F4BTM300 PCB Substrates Introduction F4BTM300 high frequency circuit material is manufactured through the precise formulation of fiberglass cloth, nano-ceramic fillers, and polytetrafluoroethylene resin, followed by stringent pressing processes. Based on the F4BM dielectric layer and enhanced with high-dielectric, low-loss nano-ceramics, F4BTM300 laminate achieves a higher dielectric constant, improved heat resistance, a lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining excellent low-loss characteristics. Product Differentiation F4BTM300 PCB material features electrodeposited (ED) copper foil, distinguishing it from the F4BTME series which uses reverse-treated (RTF) copper foil. This makes F4BTM300 suitable for applications without Passive Intermodulation (PIM) requirements, while the F4BTME variant is designed for applications demanding excellent PIM performance, more precise line control, and lower conductor loss. Features & Benefits - Low Dielectric constant (Dk) value is 3.0. - Addition of ceramics enhances the performance. - F4BTME300 exhibits excellent PIM performance - Comes in various thicknesses and sizes, offers cost savings - Commercialization, large-scale production, and high cost-effectiveness. - Radiation-resistant and low out-gassing properties Models & Data Sheet Here's a detailed narration of the technical parameters mentioned in the data sheet for F4BTM: Dielectric Constant (Typical): Test Conditions: Measured at 10GHz Unit: Dimensionless F4BTM298: 2.98 F4BTM300: 3.0 F4BTM320: 3.2 F4BTM350: 3.5 The dielectric constant represents the material's ability to store electrical energy when subjected to an electric field. Dielectric Constant Tolerance: F4BTM298: ±0.06 F4BTM300: ±0.06 F4BTM320: ±0.06 F4BTM350: ±0.07 This parameter indicates the acceptable range of variation in the dielectric constant for the specified models. Loss Tangent (Typical): Test Conditions: Measured at 10GHz and 20GHz F4BTM298: 0.0018 F4BTM300: 0.0018 F4BTM320: 0.0020 F4BTM350: 0.0025 The loss tangent refers to the amount of energy dissipated as heat when an electrical signal passes through the material. Dielectric Constant Temperature Coefficient: Test Conditions: Temperature range of -55 oC to 150oC Unit: Parts per million per degree Celsius (PPM/℃) F4BTM298: -78 F4BTM300: -75 F4BTM320: -75 F4BTM350: -60 This parameter indicates the change in dielectric constant with respect to temperature. Peel Strength: Test Conditions: Measured with 1 oz F4BTM and 1 oz F4BTME Unit: Newtons per millimeter (N/mm) F4BTM298: >1.6 F4BTM300: >1.6 F4BTM320: >1.6 F4BTM350: >1.6 Peel strength measures the bonding strength between layers of the material. Volume Resistivity: Test Conditions: Standard conditions Unit: Megaohm centimeters (MΩ.cm) F4BTM298: ≥1×10^7 F4BTM300: ≥1×10^7 F4BTM320: ≥1×10^7 F4BTM350: ≥1×10^7 Volume resistivity indicates the material's resistance to the flow of electrical current through its volume. Surface Resistivity: Test Conditions: Standard conditions Unit: Megaohms (MΩ) F4BTM298: ≥1×10^6 F4BTM300: ≥1×10^6 F4BTM320: ≥1×10^6 F4BTM350: ≥1×10^6 Surface resistivity represents the material's resistance to the flow of electrical current across its surface. Electrical Strength (Z direction): Test Conditions: 5KW, 500V/s Unit: Kilovolts per millimeter (KV/mm) F4BTM298: >26 F4BTM300: >30 F4BTM320: >32 F4BTM350: >32 Electrical strength measures the ability of the material to withstand high voltage without electrical breakdown. Breakdown Voltage (XY direction): Test Conditions: 5KW, 500V/s Unit: Kilovolts (KV) F4BTM298: >34 F4BTM300: >35 F4BTM320: >40 F4BTM350: >40 Breakdown voltage represents the voltage at which the material experiences electrical breakdown in the XY direction. Coefficient of Thermal Expansion: Test Conditions: Temperature range of -55 oC to 288oC Unit: Parts per million per degree Celsius (ppm/oC) XY direction: F4BTM298: 15,16 F4BTM300: 15,16 F4BTM320: 13,15 F4BTM350: 10,12 Z direction: F4BTM298: 78 F4BTM300: 72 F4BTM320: 58 F4BTM350: 51 The coefficient of thermal expansion indicates