TP960 Fiberglass-Free PPO Ceramic PCB 2-Layer 1mm TP960 High Frequency with EPIG for Miniaturized Antenna & Satellite Navigation

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

1.Introduction

TP960 high frequency PCB is a double-sided rigid  printed circuit board fabricated on fiberglass-free PPO ceramic thermoplastic TP960 copper clad laminate. TP series substrate is a special thermoplastic high-frequency material composed of ceramic filler and polyphenylene oxide (PPO) resin without fiberglass reinforcement. The dielectric constant of TP laminate can be precisely customized by adjusting the mixing ratio of ceramic powder and PPO resin. TP960 laminate PCB delivers low dielectric loss and reliable electrical performance for compact RF circuits, and serves as a cost-effective alternative to ceramic substrates for miniaturized antenna designs.

2.Features

• Dielectric constant (Dk) of 9.6±0.19 at 10GHz
• Dissipation factor of 0.0012 at 10GHz
• Low TCDK at -40 ppm/°C, ranging from -55°C to 150°C
• CTE x-axis of 40 ppm/°C, CTE y-axis of 40 ppm/°C, CTE z-axis of 55 ppm/°C, -55°C to 150°C
• Thermal conductivity of 0.65 W/mk
• Moisture absorption of 0.01%
• UL 94-V0 flame retardant rating

3.Benefits

• Fiberglass-free structure eliminates weave effect for consistent RF signal transmission
• Wide customizable dielectric constant range from Dk 3 to 25 for miniaturized circuit design
• Excellent machinability, supports drilling, milling and grinding, easier processing than pure ceramic substrates
• Strong copper foil adhesion compared with vacuum-coated ceramic substrates
• Radiation resistance and low outgassing performance for harsh working environments
• Lower manufacturing cost than ceramic dielectric substrates for antenna and navigation applications

4.PCB Construction details

5.PCB Stackup: 2-layer rigid PCB

• Copper_layer_1 - 35 μm
• TP960 Core - 1 mm (39.37mil)
• Copper_layer_2 - 35 μm

6.PCB Statistics

• Components: 89
• Total Pads: 103
• Thru Hole Pads: 64
• Top SMT Pads: 39
• Bottom SMT Pads: 0
• Vias: 48
• Nets: 2

7.Type of artwork supplied: Gerber RS-274-X

8.Quality standard: IPC-Class-2

9.Availability: Worldwide

10.Some Typical Applications

• Global Satellite Navigation System
• Missile-borne electronic systems
• Fuze technology equipment
• Miniaturized antenna hardware

11.TP & TP960 Microwave Composite Dielectric Copper Clad Laminate Knowledge

TP series is a unique fiberglass-free thermoplastic high-frequency CCL. Its dielectric layer is formulated with ceramic powder and PPO resin, and the dielectric constant can be precisely tuned by adjusting ceramic and PPO proportions. TP stands for base material without copper cladding; TP-1 is single-sided copper clad laminate, TP-2 is double-sided copper clad laminate.

11.1 Core Electrical & Material Features

• Customizable Dk range from 3 to 25 with stable dielectric performance; common grades include TP300, TP440, TP600, TP615, TP920, TP960, TP980
• Low dielectric loss; loss rises slightly with frequency and remains stable below 10GHz
• Long-term operating temperature range: -100°C ~ +150°C; material deformation and copper peel risk above 180°C
• Radiation resistant and low outgassing properties
• Ultra-low moisture absorption, stable electrical parameters under variable humidity

11.2 Processing & Structural Advantages

• Excellent machinability, supports drilling, turning, grinding, shearing and milling, much easier to process than ceramic substrates
• Superior copper-dielectric adhesion compared with vacuum coated ceramic substrates
• Minimum available thickness of 0.5mm, multiple thickness options for custom requirements
• Thermoplastic processing, high fabrication yield and lower cost than ceramic substrates
• Multilayer stacking is not generally recommended; if required, low-temperature bonding sheets must be used and feasibility fully verified

11.3 Soldering Limitations & Application Notes

• Not suitable for 260°C thermal shock test or wave soldering
• Hand soldering with constant-temperature iron is recommended
• Reflow soldering is not advised; if necessary, peak temperature should stay below 200°C with full pre-production evaluation

1. 12.Application

TP960 high frequency PCB is widely deployed in satellite navigation, missile-borne electronics, fuze systems and compact miniaturized antenna modules. The fiberglass-free PPO ceramic composite structure makes TP960 PCB ideal for RF systems that demand stable dielectric performance, small form factor and low outgassing capability.

13.Product Summary

TP960 2-Layer PCB is a rigid printed circuit board built on 39.37mil TP960 fiberglass-free PPO ceramic thermoplastic copper clad laminate. TP960 rigid PCB uses EPIG surface finish, no solder mask and no silkscreen on both sides. This TP960 PCB undergoes 100% electrical testing before shipment. Thanks to fiberglass-free PPO ceramic composite structure, TP960 PCB is widely used for global satellite navigation, missile-borne systems, fuze devices and miniaturized antenna applications.

14.TP960 DataSheet