TMM10 1-Layer 60mil Thermoset PCB Rogers Microwave Material with OSP for GPS Antennas and Patch Antennas

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

1. Introduction of Rogers TMM10 PCB

Rogers TMM10 PCB is a high-performance thermoset microwave rigid printed circuit board engineered for high-precision stripline, microstrip, and high-reliability microwave circuit applications. As a core member of the Rogers TMM thermoset material family, TMM10 substrate adopts an advanced ceramic-hydrocarbon thermoset polymer composite structure, integrating the ultra-stable electrical performance of ceramic substrates and the superior process flexibility of traditional PTFE microwave laminates. This Rogers 1-Layer high-frequency PCB eliminates the complex specialized pretreatment procedures required by conventional high-frequency materials, enabling streamlined standard PCB manufacturing and consistent circuit performance.

Featuring a high, stable dielectric constant, ultra-low high-frequency loss, exceptional thermal stability and copper-matched thermal expansion properties,  Rogers TMM10 high-frequency material delivers reliable dimensional accuracy and durable plated-through-hole performance under continuous thermal cycling. Manufactured in strict accordance with IPC-Class-2 quality standards and 100% electrically inspected prior to shipment, this thermoset microwave PCB sustains stable, repeatable high-frequency performance for mission-critical microwave devices, radar systems, satellite communication modules and high-power RF components across global markets.

2. Key Features of Rogers TMM10 PCB

1. Fabricated with genuine Rogers TMM10 ceramic hydrocarbon thermoset polymer composite dielectric substrate for premium high-frequency stability
2. Features a high and consistent dielectric constant, supporting compact miniaturization and high-density microwave circuit design
3. Maintains ultra-low dissipation factor across broadband microwave bands, minimizing signal attenuation and transmission loss
4. Delivers extremely low thermal coefficient of dielectric constant, effectively suppressing electrical parameter drift under temperature fluctuation
5. Adopts isotropic thermal expansion coefficients precisely matched to copper foil, ensuring excellent structural and dimensional consistency
6. Offers high decomposition temperature, providing outstanding thermal resistance for long-term high-power operation
7. Equipped with enhanced thermal conductivity to accelerate heat dissipation for high-power RF and microwave circuit modules
8. Possesses superior mechanical rigidity to resist creep deformation and cold flow under prolonged operational stress
9. Provides excellent chemical inertness against standard PCB etching solutions and processing solvents for full-process structural protection
10. Features a stable thermoset resin framework that avoids substrate softening, enabling precise and reliable industrial wire bonding processes

3. Product Benefits

1. Superior Long-Term Mechanical Durability: Rogers TMM10 thermoset composite material exhibits excellent anti-creep and anti-cold-flow characteristics, maintaining precise dimensional stability during long-term high-frequency operation and repeated thermal cycling.
2. Full Standard Process Compatibility: Eliminates complicated sodium napthanate pretreatment and exclusive PTFE processing workflows, fully adapting to conventional PCB manufacturing procedures to improve production yield and reduce overall fabrication costs.
3. Excellent Chemical Resistance: Resists corrosion and structural damage from various industrial fabrication chemicals, effectively protecting substrate integrity throughout etching, plating and component assembly stages.
4. Stable Wire Bonding Performance: Differing from thermoplastic high-frequency materials, TMM10 retains rigid structural stability under heating, preventing pad lifting, trace deformation and bonding failure during precision wire bonding operations.
5. Enhanced PTH Thermal Reliability: Copper-matched isotropic CTE values greatly reduce thermal expansion mismatch between substrate and copper, significantly improving the long-term reliability of plated through holes in extreme temperature environments.
6. Consistent Broadband Electrical Stability: Low TCDK and uniform dielectric properties ensure precise impedance control and stable phase performance for diversified broadband microwave circuit designs.
7. Efficient High-Power Heat Dissipation: Advanced thermal conductivity rapidly dissipates concentrated heat generated by high-power amplifiers and active microwave components, avoiding thermal performance degradation.
8. Flexible Structural Design Adaptability: Supports multiple copper foil weights and metal substrate lamination, meeting customized requirements for high-density and high-power microwave circuit applications.