the material's dimensional change with respect to temperature. Thermal Stress: Test Conditions: 260℃, 10s, 3 times Result: No delamination This parameter assesses the material's ability to withstand thermal stress without experiencing delamination or separation. Water Absorption: Test Conditions: 20±2℃, 24 hours Unit: Percentage (%) F4BTM298: ≤0.05 F4BTM300: ≤0.05 F4BTM320: ≤0.05 F4BTM350: ≤0.05 Water absorption represents the amount of water the material can absorb under specified conditions. Density: Test Conditions: Room temperature Unit: Grams per cubic centimeter (g/cm3) F4BTM298: 2.25 F4BTM300: 2.25 F4BTM320: 2.20 F4BTM350: 2.20 Density indicates the mass of the material per unit volume. Long-Term Operating Temperature: Test Conditions: High-Low Temperature Chamber Unit: Celsius (℃) Temperature Range: -55 to +260 This parameter specifies the temperature range within which the material can operate over an extended period of time. Thermal Conductivity (Z direction): Test Conditions: Measured in watts per meter-kelvin (W/(M.K)) F4BTM298: 0.42 F4BTM300: 0.42 F4BTM320: 0.50 F4BTM350: 0.54 Thermal conductivity measures the material's ability to conduct heat in the Z direction. PIM (Only applicable to F4BTME): Unit: Decibels relative to carrier (dBc) F4BTME: ≤-160 PIM, or Passive Intermodulation, refers to the generation of unwanted signals caused by nonlinearities in the material when exposed to high-frequency signals. Flammability: Unit: UL-94 rating F4BTM298: V-0 F4BTM300: V-0 F4BTM320: V-0 F4BTM350: V-0 Flammability rating indicates the material's resistance to ignition and flame spread according to the UL-94 standard. Material Composition: This section provides information about the components used in the F4BTM material, including PTFE (Polytetrafluoroethylene), Fiberglass Cloth, nano-ceramics, and the specific pairing of F4BTM with either ED copper foil or reverse-treated (RTF) copper foil for F4BTME. Product Technical Parameters Product Models & Data Sheet Product Features Test Conditions Unit F4BTM298 F4BTM300 F4BTM320 F4BTM350 Dielectric Constant (Typical) 10GHz / 2.98 3.0 3.2 3.5 Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07 Loss Tangent (Typical) 10GHz / 0.0018 0.0018 0.0020 0.0025 20GHz / 0.0023 0.0023 0.0026 0.0035 Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78 -75 -75 -60 Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6 1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4 Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7 Surface Resistivity Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 Electrical Strength (Z direction) 5KW，500V/s KV/mm >26 >30 >32 >32 Breakdown Voltage (XY direction) 5KW，500V/s KV >34 >35 >40 >40 Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 15，16 15，16 13，15 10，12 Z direction -55 º~288ºC ppm/ºC 78 72 58 51 Thermal Stress 260℃, 10s，3 times No delamination No delamination No delamination No delamination Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05 Density Room Temperature g/cm3 2.25 2.25 2.20 2.20 Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260 Thermal Conductivity Z direction W/(M.K) 0.42 0.42 0.50 0.54 PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160 Flammability / UL-94 V-0 V-0 V-0 V-0 Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics F4BTM Laminate and Applications The screen displays a F4BTM300 PCB substrate . F4BTM300 high frequency circuit materials are utilized in various applications, including Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, Beidou, Missile-borne, Power Amplifier, and Radio Frequency. Final （F4BTM series aluminum-based/copper-based substrates） F4BTM series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side of the dielectric layer is covered with either aluminum-based or copper-based material. This arrangement serves the purpose of shielding or heat dissipation. For examples, F4BTM300-AL represents F4BTM300 with aluminum-based substrate.
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. .jpg)
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