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Rogers RO4830 PCB With Low Profile Copper 5mil and 9.4mil High Frequency Thermoset Circuit Boards

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

General Description

Rogers RO4830 high frequency PCBs are constructed from advanced thermoset laminates, providing a reliable and cost-efficient solution for demanding RF and microwave applications. Rogers RO4830 PCBs serve as a high-performance alternative to traditional PTFE-based materials and are exceptionally suited for millimeter-wave devices where budget and performance must be balanced. A key application is in 76-81 GHz automotive radar sensors, where the RO4830 material is commonly utilized as the cap layer in hybrid FR-4 multi-layer board designs.

 

The dielectric constant of RO4830 laminates is engineered for stability, measuring 3.2 at 77 GHz, which is slightly higher than that of standard PTFE-woven glass laminates. A critical feature of RO4830 PCBs is the use of low-profile reverse-treated copper foil, which enables outstanding insertion loss performance of only 2.2 dB per inch at 77 GHz. The material's construction incorporates a flat woven e-glass reinforcement and a filler with a highly uniform, fine particle size, granting it superior laser drilling capabilities for precise fabrication. Furthermore, RO4830 PCBs include an advanced antioxidant package that delivers exceptional resistance to oxidation, outperforming other hydrocarbon-based circuit materials. These high-frequency boards comply with UL 94 V-0 flame retardant standards and are fully compatible with lead-free soldering processes.

 

Key Features:

  1. Dielectric constant of 3.24

2. Excellent insertion loss of 2.2 dB/in at 77 GHz

3. UL 94 V-0 flame retardant rating

4. Optimized filler, resin, and glass composite system

5. Reverse treated smooth low profile copper foil

 

 

Benefits:

  1. Remarkable resistance to oxidation
  2. Consistent within-sheet dielectric constant for reliable laser drilling performance
  3. Lower overall cost compared to PTFE laminate options, contributing to reduced PCB manufacturing expenses
  4. Ideal for automotive radar sensor PCB applications

Typical Applications:

76-81 GHz Automotive Radar Sensors

 

RO4830 Data Sheet

PCB Electrical Properties Tables
Click to expand/collapse the table
Property Typical Values [1]
RO4830(TM)
Units Condition Test Method
Dielectric Thickness
0.005” 0.0095”
Dielectric Constant, εr Design 3.24 3.24 - 77 GHz microstrip differential phase length
Transmission Line Loss 2.2 1.8 dB/in 77 GHz microstrip differential phase length
Dissipation Factor, tan δ 0.0033 0.0032 - 10 GHz split-post dielctric resonator
Thermal Coefficient of εr (z direction) -30 -30 ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Dielectric Strength 78.7 59.1 kV/mm 48 hrs @ 50°C IPC-TM-650, 2.5.6.2
2000 1500 V/mil
Water Absorption 0.15 0.13 0 D-48/50 ASTM D570
Peel Strength after Thermal Stress 0.67 0.67 N/mm 18 micron reverse
treated EDfoil
IPC-TM-650 2.4.8
3.8 3.8 lbs/in
Flammability Rating V-0 V-0 - C-48/23/50 UL94
Dimensional
Stability
MD -1.8
(-1.8)
-1.5 (-1.5) mm/m (mils/in) 4 hrs @ 105°C IPC-TM-650 2.4.39A
CMD -1.8
(-1.8)
-1.6 (-1.6)
Decomposition Temperature 408 412 °C - ASTM D3850
Time to Delamination (T288) >30 >30 minutes with Cu IPC-TM-650, 2.4.24.1
Lead-Free Process Capable YES YES - - -
Thermal Conductivity (calculated) 0.45 0.47 W/mK 50°C Through-plane calculation with series
mixing rule
CTE x,y 23 21 ppm/°C 0 to 150°C IPC-TM-650 2.4.41
z 110 83

 

Our PCB Capability (RO4830)

PCB Capability (RO4830)

PCB Material:

Hydrocarbon/ Ceramic/ Spread Woven Glass

Designation:

RO4830

Dielectric constant:

3.24

Dissipation factor

0.0033-0.0032

Layer count:

Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

Dielectric thickness

5mil (0.127mm), 9.4mil (0.239mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

 

About Bicheng

Established in 2003, Bicheng Electronics Technology Co., Ltd has become a reputable supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 20 years of experience, we have been serving various industries worldwide, including cellular base station antennas, satellites, high-frequency passive components, microstrip line and band line circuits, millimeter wave equipment, radar systems, digital radio frequency antennas, and more.

 

Our high-frequency PCBs primarily utilize three renowned material brands: Rogers Corporation, Taconic, and Wangling. These materials offer a wide range of dielectric constants, ranging from 2.2 to 10.2, ensuring versatility and suitability for different applications.

 

In addition to high-frequency PCBs, we also specialize in FR-4 circuit boards, flexible circuits, and metal core PCBs. Our capabilities cover everything from prototyping and small runs to large-scale production. Furthermore, we actively engage in research and development of high-value-added PCB projects, including HDI (high-density interconnect), quick turn, impedance control, heavy copper, and backplane boards. This diversification allows us to offer a comprehensive product line that caters to both low-end and high-end requirements.

 

Our PCBs find applications across a wide spectrum of industries, such as computer networking, safety and surveillance, power supply, telecommunications, automotive electronics, medical apparatus and instruments, national defense, and industrial equipment. We strive to meet the diverse needs of our customers and provide reliable PCB solutions for various purposes.