4. PCB Construction Details

5. PCB Stackup

This 1-Layer rigid Rogers TMM10 PCB adopts a simplified single-sided industrial stackup with a standardized 60mil thick TMM10 dielectric core and uniform copper distribution, delivering balanced electrical stability, thermal efficiency and mechanical rigidity for professional high-frequency microwave applications:

1. Single-Sided Copper Layer: 35μm Finished Outer Copper
2. Rogers TMM10 Core Dielectric: 60mil Standard Thickness

6. PCB Statistics

1. Customized Component Count
2. Customized Pad & SMT Layout
3. Customized Via and Net Distribution

7. Artwork & Production Standard

1. Supplied Artwork Type: Gerber RS-274-X
2. Manufacturing Compliance Standard: IPC-Class-2
3. Product Supply Scope: Worldwide Availability

8. Typical PCB Applications

-chip testers

-dielectric polarizers

-satellite communication systems

-GPS antennas, and patch antennas etc

9. Rogers TMM10 Copper Clad Laminate Introduction

Rogers TMM10 is a premium ceramic hydrocarbon thermoset polymer composite copper clad laminate within the professional Rogers TMM thermoset microwave material series. Developed to bridge the performance gap between rigid ceramic substrates and flexible PTFE laminates, TMM10 integrates ceramic-grade electrical stability and conventional microwave substrate processability without requiring complex specialized fabrication techniques. It serves as an ideal drop-in replacement for high-cost alumina ceramic substrates, delivering superior manufacturability and cost efficiency for mass production of high-frequency PCBs.

Unlike traditional PTFE-based high-frequency substrates, TMM10 thermoset laminates require no sodium napthanate pretreatment before electroless plating, simplifying metallization workflows and improving production consistency. The material features an ultra-low thermal coefficient of dielectric constant, sustaining stable Dk and DF parameters across wide temperature ranges. Its copper-synchronized isotropic thermal expansion minimizes etching shrinkage and thermal stress deformation, ensuring exceptional long-term reliability of plated-through-hole structures during temperature cycling.

With industry-leading thermal conductivity, TMM10 efficiently dissipates heat from high-power RF devices and prevents thermal-induced performance attenuation. As a pure thermoset resin-based material, it maintains structural rigidity under continuous high-temperature conditions, enabling accurate, damage-free wire bonding without pad lifting or substrate warpage. Boasting excellent resistance to PCB process etchants and organic solvents, TMM10 CL retains complete structural integrity throughout multi-stage fabrication. It supports diversified copper foil specifications and direct metal plate bonding, providing flexible, customizable solutions for miniaturized, high-power and multi-layer microwave circuit designs.

9.1 Core Features of TMM10 CCL

- Premium ceramic-hydrocarbon thermoset composite structure, combining ceramic-level electrical stability and PTFE-like easy processing performance

- Optimized high dielectric constant to support microwave circuit miniaturization and high-density layout design

- Ultra-low dissipation factor for minimal signal transmission loss in high-frequency microwave bands

- Extremely low TCDK value guarantees stable electrical parameters under variable temperature environments

- Copper-matched isotropic CTE ensures superior dimensional stability and reliable plated-through-hole performance

- High thermal decomposition temperature delivers excellent heat resistance for harsh working conditions

- Enhanced thermal conductivity optimizes heat dissipation efficiency for high-power RF module operation

- Excellent mechanical stability effectively resists creep deformation and cold flow under long-term stress

- Superior chemical inertness protects substrate integrity during PCB fabrication and component assembly

- Rigid thermoset structure enables stable, high-precision industrial wire bonding applications

9.2 Processing & Structural Advantages of TMM10 CCL

- Eliminates sodium napthanate pretreatment requirement, simplifying electroless plating processes and improving production efficiency

- Fully compatible with all standard PWB manufacturing workflows with no specialized tooling or procedures needed

- Versatile copper cladding options including 1/2oz, 1oz and 2oz electrodeposited copper foil for diverse current load demands

- Supports direct lamination with aluminum and brass substrates to produce high-strength, high-heat-dissipation metal-backed PCBs

- Ultra-low etching shrinkage ensures high dimensional precision for fine-line high-frequency microwave circuits

- Cost-effective alternative to traditional alumina ceramic substrates with higher fabrication yield and lower material costs

9.3 Main CCL Application Scenarios

- Professional Satellite Communication Systems

- GPS Antennas, Patch Antennas and Related Antenna Devices

- High-Precision Dielectric Polarizers and Microwave Optical Components

- Semiconductor Chip Testing and Precision Measurement Equipment

10. Product Overall Summary

Rogers TMM10 1-Layer 60mil high frequency PCB stands out as a versatile, cost-efficient, and high-stability thermoset microwave circuit solution for modern RF and microwave industries. Combining the unique advantages of ceramic dielectric stability and conventional PCB processability, Rogers TMM10 single-layer PCB features ultra-low signal loss, copper-matched thermal expansion, excellent heat dissipation, and outstanding mechanical and chemical durability. It fully supports standard PCB fabrication and precision wire bonding, effectively replacing expensive alumina substrates while maintaining reliable electrical performance across fluctuating temperatures and harsh operating environments. Ideal for radar systems, satellite communication, power amplifiers, microwave filters and precision testing equipment, TMM10 IPC-Class-2 compliant PCB delivers consistent, long-term high-frequency performance for global commercial, industrial, and military high-power RF applications.

11.Datasheet