Rogers RO3203 4-Layer 0.6mm RF PCB for High-Frequency Wireless Communications

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

Product Overview

This product is a high-frequency, 4-layer rigid PCB constructed on Rogers RO3203 laminate, designed for demanding RF and microwave applications. With a compact form factor of 49.6mm x 25.2mm per unit and a slim profile of 0.6mm, this board is engineered for optimal electrical performance in the high-frequency spectrum, exceeding 20 GHz. It features a sophisticated build with blind vias (L1-L2) and adheres to IPC-Class-2 standards, ensuring high reliability for complex wireless systems. The absence of solder mask and silkscreen, combined with an Immersion Silver surface finish, is tailored for superior RF performance and consistent signal integrity.

PCB Construction Details

The following table summarizes the key physical and electrical specifications of this 4-layer RF PCB.

Additional Components & Features

This PCB supports a compact design with 10 components, 20 total pads (10 thru-hole and 10 top-side SMT), and 15 vias interconnected across 4 nets. The board is supplied with Gerber RS-274-X artwork data and is accepted worldwide.

Material Advantages of RO3203

The core of this PCB's performance lies in the Rogers RO3203 material, a ceramic-filled PTFE composite with woven glass reinforcement. It offers a stable dielectric constant (3.02 ± 0.04) and an extremely low dissipation factor (0.0016), which minimizes signal loss at high frequencies. Key benefits include:

Excellent Dimensional Stability: Ensures high production yields and is ideal for complex multi-layer structures.

Low In-Plane CTE: Matched to copper, making it reliable for surface-mounted assemblies and hybrid designs with epoxy multilayers.

Mechanical Rigidity: The woven glass reinforcement improves handling without compromising electrical performance.

Cost-Effectiveness: Provides high-frequency performance at an economical price point for volume manufacturing.

Typical Applications

This PCB is ideally suited for a wide range of high-frequency applications, including:

Automotive radar and collision avoidance systems

Global Positioning Satellite (GPS) antennas

Wireless telecommunications infrastructure and base stations

Microstrip patch antennas

Direct broadcast satellites and wireless broadband (LMDS)

Why Choose This PCB?

This board offers a reliable, performance-driven solution for high-frequency designs, combining the proven electrical properties of Rogers RO3203 material with precise, controlled impedance fabrication techniques. Its specification is tailored to meet the mechanical and electrical demands of next-generation wireless communication systems.

Order Now for High-Frequency Applications!

Leverage this robust 4-layer RF PCB to enhance the performance and reliability of your wireless products. Contact us today to discuss your project requirements and initiate the ordering process.