F4BTD350S PCB Raw Materials Product Introduction Wangling F4BTD series is a new generation of high thermal conductivity PTFE resin high-frequency substrates, reinforced with glass fiber cloth and loaded with high thermally conductive specialty ceramics. Designed for applications requiring low insertion loss and high heat dissipation efficiency, the F4BTD series serves as a direct replacement for similar foreign products. The F4BTD series laminate includes three models: F4BTD350, F4BTD350S, and F4BTD615, with typical dielectric constant, loss, and thermal conductivity values of: F4BTD350: 3.5 / 0.002 / 0.72 W/(M·K) F4BTD350S: 3.5 / 0.0016 / 1.25 W/(M·K) F4BTD615: 6.15 / 0.002 / 1.1 W/(M·K) Among them, F4BTD350S RF PCB material stands out with the lowest loss (0.0016) and highest thermal conductivity (1.25 W/(M·K)) in the series, making it the optimal choice for power-sensitive and heat-intensive RF applications. All models in the F4BTD series microwave Material offer excellent low-loss and high thermal conductivity performance, which increases microwave power tolerance, extends device service life, and supports reliable long-term high-temperature operation. These features ensure equipment reliability and enable low-cost maintenance. Additionally, the F4BTD series provides low coefficient of thermal expansion (CTE), dimensional stability, high electrical strength, and high insulation performance. These advantages translate into easier PCB processing, higher through-hole reliability, fewer soldering defects, better component matching, and stronger environmental adaptability. F4BTD350S high-frequency laminate, like other F4BTD series products, can be processed using standard PTFE sheet fabrication techniques. The excellent mechanical and physical properties of the F4BTD series laminate make it suitable for multilayer, high-multilayer, and backplane processing, as well as dense hole and fine line circuitry. F4BTD Series Product Features High thermal conductivity – F4BTD350S achieves 1.25 W/(M·K) Low loss – F4BTD350S achieves ultra-low 0.0016 High power tolerance High reliability Stable dielectric constant over temperature Low CTE and dimensional stability Radiation resistance Low outgassing Low water absorption Typical Applications High-power radio frequency (RF) systems Power amplifiers Antennas Industrial heating equipment Couplers, filters, power splitters A Piece of F4BTD350S Laminate Here is a RF-35TC laminate. F4BTD350S Datasheet Product technical parameters Test condition Unit F4BTD350S Dielectric constant (typical value) @ 2GHz 2GHz / 3.52 Dielectric constant (typical value) @ 10GHz 10GHz / 3.50 Dielectric constant tolerance / / ±0.07 Dielectric constant (design value) @ 10GHz 10GHz / 3.62 Loss factor (typical value) @ 2GHz 2GHz / 0.0012 Loss factor (typical value) @ 10GHz 10GHz / 0.0016 Dielectric constant temperature coefficient -55℃ ~ 150℃ PPM/℃ -45 Peel strength 10Z copper foil N/mm >0.8 Volume resistivity C96/23/95 MΩ·cm 1×10¹¹ Surface resistance C96/23/95 MΩ 1×10¹² Electric strength (Z direction) 5KW, 500V/s KV/mm 25 Breakdown voltage (horizontal direction) 5KW, 500V/s KV 38 Relative tracking index CTI 23℃/50%RH/24H V 600 Coefficient of thermal expansion (X,Y direction) -55℃ ~ 288℃ ppm/℃ 11, 10 Coefficient of thermal expansion (Z direction) -55℃ ~ 288℃ ppm/℃ 40 Thermal decomposition temperature Td (5% mass loss) 5% mass loss ℃ 500 Flexural strength (X,Y direction) Normal state MPa 74, 64 Tensile strength (X,Y direction) Normal state MPa 48, 45 Flexural modulus (X,Y direction) Normal state MPa 7500, 7000 Dimensional stability (X,Y direction) After etching and baking % 0.08, 0.18 Thermal stress 260℃/10s / 3 cycles / No delamination Thermal conductivity (Z direction) Z direction W/(m·K) 1.25 Specific heat capacity / J/(g·℃) 0.8 Density Normal temperature g/cm³ 2.21 Long-term service temperature High and low temperature chamber ℃ -55～+260 Water absorption 20±2℃, 24 hours % 0.05 Flame retardancy / UL-94 V-0 Dielectric layer composition / / PTFE, glass fiber cloth, high thermal conductivity special ceramics Summary The F4BTD series of high thermal conductivity PTFE substrates delivers a unique combination of low loss, high heat dissipation, and stable electrical performance. Within the series, F4BTD350S laminate offers the best balance of ultra-low loss (0.0016) and high thermal conductivity (1.25 W/(M·K)), making it the ideal choice for demanding high-power RF and microwave applications. As a drop-in replacement for comparable foreign materials, the F4BTD series – and especially the F4BTD350S Substrate– provides engineers with a reliable, cost-effective solution for power amplifiers, antennas, couplers, filters, industrial heating systems, and beyond. 
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