17.1 test method. In terms of thermal properties, RO3035 exhibits a decomposition temperature (Td) of 500℃, determined through thermogravimetric analysis (TGA) according to the ASTM D 3850 standard. The material has a coefficient of thermal expansion ranging from 17 ppm/℃ to 24 ppm/℃ in the X, Y, and Z directions, covering a temperature range of -55℃ to 288℃, measured at 23℃ and 50% relative humidity using the IPC-TM-650 2.4.4.1 test method. The thermal conductivity of RO3035 is 0.5 W/M/K at 50℃, tested as per ASTM D 5470. Moving on to the mechanical properties, the copper peel strength is 10.2 Ib/in., tested with a 1oz copper layer after solder float according to the IPC-TM 2.4.8 standard. The Young's modulus, a measure of stiffness, is reported as 1025 MPa and 1006 MPa at 23℃, determined using the ASTM D 638 standard. Considering dimensional stability, RO3035 exhibits a range of -0.11 mm/m to 0.11 mm/m in the MD (Machine Direction) and CMD (Cross-Machine Direction), respectively, under Condition A, as determined by the IPC TM-650 2.2.4 test method. In terms of physical properties, RO3035 has a flammability rating of V-0, conforming to the UL 94 standard. The moisture absorption is reported as 0.04% as per the D48/50 test conducted according to the IPC-TM-650 2.6.2.1 standard. The density of RO3035 is 2.1 gm/cm3 at 23℃, measured using the ASTM D 792 standard. Lastly, RO3035 is compatible with lead-free processes, making it suitable for environmentally friendly manufacturing. RO3035 Typical Value Property RO3035 Direction Units Condition Test Method Electrical Properties Dielectric Constant,εProcess 3.50±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline Dielectric Constant,εDesign 3.6 Z 8GHz to 40 GHz Differential Phase Length Method Dissipation Factor,tanδ 0.0015 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Thermal Coefficient of ε -45 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5 Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1 Surface Resistivity 107 MΩ COND A IPC 2.5.17.1 Thermal Properties Td 500 ℃ TGA ASTM D 3850 Coefficient of Thermal Expansion 17 X ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1 Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470 Mechanical Properties Copper Peel Stength 10.2 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8 Young's Modulus 1025 MPa 23℃ ASTM D 638 Dimensional Stability (MD, CMD) -0.11 0.11 mm/m Condition A IPC TM-650 2.2.4 Physical Properties Flammability V-0 UL 94 Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1 Density 2.1 gm/cm3 23℃ ASTM D 792 Lead-free Process Compatible Yes Applications Rogers RO3035 PCB raw materials find widespread use in various applications due to their excellent electrical and thermal properties. Here are some typical applications where RO3035 are commonly utilized: - Automotive radar applications - Global positioning satellite antennas - Cellular telecommunications systems -power amplifiers and antennas - Patch antenna for wireless communications - Direct broadcast satellites - Datalink on cable systems - Remote meter readers - Power backplanes
(-55 to 288℃)
17
24
Y
Z
1006
.jpg)
Home