Home - Standard PCB - 6-Layer S1000-2M PCB HDI Printed Circuit Board 90 Ohm Impedance Control HASL Finish

6-Layer S1000-2M PCB HDI Printed Circuit Board 90 Ohm Impedance Control HASL Finish

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

General Description

This high-performance 6-layer HDI PCB is manufactured using FR-4 S1000-2M material, known for its high Tg and low CTE properties. The board features controlled differential impedance configurations including 90 ohm on layer 3 with 6mil/7mil and 6mil/10mil trace/gap specifications, and layer 4 with 7mil/7mil and 6mil/7mil parameters. Constructed with 1oz copper on all layers, the board features HASL surface finish and green solder mask for reliable performance.

 

S1000-2M HDI PCB incorporates advanced via structures with blind vias from top layer to inner layer 4 and buried vias between inner layers 3 and 4. Manufactured to IPC-Class 2 standards, each board undergoes rigorous quality control and is supplied with V-cut scoring for easy separation. Packages contain 25 boards per shipment, ensuring consistent quality for volume production requirements.

 

 

 

Applications

Computers

Communications

Automotive electronics etc.

 

PCB Parameters

PCB Electrical Properties Tables
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PCB Parameters
Item Description Requirement Actual Result Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05
1. Laminate Material Type FR-4 S1000-2M FR-4 S1000-2M ACC
Tg 170℃ 170℃ ACC Hole Code PTH Required Actual value Result
Supplier SHENGYI SHENGYI ACC 1 Y 0.375 0.375 0.400 0.400 0.375 ACC
Thickness 1.6±10% mm 1.63-1.68mm ACC 2 Y 0.500 0.500 0.550 0.525 0.525 ACC
2.Plating thickness Hole Wall ≥25µm 30.17µm ACC 3 Y 0.7*2.4 0.7*2.4 0.7*2.41 0.69*2.4 0.7*2.4 ACC
Outer copper 35µm 41.09µm ACC 4 Y 0.625 0.625 0.600 0.625 0.600 ACC
Inner Copper 30µm 33.69µm ACC 5 Y 0.725 0.725 0.725 0.750 0.725 ACC
3.Solder mask Material Type TAIYO/ PSR-2000GT600D TAIYO/ PSR-2000GT600D ACC 6 Y 0.900 0.925 0.900 0.900 0.900 ACC
Color Green Green ACC 7 Y 1.000 1.000 0.950 0.975 1.000 ACC
Rigidity (Pencil Test) ≥4H or above 5H ACC 8 N 1.050 1.050 1.050 1.075 1.050 ACC
S/M Thickness ≥10 µm 20.11µm ACC 9 Y 1.300 1.300 1.300 1.325 1.325 ACC
Location Both Sides Both Sides ACC 10 Y 1.350 1.350 1.325 1.350 1.325 ACC
4. Component Mark Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC 11 Y 1.575 1.575 1.600 1.600 1.575 ACC
Color White White ACC 12 Y 1.650 1.650 1.700 1.675 1.675 ACC
Location C/S C/S ACC 13 Y 1.700 1.700 1.750 1.725 1.725 ACC
5.Vias Through holes Yes L1-L6 ACC 14 Y 3.250 3.250 3.250 3.275 3.250 ACC
Blind vias Yes L1-L5 ACC 15 Y 3.450 3.450 3.400 3.425 3.450 ACC
Buried vias Yes L4-L5 ACC 16 Y 0.7*2.6 0.7*259 0.7*2.61 0.69*2.6 0.7*2.59 ACC
6. Identification UL Mark YES YES ACC
Date Code WWYY 0421 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method HASL Lead Free HASL Lead Free ACC
Tin Thickness 3-6µm 4.06µm ACC
Nickel Thickness
Gold Thickness Impedance Test Report
8. Normativeness RoHS Directive 2015/863/EU OK ACC Sample NO. Layer Line Width(mil)±10% Line Space (mil)±10% Impedance Type Required Value (ohm) Tolerance Actual Value Result
REACH Directive 1907 /2006 OK ACC Single End Differential
9.Annular Ring Min. Line Width (mil) 6mil 5.8mil ACC 1 L3 6.000 7.000 V 90.00 ±10% 93.59 ACC
Min. Spacing (mil) 5mil 5.2mil ACC L3 6.000 10.000 V 100.00 ±10% 102.33 ACC
10.V-groove Angle 30° 30° ACC L4 7.000 7.000 V 90.00 ±10% 88.99 ACC
Residual thickness 0.5mm 0.5mm ACC L4 6.000 7.000 V 90.00 ±10% 90.76 ACC
11. Beveling Angle
Height
12. Function Electrical Test 100% PASS 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.21% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5℃ OK ACC
Thermal Stress Test 288 ±5℃ OK ACC
Ionic Contamination Test ≦ 1.56 µg/c㎡ 0.56µg/c㎡ ACC