F4BTMS300 PCB Substrates

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F4BTMS300 PCB Substrates

Introduction

F4BTMS300 laminate is part of the F4BTMS series, an upgraded iteration of the F4BTM series that integrates significant technological advancements in material formulation and manufacturing processes. Based on the foundational performance of its predecessor, F4BTMS300 high frequency circuit material incorporates a small amount of ultra-thin and ultra-fine fiberglass cloth for reinforcement, combined with a substantial, uniform blend of special nanoceramics and polytetrafluoroethylene (PTFE) resin—modifications that minimize the fiberglass effect during electromagnetic wave propagation, reduce dielectric loss, and enhance dimensional stability. F4BTMS300 high-reliability material is engineered specifically for aerospace applications, boasting the capability to replace comparable foreign products while offering a broader range of dielectric constants thanks to its advanced material composition.

F4BTMS300 high frequency laminate exhibits reduced anisotropy across the X/Y/Z directions, enabling compatibility with higher operating frequencies, improved electrical strength, and enhanced thermal conductivity. F4BTMS300 RF PCB material also features an excellent low coefficient of thermal expansion and stable dielectric temperature characteristics, making it suitable for demanding high-frequency and high-temperature aerospace environments. As a standard offering, F4BTMS300 PCB material is paired with RTF low-roughness copper foil, which not only lowers conductor loss but also delivers exceptional peel strength, with flexible compatibility with copper-based or aluminum-based substrates.

Circuit boards fabricated with F4BTMS300 PCB substrates can be processed using standard PTFE board manufacturing techniques, leveraging the material’s superior mechanical and physical properties for multi-layer, high-layer-count, and backplane production. It also demonstrates excellent processability in dense hole drilling and fine line routing, ensuring adaptability to complex circuit design requirements. Additionally, F4BTMS300 laminate can be combined with buried 50Ω resistor copper foil to create resistor film substrates, expanding its application scope in specialized aerospace electronic systems.

Product Features

- Minimal dielectric constant tolerance and excellent batch-to-batch consistency.

- Extremely low dielectric loss.

- Stable dielectric constant and low loss within frequencies up to 40GHz, meeting the requirements of phase-sensitive applications.

- Excellent temperature coefficient of dielectric constant and dielectric loss, maintaining frequency and phase stability between -55°C and 150°C.

- Excellent resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation.

- Low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.

- Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliable hole copper connections.

- Improved thermal conductivity, suitable for high-power applications.

- Excellent dimensional stability.

- Low water absorption.

Models & Data Sheet

here are the technical parameters of the different product models:

Product Models: F4BTMS220 F4BTMS233 F4BTMS255 F4BTMS265 F4BTMS294 F4BTMS300 F4BTMS350 F4BTMS430 F4BTMS450 F4BTMS615 F4BTMS1000

Dielectric Constant (Typical): Test Conditions: 10 GHz Values: F4BTMS220: 2.2 F4BTMS233: 2.33 F4BTMS255: 2.55 F4BTMS265: 2.65 F4BTMS294: 2.94 F4BTMS300: 3.00 F4BTMS350: 3.50 F4BTMS430: 4.30 F4BTMS450: 4.50 F4BTMS615: 6.15 F4BTMS1000: 10.20

Dielectric Constant Tolerance: Values: F4BTMS220: +/-0.02; F4BTMS233: +/-0.03; F4BTMS255: +/-0.04; F4BTMS265: +/-0.04; F4BTMS294: +/-0.04; F4BTMS300: +/-0.04; F4BTMS350: +/-0.04; F4BTMS430: +/-0.05; F4BTMS450: +/-0.09; F4BTMS615: +/-0.09; F4BTMS1000: +/-0.12

Dielectric Constant (Design): Test Conditions: 10 GHz Values are the same as the "Dielectric Constant (Typical)" section.

