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TU-872 SLK Sp FR-4 Radio Frequency PCB Low Dk and Df High Thermal Reliability Printed Circuit Board
TU-872 SLK Sp FR-4 Radio Frequency PCB Low Dk and Df High Thermal Reliability Printed Circuit Board
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Brief Introduction
TU-872 SLK Sp is a high-performance PCB laminate built on a modified epoxy FR-4 resin system. TU-872 PCB features reinforcement with advanced woven glass fibers and is engineered to deliver an extremely low dielectric constant and low dissipation factor, making it ideal for high-speed, low-loss, and high-frequency circuit board applications.
TU-872 material is fully compatible with environmentally friendly lead-free manufacturing processes while maintaining compatibility with standard FR-4 production workflows. TU-872 SLK Sp laminates offer a range of enhanced properties, including excellent coefficient of thermal expansion (CTE), superior resistance to chemicals and moisture, robust thermal stability, and strong resistance to conductive anodic filament (CAF) formation. Additionally, the inclusion of an allyl network-forming compound significantly improves the material's toughness.
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Key Features
1. Excellent electrical properties
2. Dielectric constant less than 3.5
3. Dissipation factor less than 0.010
4. Excellent, stable and flat Dk/Df performance
5. Compatible with most FR-4 processes
6. Lead free process compatible
7. Improved z-axis thermal expansion
8. Anti-CAF capability
9. Superior dimensional stability, thickness uniformity and flatness
10. Excellent through-hole and soldering reliability
Our PCB Capabilities (TU-872 SLK Sp)
| Our PCB Capability (TU-872 SLK Sp) | |
| PCB Material: | High performance modified epoxy FR-4 resin |
| Designation: | TU-872 SLK Sp |
| Dielectric constant: | < 3.5 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver, ENEIPIG, Pure gold etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Main Applications
1. Radio Frequency
2. Backpanel, High performance computing
3. Line cards, Storage
4. Servers, Telecom, Base station
5. Office Routers
Our Advantages
ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
16000㎡ workshop;
30000㎡ output capability per month;
Prototype to large volume production capability
IPC Class 2 / IPC Class 3;
Any layer HDI PCBs;
Delivery on time: >98%
Customer complaint rate: <1%
Typical Properties (TU-872 SLK Sp)
| Typical Properties for TU-872 SLK Sp Laminate | |||
| Typical Values | Conditioning | IPC-4101 /126 | |
| Thermal | |||
| Tg (DMA) | 220°C | ||
| Tg (DSC) | 200°C | > 170°C | |
| Tg (TMA) | 190°C | E-2/105 | |
| Td (TGA) | 340°C | > 340°C | |
| CTE x-axis | 12~15 ppm/°C | N/A | |
| CTE y-axis | 12~15 ppm/°C | E-2/105 | N/A |
| CTE z-axis | 2.30% | < 3.0% | |
| Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T260 | 60 min | > 30 min | |
| T288 | 20 min | E-2/105 | > 15 min |
| T300 | 5 min | > 2 min | |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| DK & DF | |||
| Permittivity (RC 50%) @10GHz | 3.5 | ||
| Loss Tangent (RC 50%) @10GHz | 0.008 | ||
| Electrical | |||
| Permittivity (RC50%) | |||
| 1GHz (SPC method/4291B) | 3.6/3.4 | < 5.2 | |
| 5GHz (SPC method) | 3.5 | E-2/105 | - |
| 10GHz (SPC method) | 3.5 | - | |
| Loss Tangent (RC50%) | |||
| 1GHz (SPC method/4291B) | 0.006/0.004 | ||
| 5GHz (SPC method) | 0.007 | E-2/105 | < 0.035 |
| 10GHz (SPC method) | 0.008 | ||
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | A | > 30 kV/mm |
| Dielectric Breakdown | > 50 kV | A | N/A |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 26 GPa | A | N/A |
| Fill Direction | 24 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz RTF Cu foil | 4~7 lb/in | A | > 4 lb/in |
| Water Absorption | 0.13% | E-1/105+D-24/23 | < 0.5 % |