Loss Tangent (Typical): Test Conditions: 10 GHz 20 GHz 40 GHz

Values: F4BTMS220: 10 GHz: 0.0009 20 GHz: 0.0010 40 GHz: 0.0013

F4BTMS233: 10 GHz: 0.0010 20 GHz: 0.0011 40 GHz: 0.0015

F4BTMS255: 10 GHz: 0.0012 20 GHz: 0.0013 40 GHz: 0.0016

F4BTMS265: 10 GHz: 0.0012 20 GHz: 0.0014 40 GHz: 0.0018

F4BTMS294: 10 GHz: 0.0012 20 GHz: 0.0014 40 GHz: 0.0018

F4BTMS300: 10 GHz: 0.0013 20 GHz: 0.0015 40 GHz: 0.0019

F4BTMS350: 10 GHz: 0.0016 20 GHz: 0.0019 40 GHz: 0.0024

F4BTMS450: 10 GHz: 0.0015 20 GHz: 0.0019 40 GHz: 0.0024

F4BTMS615: 10 GHz: 0.0020 20 GHz: 0.0023 40 GHz: /

F4BTMS1000: 10 GHz: 0.0020 20 GHz: 0.0023 40 GHz: /

Product Technical Parameters			Product Models & Data Sheet
Product Features	Test Conditions	Unit	F4BTMS220	F4BTMS233	F4BTMS255	F4BTMS265	F4BTMS294	F4BTMS300	F4BTMS350	F4BTMS430	F4BTMS450	F4BTMS615	F4BTMS1000
Dielectric Constant (Typical)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.00	3.50	4.30	4.50	6.15	10.20
Dielectric Constant Tolerance	/	/	±0.02	±0.03	±0.04	±0.04	±0.04	±0.04	±0.05	±0.09	±0.09	±0.12	±0.2
Dielectric Constant (Design)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.0	3.50	4.3	4.5	6.15	10.2
Loss Tangent (Typical)	10GHz	/	0.0009	0.0010	0.0012	0.0012	0.0012	0.0013	0.0016	0.0015	0.0015	0.0020	0.0020
	20GHz	/	0.0010	0.0011	0.0013	0.0014	0.0014	0.0015	0.0019	0.0019	0.0019	0.0023	0.0023
	40GHz	/	0.0013	0.0015	0.0016	0.0018	0.0018	0.0019	0.0024	0.0024	0.0024	/	/
Dielectric Constant Temperature Coefficient	-55 º~150ºC	PPM/℃	-130	-122	-92	-88	-20	-20	-39	-60	-58	-96	-320
Peel Strength	1 OZ RTF copper	N/mm	>2.4	>2.4	>1.8	>1.8	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2
Volume Resistivity	Standard Condition	MΩ.cm	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8

Surface Resistivity

Standard Condition

MΩ

≥1×10^8

Electrical Strength (Z direction)

5KW, 500V/s

KV/mm

>26

>30

>32

>34

>40

>42

>44

>45

>48

>23

Breakdown Voltage (XY direction)

5KW, 500V/s

>35

>38

>40

>42

>48

>52

>55

>52

>54

>55

>42

Coefficientof Thermal Expansion (X, Y direction)

-55 º~288ºC

ppm/ºC

40, 50

35, 40

15, 20

10, 12

10, 11

10, 12

13, 12

12, 12

10, 12

16, 18

Coefficientof Thermal Expansion (Z direction)

-55 º~288ºC

ppm/ºC

290

220

Thermal Stress

260℃, 10s, 3 times

No delamination

Water Absorption

20±2℃, 24 hours

0.02

0.025

0.02

0.025

0.03

0.08

0.1

0.03

Density

Room Temperature

g/cm3

2.18

2.22

2.26

2.25

2.28

2.3

2.51

2.53

2.75

3.2

Long-Term Operating Temperature

High-Low Temperature Chamber

℃

-55～+260

Thermal Conductivity

Z direction

W/(M.K)

0.26

0.28

0.31

0.36

0.58

0.6

0.63

0.64

0.67

0.81

Flammability

UL-94

V-0

Material Composition

PTFE, Ultra-thin and ultra-fine (quartz) fiberglass.

PTFE, Ultra-thin and ultra-fine fiberglass, ceramics.

A F4BTMS300 Laminate and Typical Applications:

Presented on the screen is an F4BTMS300 high-frequency PCB substrate.

F4BTMS300 laminates are extensively employed in various domains, including: Aerospace and aviation equipment, space installations, and cabin setups. Microwave and RF applications. Radar systems, particularly in military applications. Feed networks for signal distribution. Phase-sensitive antennas and phased array antennas. Satellite communications, and much more.

Final

(F4BTMS series aluminum-based/copper-based boards) This series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side is covered with an aluminum-based or copper-based layer. This configuration serves as shielding or heat dissipation.

The model numbers are F4BTMS***-AL or F4BTMS***-CU. For example, F4BTMS220-AL represents F4BTMS220 with aluminum-based substrate. F4BTMS294-CU represents F4BTMS294 with copper-based substrate.